专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JPH03177037A MECHANISM AND METHOD FOR DETECTING OFF-SET AMOUNT BETWEEN TOOL AND CAMERA OF BONDING DEVICE 失效
公开(公告)号：JPH03177037A
公开(公告)日：1991-08-01
申请号：JP31440989
申请日：1989-12-05
申请人： MARINE INSTR CO LTD
发明人： TAKANO TADASHI , NISHIMAKI KOUJI
IPC分类号： H01L21/60
摘要： PURPOSE:To enable accurate computation and measurement of an off-set amount without carrying out temporary bonding on a sample by automatically calculating and computing the center of a tool of a bonding head through a tool edge detector. CONSTITUTION:A tool edge detector 10 of a bonding head 9 is mounted on a device box 12, and the light projected from a fiber impinges on the tool edge part of the bonding head 9 and reflected light therefrom is received by the tool edge detector 10 and is photoelectrically converted therein and is input to a control circuit. Further, a camera 1 and the bonding head 9 are moved in the XY directions by an XY table driving mechanism to take the image of the tool edge detector 10 so that the position thereof can be stored. The center of the tool is computed from the coodinates of the tool edge of the bonding head obtained by the tool edge detector 10, and the off-set amount between the tool and the camera 1 is detected by the control circuit. Thus, the off-set amount can accurately be determined and moreover the measuring time can be reduced so that working efficiency can be improved.

2. 发明专利

JPH02248058A TAPE BONDING DEVICE 失效
公开(公告)号：JPH02248058A
公开(公告)日：1990-10-03
申请号：JP6762889
申请日：1989-03-22
申请人： MARINE INSTR CO LTD
发明人： TAKANO TADASHI
IPC分类号： H01L21/60
摘要： PURPOSE:To enable the bonding of an electronic device even if it is large in size by a method wherein a tool supporter, which supports both the ends of a guide shaft that pivotally supports a bonding tool and is movable to a bonding plane, is provided movable in a vertical direction. CONSTITUTION:Parts 10a and 10b of a bonding tool 10 are pivotally supported by a guide shaft 12 formed nearly T-shaped in cross section and fixed to both supporting sections 13a and 13b of a tool supporter 13 and constituted in such a state that they can move in a direction that the guide shaft 12 guides or a direction of an arrow. The tool 10 is able to stop at an optional position on the guide shaft 12 and fixed by screws or the like from the upper opening of the tool supporter 13. The upside of the tool 10 is made to bear against the tool supporter 13. The bonding tool 10 is positioned at a tool descending position and then is made to descend through an XY table to enable its tip to be brought into contact with an inner lead 17, and the inner lead 17 and an outer lead are hot-bonded by pressure to join together through a bonding pressure and heat applied to the tool supporter 13.

3. 发明专利

JPH02130935A SHORT-SIZED TAPE CONVEYER FOR TAPE BONDER 失效
公开(公告)号：JPH02130935A
公开(公告)日：1990-05-18
申请号：JP28524588
申请日：1988-11-11
申请人： NEC CORP , MARINE INSTR CO LTD
发明人： SAKURAI KEIZO , TAKANO TADASHI
IPC分类号： H01L21/50
摘要： PURPOSE:To effectively convey the section tape of a tape bonder by transferring works before bonding, from this side of a bonding workbench to a specified position of the workbench, and pushing out works after bonding from the workbench toward an unloader magazine. CONSTITUTION:A loader magazine 2 accommodates works 1 before bonding, and the work 1 fixes a section tape to a tape carrier. A loader elevator 3 sets the magazines 2 at previously assigned heights in order. An unloader magazine 12 accommodates works 1 after bonding, and sets the magazines 12 at a plurality of previously assigned heights in order by an unloader elevator 13. The works 1 before bonding are carried by a belt conveyer, from the loader magazine to a specified positions on this side of a boding workbench 7. Said works 1 are transferred from said position to a specified position of the workbench 7. The works 1 after bonding are pushed out by a work-supply-pushing-out apparatus, from the workbench 7 toward the magazine 12.

4. 发明专利

JPS61163646A LIFTING GEAR FOR TOOL OF TAPE BONDING DEVICE 失效
公开(公告)号：JPS61163646A
公开(公告)日：1986-07-24
申请号：JP412485
申请日：1985-01-16
申请人： NEC CORP , MARINE INSTR CO LTD
发明人： OKAMURA MINORU , IKEDA FUMIMARO , TAKANO TADASHI
IPC分类号： H01L21/52 , H01L21/58 , H01L21/60
摘要： PURPOSE:To adjust the pushing force of joining operation and the follow-up properties of a cam follower easily, and to shorten the time by severally enabling the adjustment of the pushing force and the adjustment of the follow-up properties. CONSTITUTION:The revolution of a motor 11 is transmitted over a cam 15, and a member 19 hung down by a spring 26 from a holder 28 through a cam holder 20 is slid vertically along a member 24. An air cylinder 16 fixed onto the member 19 and a pressing member 17 hung down from the member 19 by a spring 25 are also moved vertically at that time. When the members 17, 19 are lowered, a joining tool 18 fastened at the lower end of the member 17 approaches to a substrate 9 on a base 10. A contact between the tool 18 and the substrate 9 is detected by a switch 27, and the work of pressing, changeover, heating, etc. is conducted. The pressing sliding member 17 is left together with the tool, and a stopper 22 at the upper end of the member 17 is separated from the upper end of a pressing slide 23 in the front of the member 19. The substrate is pressed afterward by the air cylinder 16. According to the constitution, the vertical speed and pressing force of the tool can be adjusted separately, thus easily executing work rapidly.

5. 发明专利

JPH03174736A AUTOMATIC LEVELING MECHANISM FOR TAPE BONDER 失效
公开(公告)号：JPH03174736A
公开(公告)日：1991-07-29
申请号：JP31342689
申请日：1989-12-04
申请人： MARINE INSTR CO LTD
发明人： TAKANO TADASHI
IPC分类号： H01L21/60
摘要： PURPOSE:To automatically adjust the levels of a bonding tool and a work surface and thus obtain uniform bonding strength by using a mechanism to depress the bonding tool when it touches the bonding face and leaves the socket for receiving the tool. CONSTITUTION:A bonding tool 3, driven by an X-Y table 25, is positioned on the surface of an object placed on a substrate 8. A vertical drive mechanism 24 moves a tool holder 20 downward to drive a push member 1 downward. When the abutment face of the bonding tool 3 comes into contact with the work surface on the substrate 1, the tip of the support of a tool grip 2 leaves a socket, and thus the bonding tool becomes free. The push member 1 still goes downward, and its pressing face 1c depresses a mounting member 2b. In this manner, the bonding tool is automatically leveled with the work surface, and uniform bonding strength is obtained.

6. 发明专利

JPH02248059A BONDING DEVICE 失效
公开(公告)号：JPH02248059A
公开(公告)日：1990-10-03
申请号：JP6762989
申请日：1989-03-22
申请人： MARINE INSTR CO LTD
发明人： TAKANO TADASHI
IPC分类号： H01L21/60
摘要： PURPOSE:To enable the bonding of an electronic device even if it is large in size by a method wherein a bonding tool is composed of a bonding tool stationary part and a bonding tool movable part capable of pivoting about a rotation axis supported by the bonding tool stationary part. CONSTITUTION:A bonding tool movable part 19 is so supported as to be movable about a rotation axis 25 as a center supported by a nearly U-shaped bonding tool stationary part 20. A work contact part 24 is formed protrudent from the rotation axis 25 of the bonding tool movable part 25 as a center and its bonding face is formed arc-shaped, and it is so constituted as to be located at the center of the bonding tool stationary part 20. The bonding tool stationary part 20 is supported by a tool holder 23, the tool holder 23 is made to move up or down by an up-down drive means, and the up-down drive means is mounted on an XY table to enable the work contact part 25 to be positioned moving in the directions of X and Y.

7. 发明专利

JPH01181542A HEAD FOR PICKING UP SEMICONDUCTOR CHIP 失效
公开(公告)号：JPH01181542A
公开(公告)日：1989-07-19
申请号：JP459688
申请日：1988-01-12
申请人： MARINE INSTR CO LTD
发明人： KONO HIDEYUKI , HARA KAZUNORI , TAKANO TADASHI
IPC分类号： H01L21/67 , H01L21/52 , H01L21/68
摘要： PURPOSE:To go without a sticking plate and to conduct a pick-up of a chip near an expanding ring, by equipping a sticking sheet weight on the chucking side of semiconductor chip for avoiding the upheaval of a sticking sheet. CONSTITUTION:A head for picking up a chip is provided with a chucking collet 1 which has a vacuum exhaust hole 1a having an opening portion against the chucking side of a semiconductor chip. The chucking collet 1 is moved toward the chucking side of the semiconductor chip by an equipment for pushing out the chucking collet, until the opening portion of the vacuum exhaust hole 1a is shut up by the chucking side of the semiconductor chip for the chucking collet 1 to stick to a chip. On the other hand, while a plunge-up pin 12 is plunging up the chip, a sticking sheet weight 7 avoids the upheaval of a sticking sheet 10 around the chip which is being picked up from the chip chucking side of the sticking sheet 10. Therefore, a semiconductor chip which has been sticking to the sticking sheet 10 is peeled off from the sticking sheet 10. By this method, there is no need of a chucking plate and chips arranged near an expanding ring can also be picked up.

8. 发明专利

JPH02248057A TAPE BONDING DEVICE 失效
公开(公告)号：JPH02248057A
公开(公告)日：1990-10-03
申请号：JP6762789
申请日：1989-03-22
申请人： MARINE INSTR CO LTD
发明人： TAKANO TADASHI
IPC分类号： H01L21/60
摘要： PURPOSE:To enable the bonding of an electronic device even if it is large in size by a method wherein the area of the bonding face of a tool is made equal to that of a row of bonded components arranged in lines or in a belt of prescribed width. CONSTITUTION:The pressing face area of a work pressing section 10 of a bonding tool 14 is made equal to the area of a row of bonded components arranged in lines or in a belt of prescribed width. The bonding tool 14 is positioned at a descending position in the directions of X and Y through an XY table 17, and then an arm 16a of a vertical drive section 16 is made to descend and the tip of the tool 14 presses a bump and leads 18 on an IC chip 19 positioned and arranged on a board 20 to join the leads 18 to the board 20 through thermocompression bonding by pressure to finish bonding. By this setup, bonding excellent in accuracy can be carried out even if an electronic device is made large in size.

9. 发明专利

JPH02243500A CONSTANT LIFT SUPPLY MECHANISM 失效
公开(公告)号：JPH02243500A
公开(公告)日：1990-09-27
申请号：JP6348289
申请日：1989-03-17
申请人： MARINE INSTR CO LTD
发明人： TAKANO TADASHI
IPC分类号： B66F19/00
摘要： PURPOSE:To aim at the promotion of space saving irrespective of an amount of lift in a material body by connecting a support of the body to a moving body traveling on a base in a direction orthogonal with the support, and also connecting the moving body traveling along a cam formed in the support on the base with a spring. CONSTITUTION:A roller 6a travels along an end face 10 of a longitudinal fixed plate 10 with height of a lifting material 1. A slide plate 12 moves in an arrow A direction via a fulcrum pin 8a at an edge of a connecting rod 8 connected to the roller 6a, and thereby a spring 9 is made so as to be energized, but a cam 7 or a support is also synchronized with motion of the roller 6a and a roller 6c travels along a cam groove 7b. Consequently, this roller 6c rectilinearly travels together with ta straight slide plate 12b installed on a base 13, and the spring 9 pulls the slide plate 12a in a B direction so that dead load of the lifting material 1 is thus offset. Therefore the promotion of space saving can be done irrespective of vertical travel of the lifting material 1.

10. 发明专利

JPH02109346A TAPE BONDING DEVICE 失效
公开(公告)号：JPH02109346A
公开(公告)日：1990-04-23
申请号：JP26134788
申请日：1988-10-19
申请人： MARINE INSTR CO LTD
发明人： TAKANO TADASHI , KONO HIDEYUKI
IPC分类号： H01L21/60
摘要： PURPOSE:To enable highly accurate inner lead bonding efficiently at a high speed by independently providing an IC chip position detector for detecting an IC chip supplied and placed onto a receiving board and a detector for a lead position with respect to a head. CONSTITUTION:An IC chip 8' is picked up from an adhesive sheet on a wafer cassette ring 9 by a transfer arm 7, and the chip 8' is supplied and placed onto a receiver base 1 at an IC chip supply position. Then the position of the chip 8' is detected by a camera 11 exclusively used for the IC chip 8'. The position of lead group of carrier tape 5 which has reached the bonding position is at the same time detected by a camera 12 exclusively for detection of the lead group. Then the receiver base 1 which has completed the detection of IC chip 8' is moved in a Y direction while X, Y and theta compensation is made for matching with the lead group, and the carrier tape 65 is lowered to the bonding level by a tape holder 6 while the position of IC 8' is made to be the bonding position, and thereafter bonding is carried out through heating and pressurizing processes by a tool 3.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式