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1. 发明专利

JPH0220035A DEVICE FOR DETECTING CENTER OF ROTATION OF IC CHIP ON ULTRASONIC BONDER 失效
公开(公告)号：JPH0220035A
公开(公告)日：1990-01-23
申请号：JP17007788
申请日：1988-07-08
申请人： MARINE INSTR CO LTD
发明人： SASAHARA HIDENORI , MIYOSHI HIDEAKI , HIRATA YUUJI
IPC分类号： H01L21/60 , H01L21/607
摘要： PURPOSE:To accurately detect the center of rotation of an IC chip by storing a visual field pattern recognized at the initial time of detection of rotating center, comparing it with the visual field pattern at the second and later times of the detection of the center, and moving to search a recognition camera and the chip until a pad is collected as a mark in the visual field. CONSTITUTION:A recognition device 18 outputs a coordinates signal 1 of a visual field center 34 collected by a recognition camera 17 and a visual field pattern signal 2. A pad center position calculator 23 receives the signals 1, 2 of the center 34, counts small divisions of the signal 2 longitudinally and laterally from the center 34 to the center 35 of the pad, and obtains the coordinates of the center 35 of the initial detection pad. Then, a rotary table 14 is rotated, an IC chip is rotated at 180 in a pad placing surface, a center position calculator 24 calculates the coordinates of the center of rotation of the chip, a comparator 26 compares the initial visual field pattern from a memory 25 with the visual field pattern collected at present, and an XY table controller 29 moves a X table or a Y table until the detection pad of second or later is collected in the field.

2. 发明专利

JPH01273388A BONDER FOR OUTER LEAD 失效
公开(公告)号：JPH01273388A
公开(公告)日：1989-11-01
申请号：JP10126388
申请日：1988-04-26
申请人： MARINE INSTR CO LTD
发明人： MIYOSHI HIDEAKI
IPC分类号： H05K3/34 , H01L21/60 , H05K13/00
摘要： PURPOSE:To bond an outer lead immediately after a substrate is conveyed, and to shorten a cycle time by installing a semiconductor-chip sticking stage in the carrying path of the substrate on the stream side upper than a bonding stage and setting up a semiconductor-chip sticking device at the position of the substrate in the sticking stage. CONSTITUTION:A semiconductor-chip sticking stage 36 is mounted in the carrying path of a substrate on the stream side upper than a bonding stage 37. A semiconductor-chip sticking device 18 sticking a semiconductor chip 2 is fitted at the specified position of the substrate in the stage 36. The substrate 1, at the predetermined position of which the chip 2 is pasted previously, is conveyed to the stage 37. Since the chip 2 is stuck to the substrate 1, positional displacement to the substrate 2 is not generated by carrying. Consequently, an outer lead is bonded by an outer lead bonder immediately after the substrate is conveyed. Accordingly, a bonding cycle time is shortened.

3. 发明专利

JPS61154196A OUTER LEAD BONDING APPARATUS 失效
公开(公告)号：JPS61154196A
公开(公告)日：1986-07-12
申请号：JP27374884
申请日：1984-12-27
申请人： NEC CORP , MARINE INSTR CO LTD
发明人： OKAMURA MINORU , SATO TATSUO , MIYOSHI HIDEAKI , KANDA YUJI
IPC分类号： H05K3/32 , H01L21/60

4. 发明专利

JPH03155141A FRAME CONVEYANCE SWITCHING MECHANISM AND SWITCHING METHOD THEREFOR 失效
公开(公告)号：JPH03155141A
公开(公告)日：1991-07-03
申请号：JP29400089
申请日：1989-11-14
申请人： MARINE INSTR CO LTD
发明人： URAMOTO IWAMI , MIYOSHI HIDEAKI , NOMURA HISASHI
IPC分类号： H01L21/52 , H01L21/50
摘要： PURPOSE:To improve timing efficiency in a frame feeding step and to prevent warpage of a frame by providing two or more conveying mechanisms for conveying the frame in parallel in a direction parallel to a frame guiding direction to guide means, providing means for switching a guide for holding the frame to higher and lower positions than the frame conveying surface of the conveying mechanism. CONSTITUTION:A base 21 coupled to the end of a shaft is position-controlled in a pulled state in the state that the shaft 10a of a cylinder 10 is sucked. In this case, conveying mechanisms 6, 7 become states in which guide rails 3a, 3b coincide with the conveying path of a conveying mechanism 4. In this case, a bearing 29 provided on the lower surface of a holding base 26 is disposed at the uppermost part 18H of a cam surface. Accordingly, when disposed at the lowermost part 18L of the cam surface, a lead frame placed on belts 7c, 7d of the mechanism 7 is held at both ends by guide rails 31a, 31b by the suction of the cylinder to be raised, and steadily separated from above the belts 7c, 7d.

5. 发明专利

JPH0244744A WIRE BONDING 失效
公开(公告)号：JPH0244744A
公开(公告)日：1990-02-14
申请号：JP19461888
申请日：1988-08-05
申请人： MARINE INSTR CO LTD
发明人： MIYOSHI HIDEAKI , AOKI MASAHIRO
IPC分类号： H01L21/607 , H01L21/60
摘要： PURPOSE:To prevent the irregular feed amount of the wire and the deviation of a bent point by allowing a first bonding margin to protrude from the end of a wedge before the wire is cut, and bending it at the base of the margin. CONSTITUTION:A wedge 1 is relatively raised while a wire 2 remains continued from a second bonding part 8 to set the length of the wire 2 between the part 8 and the wedge 1 to l. Then, the wedge 1 is again relatively lowered, and the wire is bent at the part beforehand of the length l from the rising base of the wire. Thereafter, the wedge 1 is relatively moved forward in a state that the rearward movement of the wedge 1 to the wire 2 is stopped, and the rising base of the wire 2 is cut. Thus, the irregular feed amount of the wire 2, the deviation of the bending point, and the lateral bending of the first bonding margin do not possibly occur.

6. 发明专利

JPH0244740A METHOD AND APPARATUS FOR WIRE BONDING 失效
公开(公告)号：JPH0244740A
公开(公告)日：1990-02-14
申请号：JP19461788
申请日：1988-08-05
申请人： MARINE INSTR CO LTD
发明人： MIYOSHI HIDEAKI
IPC分类号： H01L21/60
摘要： PURPOSE:To effectively bond without fail by reducing the inclination of a wire in the wire guide hole of a bonding wedge, then increasing the inclination of the wire, and performing first and second bindings. CONSTITUTION:A first slider 8 is vertically movably provided along a first slide face 7 having the same inclination of 60 deg. as that of a wire 5 at the end of an arm 2, and a second slider 10 is vertically movably provided along a second slide face 9 having an inclination of 135 deg. directed toward the wedge 4 of the slider 8. For example, when the inclination of the wire is 30 deg. and a first bonding is conducted, a first bonding margin of predetermined length is effectively brought into pressure contact with a first bonding part, and the inclination of the wire is set to, for example, 60 deg., and a second bonding is conducted. Thus, both the first and second bondings can be effectively performed without fail.

7. 发明专利

JPH01273396A BONDER FOR OUTER LEAD 失效
公开(公告)号：JPH01273396A
公开(公告)日：1989-11-01
申请号：JP10126188
申请日：1988-04-26
申请人： MARINE INSTR CO LTD
发明人： MIYOSHI HIDEAKI
IPC分类号： H05K13/00 , H01L21/60
摘要： PURPOSE:To conduct continuous bonding to a plurality of semiconductor chips of a different kind by using one bonder by transferring the semiconductor chips fed by a plurality of feeders to the specified position of a printed board on a semiconductor-chip sticking stage. CONSTITUTION:A semiconductor-chip sticking stage 36 is installed in a carrying path on the stream side upper than a bonding stage 37, a plurality of feeders 7 to 11 are mounted, and a semiconductor-chip shifter shifts semiconductor chips 2 to 6 supplied by a plurality of the feeders to the predetermined positions of printed boards 1 on the semiconductor-chip sticking stage 36. Consequently, when paste is applied previously to the printed boards 1 or the semiconductor chips 2 to 6, a plurality of the semiconductor chips can be stuck at the fixed positions of the printed boards 1 in the semiconductor-chip sticking stage 37. Since the printed boards 1, at specified positions of which a plurality of the semiconductor chips of a different kind are pasted previously, are fed to the bonding stage 37, bonding is performed instantaneously.

8. 发明专利

JPS63308328A DEVICE FOR TRANSFER OF LEAD FRAME 失效
公开(公告)号：JPS63308328A
公开(公告)日：1988-12-15
申请号：JP11262287
申请日：1987-05-11
申请人： MARINE INSTR CO LTD
发明人： MIYOSHI HIDEAKI
IPC分类号： H01L21/50
摘要： PURPOSE:To independently transfer partial leads frame separately by providing a lead frame support plate on a table oppositely to a lead frame group support plate on a movable table, and elevationally movably providing a lead frame gripper near the edge of the table. CONSTITUTION:A lead frame support plate is provided on a table 24 oppositely to a lead frame group support plate on a movable table 25, and a lead frame gripper is elevationally movably provided near the edge of the table 24. Accordingly, when the lead frame at the end is isolated from the lead frame group, the group support plate and the table 25 are advanced at one pitch with the distance between the lead frames as one pitch, thereby advancing the group at one pitch. Thus, one lead frame can be effectively isolated and transferred from the group of the state placed on the table 24 merely in stack without using a case and without using a manual labor.

9. 发明专利

JPS62291042A METHOD FOR RECOGNIZING LEAD POSITION 失效
公开(公告)号：JPS62291042A
公开(公告)日：1987-12-17
申请号：JP13281886
申请日：1986-06-10
申请人： MARINE INSTR CO LTD
发明人： MIYOSHI HIDEAKI , KAMIHARASHI TAKASHI , HIYAMA MASAAKI
IPC分类号： H01L21/66 , H01L21/60
摘要： PURPOSE:To realize simple calculation and a simple calculation means and reduce the errors even if the expansion coefficients of an X-direction and a Y-direction are different from each other by a method wherein the respective expansion coefficients of the X-direction and the Y-direction of specific leads are obtained from the coordinates of the specific leads before and after the displacement and the coordinates of the arbitrary leads after the displacement are obtained by multiplying the coordinates of those leads before the displacement by the expansion coefficients. CONSTITUTION:A nearly central position of all leads is selected as an origin 0 of coordinates and the respective reference X-Y coordinates of all the leads which are objects to be recognized are memorized before the displacement. Specific leads A and B (whose X-coordinates are defined as reference X-coordinates XOA and XOB) and specific leads C and D (whose Y-coordinates are defined as reference Y-coordinates YOC and YOD) are selected and the positions of the leads A, B, C, and D after the displacement are recognized by as recognition means and the displaced X-coordinates XA and XB of the leads A and B after displacement and the displaced Y-coordinates YC and Y of the leads C and D are memorized and KX =(XA-XB)/(XOA-XOB) and KY=(YC-YD)/(YOC-YOD) are calculated as the expansion coefficients of the X-direction and the Y-direction respectively. The displaced X and Y coordinates of the arbitrary leads after displacement can be obtained by multiplying the reference X and Y coordinates of the leads by KX and KY respectively.

10. 发明专利

JPS61166095A OUTER LEAD BONDING APPARATUS 失效
公开(公告)号：JPS61166095A
公开(公告)日：1986-07-26
申请号：JP66486
申请日：1986-01-08
申请人： NEC CORP , MARINE INSTR CO LTD
发明人： OKAMURA HIROSHI , SATO TATSUO , MIYOSHI HIDEAKI , KANDA YUJI
IPC分类号： H05K3/32

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