会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明专利
    • METHOD FOR MANUFACTURING LAMINATE AND APPARATUS THEREFOR
    • JP2001078399A
    • 2001-03-23
    • JP25295499
    • 1999-09-07
    • MATSUSHITA ELECTRIC IND CO LTD
    • OKADA NOBUHIROAKIYAMA NORIYUKI
    • B23P11/00H02K15/02
    • PROBLEM TO BE SOLVED: To suppress an increase in the thickness of lamination layers and prevent degradation of a magnetic property by applying a low-viscosity adhesive to the side end surface of a laminated single plate, and infiltrating and adhering the adhesive into a gap between the laminated single plates through a capillary phenomenon. SOLUTION: This laminate is formed so that an adhesive inhibitor 2 may be applied between blocks 3 on which a plurality of single plates 1 may be laminated. A low- viscosity adhesive 4 having 3000 CPS viscosity or lower is applied to the side end surface of the laminate. Because the viscosity of the adhesive 4 is low, a capillary phenomenon infiltrates the adhesive 4 between gaps of the single plates 1 to bond the single plates 1, however, a gap between the single plates 1 to which the adhesive inhibitor 2 is applied is not bonded. Fn the low-viscosity adhesive, its viscosity is determined depending on the thickness of the single plate and its surface condition as appropriate. For example, epoxy, hot melt, or silicone cyanoacrylate adhesive is preferable. By applying an adhesive inhibitor, such as oil, to the single plate at prescribed intervals before laminating the single plates, and forming a separated part on the laminate, a laminate may be formed with a fixed number of single plates bonded.
    • 5. 发明专利
    • CUPPING DIE
    • JPH04200934A
    • 1992-07-21
    • JP33795990
    • 1990-11-30
    • MATSUSHITA ELECTRIC IND CO LTD
    • FUKUDA KOJIAKIYAMA NORIYUKIBETSUMIYA ATSUSHIYADORI YASUNORI
    • B21D22/26B21D24/00
    • PURPOSE:To accurately work a bottom surface and product chamfering part by mounting a shoulder part to work a product chamfering part on a forming punch to work a plate material into the shape of a bottomed cylinder and providing a chamfering part and a clearance part on a forming die. CONSTITUTION:A plate material 2 is held between a stopper 5 and a forming die 3 and the forming punch 1 is lowered and the material 2 is worked into a bottomed cylinder. Then, an ejector 4 is elevated to eject the obtained product from the forming die 3 and to recover it. In this cupping die, a shoulder part 1a working the product chamfering part 6 on the boundary between the bottom surface and the outer peripheral part of the product is provided on this forming punch 1. On one hand, a chamfering part forming the product chamfering part 6 between the forming die 3 and the shoulder part 1a of this forming punch 1 and a clearance part 7 carrying out no chamfering are provided partially on the forming die 3 to form a clearance A communicating with a degreasing hole 8. Consequently, grease and air are prevented from remaining between the material 2 and the forming punch 1 and the bottom surface of the product and the product chamfering part 6 are improved in accuracy.
    • 6. 发明专利
    • MANUFACTURE OF LAMINATED ELEMENT
    • JP2001009532A
    • 2001-01-16
    • JP18491899
    • 1999-06-30
    • MATSUSHITA ELECTRIC IND CO LTD
    • AKIYAMA NORIYUKI
    • B21D28/02
    • PROBLEM TO BE SOLVED: To obtain a laminated element of high space factor by applying a low viscosity binder to a die side face of a bandlike thin plate single plate punching position for laminating/jointing and, performing a punching processing after immediately moving it onto the die. SOLUTION: A band-like thin plate 11 is intermittently moved between a punch 4 and a die 5 and, punch block 1 advancing operation and a binder discharging operation from a nozzle 9 of a binder applying part 3 are controlled to be synchronized along with a stop timing of the intermittent movement. When the punch block 1 advances, the bandlike thin plate 11 is pressed upon the die 5 and abuts against the binder applying part 3. At this time, the punch 4 descends on the die 5 for punching out an iron core single plate 6 from the bandlike thin plate 11. The iron core single plate 6 is inserted into a punch hole 5a formed on the die 5 so as to be laminated. Also, on the binder applying part 3, a binder 7 is discharged from the nozzle 9 so as to apply the binder 7 to a bottom face of the band-like thin plate 11.