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1. 发明专利

JP2011194813A Resin laminate for laminating flat plates, and laminate flat plate 有权
标题翻译：用于层压平板和层压板的树脂层压板
公开(公告)号：JP2011194813A
公开(公告)日：2011-10-06
申请号：JP2010066393
申请日：2010-03-23
申请人： Lintec Corp , リンテック株式会社
发明人： EJIMA YUTAKA , YOSHINOBU TAKEAKI , HAMAMOTO HIROSHI , HIRANO JUNYA
IPC分类号： B32B27/00 , G06F3/041
摘要： PROBLEM TO BE SOLVED: To provide a resin laminate for laminating flat plates, which can remove bubbles produced in laminating lamination surfaces of the flat plates having a step, and can suppress the temporal generation of bubbles, and to provide a laminate flat plate thereof.SOLUTION: The resin laminate for laminating flat plates 1 is a resin laminate for laminating the lamination surfaces of two hard flat plates mutually. One flat plate 4 has the step 5 having a height of 3-50 μm on the lamination surface 4a side. The resin laminate has a resin layer A2 laminated on the lamination surface 4a side of one flat plate 4 having the step 5 and a resin layer C3 laminated on the lamination surface 6a side of the other flat plate 6. The resin layer C3 is higher in a storage elastic modulus at 23°C than the resin layer A2.
摘要翻译：要解决的问题：提供一种用于层压平板的树脂层压板，其可以去除具有台阶的平板的层压层压表面中产生的气泡，并且可以抑制气泡的时间产生，并提供其层压板。解决方案：用于层压平板1的树脂层压板是用于相互层压两个硬平板的层叠表面的树脂层压体。一个平板4在层叠表面4a侧具有高度为3-50μm的台阶5。树脂层叠体具有层叠在具有台阶5的一个平板4的层叠面4a侧的树脂层A2和层叠在另一平板6的层叠面6a侧的树脂层C3。树脂层C3较高在23℃下比树脂层A2的储能弹性模量。

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