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1. 发明专利

JP2008161882A Electronic component, joint structure body, and electronic instrument 有权
标题翻译：电子元件，接头结构体和电子仪器
公开(公告)号：JP2008161882A
公开(公告)日：2008-07-17
申请号：JP2006351244
申请日：2006-12-27
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： FURUSAWA AKIO , SUETSUGU KENICHIRO , SAKAGUCHI SHIGEKI
IPC分类号： B23K35/26 , B23K1/00 , B23K101/36 , B23K101/42 , C22C12/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide electrical appliances and electronic instruments which are controlled by circuit boards composed of joint structure bodies, in which internal joints of electronic components do not melt until 270°C by the heat in soldering the electronic components on the circuit boards, and further shock resistance is excellent. SOLUTION: A joining material 46 contains Bi as its main component, and contains 0.2 to 0.8 wt.% of Cu and 0.02 to 0.2 wt.% of Ge as additives. By this composition, the joining material 46 does not melt below 270°C. Therefore, the joining portions in the electronic components do not melt by the heat in soldering electronic components 45A, 45B on the circuit board 44, and do not produce defective products. Further, inexpensive lead-free products can be obtained because the joining material 46 does not contain Ag. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供由电路板组成的电路板控制的电器和电子仪器，其中电子部件的内部接头在电子部件的焊接中通过热量熔化直到270℃ 电路板，抗冲击性更好。
解决方案：接合材料46包含Bi作为其主要成分，并且包含0.2至0.8重量％的Cu和0.02至0.2重量％的Ge作为添加剂。通过该组合物，接合材料46在270℃以下不熔融。因此，电子部件中的接合部分不会在电路板44上的焊接电子部件45A，45B中由于热而熔化，并且不会产生缺陷产物。此外，由于接合材料46不含有Ag，因此可以获得便宜的无铅产品。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2007313526A Joining material, electronic component, and joined structure body 有权
标题翻译：接合材料，电子元件和接合结构体
公开(公告)号：JP2007313526A
公开(公告)日：2007-12-06
申请号：JP2006144031
申请日：2006-05-24
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： FURUSAWA AKIO , SUETSUGU KENICHIRO
IPC分类号： B23K35/26 , B23K1/00 , B23K101/42 , C22C12/00 , H05K3/34
CPC分类号： Y02P70/613
摘要： PROBLEM TO BE SOLVED: To provide a joining material at a low cost, which joining material has a melting point of 270°C or higher and does not contain lead.
SOLUTION: Elements of electronic components and electrodes are joined using the joining material which comprises an alloy containing Bi as a main component, wherein the alloy comprises 0.2 to 0.8 wt.% of Cu, and 0.02 to 0.2 wt.% of Ge.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供低成本的接合材料，该接合材料的熔点为270℃以上且不含铅。解决方案：使用包含含有Bi作为主要成分的合金的接合材料将电子部件和电极的元件接合，其中该合金包含0.2-0.8重量％的Cu和0.02-0.2重量％的Ge 。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2005288529A Solder material and soldered article 有权
标题翻译：焊接材料和焊接品
公开(公告)号：JP2005288529A
公开(公告)日：2005-10-20
申请号：JP2004110860
申请日：2004-04-05
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： FURUSAWA AKIO , IGARI TAKASHI , SUETSUGU KENICHIRO , TAKANO HIROAKI
IPC分类号： B23K35/26 , C22C12/00
摘要： PROBLEM TO BE SOLVED: To provide a leadless high-temperature solder material which is high in the reliability of joining strength and enables soldering in a high-temperature region of 250 to 350°C.
SOLUTION: The solder material of a melting point 250 to 300°C is composed of an alloy of a composition existing within a region enclosed by straight lines connecting points A (5.5wt% Ag, 29.5wt% Sn, 65wt% Bi), B (3.0wt% Ag, 7.0wt% Sn, 90wt% Bi), C (2.0wt% Ag, 8.0wt% Sn, 90wt% Bi), and D (3.0wt% Ag, 32wt% Sn, 65wt% Bi) in a ternary composition diagram of Ag, Sn and Bi and the solder material of the melting point 300 to 350°C is composed of the alloy of the composition existing within the region enclosed by the straight lines connecting the points A, B, E(5.5wt% Ag, 4.5wt% Sn, 90wt% Bi) and F(12wt% Ag, 23wt% Sn, 65wt% Bi).
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种在250-350℃的高温区域具有高的接合强度可靠性并能够焊接的无引线高温焊料。解决方案：熔点为250至300℃的焊料材料由存在于连接点A（5.5重量％Ag，29.5重量％Sn，65重量％Bi ），B（3.0重量％Ag，7.0重量％Sn，90重量％Bi），C（2.0重量％Ag，8.0重量％Sn，90重量％Bi）和D（3.0重量％Ag，32重量％Sn，65重量％ Bi）在Ag，Sn和Bi的三元组成图中，并且熔点为300至350℃的焊料材料由存在于由连接点A，B，B的直线包围的区域内的组成的合金组成， E（5.5wt％Ag，4.5wt％Sn，90wt％Bi）和F（12wt％Ag，23wt％Sn，65wt％Bi）。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2000126890A SOLDERING MATERIAL 失效
公开(公告)号：JP2000126890A
公开(公告)日：2000-05-09
申请号：JP31713999
申请日：1999-11-08
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YAMAGUCHI ATSUSHI , SUETSUGU KENICHIRO , FUKUSHIMA TETSUO , FURUSAWA AKIO
IPC分类号： B23K35/26 , C22C13/00 , C22C13/02 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a lead-free material which is capable of dropping its melting point to the temperature at which electronic parts can be assembled, and excellent in mechanical strength and wettability by adding Ag, Bi and Cu in a specified range with Sn as the basic composition. SOLUTION: A Sn-Ag-Bi-Cu soldering material contains Sn which is a basic composition, 0.1-20 wt.% Ag, 0.1-25% Bi and 0.1-3.0 wt.% Cu. Further, 0.1-20 wt.% In can be added to the above composition. Alternatively, the soldering material is an alloy containing Sn and Sb, which are basic compositions, and 0.1-20 wt.% Sb. The alloy contains at least one kind of 0.1-30 wt.% Bi and 0.1-20 wt.% In, and at need, at least one kind of 0.1-3.0 wt.% Cu and 0.1-15 wt.% Zn, and the balance Sn.

5. 发明专利

JPH11186333A SOLDER BUMP FORMATION 失效
公开(公告)号：JPH11186333A
公开(公告)日：1999-07-09
申请号：JP35495097
申请日：1997-12-24
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YOSHIDA KOICHI , FURUSAWA AKIO , HIRANO MASATO , MIYAGAWA HIDEKI , KITAYAMA YOSHIFUMI
IPC分类号： H01L21/60 , H05K3/12 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To form solder bumps in uniform size, while avoiding dispersion of bridges and solder amount in solder bumps on a substrate. SOLUTION: A resin film 10 which excludes a land 5, whereon a solder bump 6 is formed in formed. Nest, a space on the land 5 of a substrate 4 is filled with a creamy solder 1 using a squeegee 3. Then, the creamy solder 1 is melted dow by reflow to form the solder bump 6 on the land 5. Finally, the resin film 10 is released from the substrate 4 to remove unnecessary solder 11, excluding those on the land 5.

6. 发明专利

JPH1140936A METHOD OF FORMING SOLDER BUMP 失效
公开(公告)号：JPH1140936A
公开(公告)日：1999-02-12
申请号：JP19294997
申请日：1997-07-18
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YOSHIDA KOICHI , SUETSUGU KENICHIRO , FURUSAWA AKIO , YAMAGUCHI ATSUSHI
IPC分类号： H05K3/34 , H01L21/60 , H05K3/12
摘要： PROBLEM TO BE SOLVED: To prevent solder bridges or solder amt. variation by repeating steps of after printing cream solder via a metal mask on a board, after reflowing processes to form solder bumps. SOLUTION: A method comprises the steps of charging a cream solder 1 to lands 5 on a board 4 through a metal mask using a squeegee 3, peeling a mask 2 off from the board 4, printing the solder 1 to the lands 5 of the board 4, reflowing to form this solder bumps 6 on the lands 5 of the board 4, charging the cream solder 1 to the solder bumps 6 via the metal mask 2 which is different in the opening diameter and thickness using the squeegee 3, peeling the mask 2 off from the board 4, printing the solder 1 to the bumps 6, and reflowing to form the solder bumps 6 on the lands 5 of the board 4.

7. 发明专利

JPH06177525A BONDING METHOD FOR ELECTRONIC PART 失效
公开(公告)号：JPH06177525A
公开(公告)日：1994-06-24
申请号：JP32298092
申请日：1992-12-02
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： UCHIYAMA HIROYUKI , KUMAGAI KOICHI , TSURUMI KOICHI , NAGATA HARUTO , FURUSAWA AKIO
IPC分类号： H05K3/34
摘要： PURPOSE:To decrease moment of causing a tombstone phenomenon using an electronic part bonding method in which the liquids temperature of the material of an external electrode outer layer is lower than the liquids temperature of bonding material. CONSTITUTION:An electronic part 10 is arranged on the solder paste 8 which is coated on a printed circuit substrate 6. Then, they are brought into a heating oven, and the printed circuit substrate 6 is heated up. At this time, the metal of an external electrode outer layer 11 begins to fuse, and the outside diameter of the electronic part 10 changes. Then, a solder part 8 begins to fuse. At this time, on the electronic part 10, as the outer layer 11 of the external electrode is in a fused state, the fused solder is diffused into the fused metal, not sucking up the solid electrode by the fused solder. As a result, a liquid-liquid interface state is formed, not a solid liquid interface state, the interfacial tention becomes smaller when compared with the solid liquid interface, the moment of causing a tombstone phenomenon becomes small.

8. 发明专利

JPH04164388A METHOD AND DEVICE FOR REFLOW SOLDERING 失效
公开(公告)号：JPH04164388A
公开(公告)日：1992-06-10
申请号：JP29272190
申请日：1990-10-29
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： FURUSAWA AKIO , TANIGUCHI MASAHIRO , KUMAGAI KOICHI
IPC分类号： B23K3/04 , H05K3/34
摘要： PURPOSE:To prevent the occurrence of thermal destruction and defective soldering in electronic parts so as to improve the certainty of soldering by performing reflow soldering to the electronic parts having different heat capacities and heat resistances mounted on one substrate by individually controlling the temperature by putting a plurality of heat medium to the parts. CONSTITUTION:Metallic blocks 2 and 3 which are separated from each other are provided as heat medium blocks for performing reflow soldering to a substrate 1 placed on the blocks 2 and 3. Heaters 4 and 6 and thermocouples 5 and 7 are respectively buried in the blocks 2 and 3. High-frequency module parts 15 on the substrate 1 receive heat from the block 2 and a four-direction plastic lead package 16 receives heat from the block 3. A temperature controller 8 sets the temperatures of the metallic blocks 2 and 3 in accordance with the ratio of the heat capacities of the parts 15 and 16 and controls the temperatures of the blocks 2 and 3 so as to maintain the blocks 2 and 3 at the set temperatures.

9. 发明专利

JP2006205198A Solder material and its manufacturing method 审中-公开
标题翻译：焊料及其制造方法
公开(公告)号：JP2006205198A
公开(公告)日：2006-08-10
申请号：JP2005019400
申请日：2005-01-27
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OKUMURA TOMOHIRO , FURUSAWA AKIO , SUETSUGU KENICHIRO
IPC分类号： B23K35/14 , B22F1/00 , B23K35/26 , B23K35/40 , C22C12/00 , C22C13/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide an unleaded high-temperature solder material which can be used for soldering within a high temperature range from 250 to 350°C, and further to provide its manufacturing method. SOLUTION: Crucibles 2, 3, 4 are arranged in a vacuum vessel 1, and Sn 5, Ag 6, and Al 7 are contained in the respective crucibles. The vacuum vessel 1 is evacuated by means of a pump 16. After a required negative pressure has been achieved, the respective crucibles are heated up to a required temperature. As a result, Sn, Ag, and Al change from solid to liquid, and begin to evaporate soon. The evaporation is carried out while turning a substrate 15 by operating a motor 18 connected to a substrate holder 14 via a supporting shaft 17. Thus, a thin film deposit is formed on the surface of the substrate 15. Next, the substrate 15 is taken out from the vacuum vessel 1, and the deposit is separated from the substrate 15 serving as a collecting member. Thus, the deposit can be obtained as a powder solder material. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供可在250至350℃的高温范围内用于焊接的无铅高温焊料，并进一步提供其制造方法。解决方案：坩埚2,3,4布置在真空容器1中，并且Sn 5，Ag 6和Al 7被包含在相应的坩埚中。真空容器1通过泵16抽真空。在达到所需的负压之后，将相应的坩埚加热到所需温度。结果，Sn，Ag和Al从固体转变为液体，并很快开始蒸发。通过经由支撑轴17操作连接到衬底保持器14的电动机18来转动衬底15来进行蒸发。因此，在衬底15的表面上形成薄膜沉积。接下来，取下衬底15 从真空容器1出来，并且沉积物与用作收集构件的基板15分离。因此，可以作为粉末焊料材料获得沉积物。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2006167790A Producing method for solder material 有权
标题翻译：生产焊料的方法
公开(公告)号：JP2006167790A
公开(公告)日：2006-06-29
申请号：JP2004367154
申请日：2004-12-20
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： FURUSAWA AKIO , SUETSUGU KENICHIRO , TANAKA MASATO , TAKEHARA HIDEKI
IPC分类号： B23K35/40 , B23K35/26 , C22C1/02 , C22C12/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a producing method for a lead-free high-temperature solder material, which is used for soldering in the high-temperature range of 250-300°C, since conventional high-temperature solder materials, which are produced by individually adding a single element to a binary alloy, are insufficient in reliability because of the wide range of variation of their liquidus temperatures.
SOLUTION: A 1st metallic component contains Bi and consists of a binary eutectic alloy. A 2nd metallic component has an eutectic point temperature different from that of the 1st metal component and is a binary eutectic alloy of two kinds of metals selected from Bi, Ag, Cu, Ge, and Zn. A 3rd metallic component consists of one or more kinds of metals selected from Pd, Al, Co, and Si. A lead-free high-temperature solder material having a melting point of 250-300°C is produced by adding the 2nd metallic component and next the 3rd metallic component to the 1st metallic component.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种用于在250-300℃的高温范围内焊接的无铅高温焊料材料的制造方法，由于常规的高温焊料材料，这是通过将单一元素单独添加到二元合金中而产生的，由于它们的液相线温度的变化范围广，其可靠性不足。
解决方案：第一金属组分含有Bi，由二元共晶合金组成。第二金属成分的共晶点温度与第一金属成分不同，是二种选自Bi，Ag，Cu，Ge，Zn的两种金属的二元共晶合金。第三金属组分由选自Pd，Al，Co和Si的一种或多种金属组成。通过将第二金属组分和第三金属组分添加到第一金属组分中来制备熔点为250-300℃的无铅高温焊料。版权所有（C）2006，JPO＆NCIPI

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