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1. 发明专利

JP2008109063A Ceramic multilayer substrate 审中-公开
标题翻译：陶瓷多层基板
公开(公告)号：JP2008109063A
公开(公告)日：2008-05-08
申请号：JP2006319956
申请日：2006-11-28
申请人： Kyocera Corp , 京セラ株式会社
发明人： FURUKUBO YUYA , YAMAMOTO SENTARO
IPC分类号： H05K3/46 , B28B11/14 , H05K1/02 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a ceramic multilayer substrate of high dimensional accuracy, which can be split by a splitting groove.
SOLUTION: The ceramic multilayer substrate is provided with respectively sintered first insulating layer 3 and second insulating layer 5 of different contraction start temperatures, an outermost layer 11 comprises the first insulating layers 3 and 11, the second insulating layers 5 and 13, laminated adjacent to the inner side of the first insulating layers 3 and 11, are provided, and the splitting groove 7 is formed to the middle of the first insulating layers 3 and 11. Thus, the first insulating layers 3 and 11 are not completely partitioned in the adjacent substrate region, high-contraction suppression effect in the surface direction of the entire ceramic multilayer substrate 1 can be maintained and substantially uniformized, and the ceramic multilayer substrate 1 of high dimensional accuracy which can be easily split by the splitting groove 7 is provided.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供可以通过分割槽分裂的高尺寸精度的陶瓷多层基板。解决方案：陶瓷多层基板设有具有不同收缩开始温度的分别烧结的第一绝缘层3和第二绝缘层5，最外层11包括第一绝缘层3和11，第二绝缘层5和13，并且分隔槽7形成在第一绝缘层3和11的中间。因此，第一绝缘层3和11不完全分隔在相邻的基板区域中，能够维持整个陶瓷多层基板1的表面方向的高收缩抑制效果，并且基本上均匀化，能够容易地被分割槽7分割的高尺寸精度的陶瓷多层基板1为提供。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2006140400A Ceramic multilayer substrate and its manufacturing method 审中-公开
标题翻译：陶瓷多层基板及其制造方法
公开(公告)号：JP2006140400A
公开(公告)日：2006-06-01
申请号：JP2004330604
申请日：2004-11-15
申请人： Kyocera Corp , 京セラ株式会社
发明人： YAMAMOTO SENTARO
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic multilayer substrate which can be made hard to form any void and can make an insulating layer thin and a wiring conductor layer thick.
SOLUTION: The method comprises steps of coating a conductor paste on the surface of a carrier film to form conductor patterns having different heights; forming a photosetting dielectric layer so as to cover the conductor patterns on the surface of the carrier film; providing a mask on a part of the conductor pattern having a high height, and irradiating the mask with light to set part of the photosetting dielectric layer and to modify the dielectric layer; preparing a flat composite green sheet by removing a non-photoset part not set by the exposure step; forming a laminate by stacking the other composite green sheet and/or the other green sheet on the first-mentioned composite green sheet, and collectively sintering the laminate.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种制造陶瓷多层基板的方法，其可以制成难以形成任何空隙并且可以使绝缘层薄并且布线导体层变厚。解决方案：该方法包括以下步骤：在载体膜的表面上涂覆导体糊，形成具有不同高度的导体图案; 形成光固化介电层，以覆盖载体膜表面上的导体图案; 在具有高高度的导体图案的一部分上提供掩模，并且用光照射掩模以设置光电介质层的一部分并修改介电层; 通过去除不由曝光步骤设置的非光泽部分来制备扁平复合生片; 通过将另一种复合生片和/或其他生片堆叠在第一提及的复合生片上形成层压体，并且一起烧结层压体。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2003073172A Ceramic moldings and method of manufacturing ceramic sintered compact using the same 审中-公开
标题翻译：陶瓷模具及其制造方法使用相同的陶瓷烧结紧固件
公开(公告)号：JP2003073172A
公开(公告)日：2003-03-12
申请号：JP2001262466
申请日：2001-08-30
申请人： Kyocera Corp , 京セラ株式会社
发明人： YAMAMOTO SENTARO , KAJIWARA SATORU , ENAMI SHINICHI
IPC分类号： C04B35/622 , C04B35/00 , C04B35/495 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide ceramic moldings capable of being manufactured into a fine sintered compact even in the case of containing a lot of synthetic resin ingredients, without impairing a sintering property, and to provide a method of manufacturing a ceramic sintered compact. SOLUTION: The ceramic moldings are composed of a ceramic ingredient and an organic ingredient, wherein the organic ingredient contains at least polymerization initiator and a monomer (oligomer) and a volume-contractive organic ingredient, and the ceramic compact is contracted by the volume- contractive organic ingredient by imparting light or heat. The organic ingredients are decomposed and removed, after that the ceramic compact is sintered.
摘要翻译：要解决的问题：即使在含有大量合成树脂成分的情况下也能够制造成精细烧结体的陶瓷模制品，而不损害烧结性能，并提供陶瓷烧结体的制造方法。解决方案：陶瓷模制品由陶瓷成分和有机成分组成，其中有机成分至少含有聚合引发剂和单体（低聚物）和体积收缩有机成分，陶瓷成型体由体积收缩剂有机成分通过赋予光或热。有机成分被分解除去，然后烧结陶瓷压块。

4. 发明专利

JP2013197180A Ceramic substrate for housing electronic component and electronic component mounting package using the same 有权
标题翻译：用于住宅电子元件的陶瓷基板和使用该电子元件的电子元件安装包
公开(公告)号：JP2013197180A
公开(公告)日：2013-09-30
申请号：JP2012060518
申请日：2012-03-16
申请人： Kyocera Corp , 京セラ株式会社
发明人： YAMAMOTO SENTARO , NISHIURA SOSUKE , OKAMOTO MASANORI
IPC分类号： H01L23/08 , H01L23/04 , H03H9/02 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a ceramic substrate for housing electronic components that is unbreakable even in a sealing process, and an electronic component mounting package using the same.SOLUTION: The ceramic substrate A for housing electronic components, comprises a bottom 3 of a substrate having a mounting face 1 for an electronic component 10 at the center of the top surface, and a bank 5 of the substrate that is integrally formed with the bottom 3 of the substrate and arranged so as to surround the mounting face 1 on the bottom 3 of the substrate, the bottom 3 and bank 5 being made of a sintered body of ceramic particles. The sintered bodies composing the bottom 3 and the bank 5, which have different porosity, respectively have porosity equal to or lower than 3%, and the bank 5 is higher in porosity than the bottom 3, which provides the ceramic substrate A for housing electronic components that is unbreakable even in a sealing process, and the electronic component mounting package using the same.
摘要翻译：要解决的问题：提供一种用于容纳即使在密封过程中也是不易破裂的电子部件的陶瓷基板，以及使用其的电子部件安装封装。解决方案：用于容纳电子部件的陶瓷基板A包括：基板具有在上表面的中心处的电子部件10的安装面1和与基板的底部3一体地形成并且布置成围绕底部的安装面1的基板的堤岸5 3，底部3和堤岸5由陶瓷颗粒的烧结体制成。构成具有不同孔隙率的底部3和堤岸5的烧结体分别具有等于或低于3％的孔隙，并且堤岸5的孔隙率高于底部3，其提供用于容纳电子的陶瓷基板A 即使在密封过程中也是不易破裂的部件，以及使用其的电子部件安装封装。

5. 发明专利

JP2011256058A Composite sintered compact of magnetic substance and dielectric substance, method for producing the same and electronic component using the same 审中-公开
标题翻译：磁性物质和电介质物质的复合烧结紧密度及其制造方法和使用该物质的电子元件
公开(公告)号：JP2011256058A
公开(公告)日：2011-12-22
申请号：JP2010130021
申请日：2010-06-07
申请人： Kyocera Corp , 京セラ株式会社
发明人： MATSUI TAKESHI , YAMAMOTO SENTARO
IPC分类号： C04B35/26 , H01F1/36 , H01F27/00 , H01F41/02 , H01G4/40
摘要： PROBLEM TO BE SOLVED: To provide a composite sintered compact of a magnetic substance containing an Li-Zn-Cu-Fe-O spinel type crystal and having high moisture resistance and a dielectric substance, a method for producing the same and an electronic component using the same.SOLUTION: In the composite sintered compact of the magnetic substance containing the Li-Zn-Cu-Fe-O spinel type crystal and a BaTiOcrystal involving Fe and the dielectric substance, the ratio I2/I1 of the peak intensity I2 of barium calcium silicate near 2θ=21.5° to the peak intensity I1 of the BaTiOcrystal near 2θ=31.7° is 0.06 or less in CuKα characteristic X-ray diffraction.
摘要翻译：解决问题的方法：提供含有Li-Zn-Cu-Fe-O尖晶石型晶体并具有高耐湿性的电介质的磁性物质的复合烧结体，其制造方法和电子元件使用相同。解决方案：在含有Li-Zn-Cu-Fe-O尖晶石型晶体的磁性物质和涉及Fe的BaTiO />结晶的复合烧结体中，在2θ= 31.7°附近的BaTiO 3 晶体的峰强度I1附近，2θ= 21.5°的钡硅酸钙的峰强度I2的比I2 / I1为0.06 或更低的CuKα特征X射线衍射。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2010109056A Compound sintered compact of magnetic body and dielectric, and lc composite electronic component using the same 有权
标题翻译：磁性体和电介质的化合物烧结和使用其的LC复合电子元件
公开(公告)号：JP2010109056A
公开(公告)日：2010-05-13
申请号：JP2008278120
申请日：2008-10-29
申请人： Kyocera Corp , 京セラ株式会社
发明人： MATSUI TAKESHI , YAMAMOTO SENTARO , TERASONO HIROBUMI
IPC分类号： H01F1/34 , C01G49/00 , C04B35/26 , H01F27/00 , H01G4/12 , H01G4/30 , H01G4/40 , H03H7/01
摘要： PROBLEM TO BE SOLVED: To provide a compound sintered compact of a magnetic body and a dielectric, which has a high relative permeability and a high relative dielectric constant at 100 MHz to 1 Hz, and to provide an LC composite electronic component using the same. SOLUTION: The compound sintered compact of the magnetic body and dielectric includes: as main crystal, a Y type hexagonal Ba ferrite containing 3.3 to 7.5 atom% Cu based on the total amount of Ba, Fe, Co, Zn, and Cu; and as other crystal, a Zn spinel type ferrite and SrTiC 3 containing 8.7 to 16.3 atom% Cu based on the total amount of Fe, Co, Zn, and Cu. The compound sintered compact of the magnetic body and dielectric is characterized in that the rate of the total amount of the Y type hexagonal Ba ferrite and Zn spinel type ferrite in the crystal of the compound sintered compact is 63 to 77, and also characterized by containing the Zn spinel type ferrite by 15 to 31 mass% and the SiTiO 3 by 10 to 17 mass%. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种磁性体和电介质的复合烧结体，其具有高的相对磁导率和100MHz至1Hz的高相对介电常数，并提供使用一样。解决方案：磁体和电介质的复合烧结体包括：作为主晶体，以Ba，Fe，Co，Zn和Cu的总量为基准，含有3.3〜7.5原子％的Cu的Y型六方晶系Ba铁氧体 ; 和作为其他晶体的Zn尖晶石型铁素体和含有基于Fe，Co，Zn和Cu总量的8.7至16.3原子％Cu的SrTiC 3 SB 3。磁体和电介质的复合烧结体的特征在于，复合烧结体的晶体中的Y型六方晶系Ba铁氧体和Zn尖晶石型铁氧体的总量的比例为63〜77， Zn尖晶石型铁素体为15〜31质量％，SiTiO 3 为10〜17质量％。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2010100511A Composite sintered compact of magnetic substance and dielectric substance, and lc composite electronic component 审中-公开
标题翻译：磁性物质和介质物质的复合烧结紧凑型和LC复合电子元件
公开(公告)号：JP2010100511A
公开(公告)日：2010-05-06
申请号：JP2009069356
申请日：2009-03-23
申请人： Kyocera Corp , 京セラ株式会社
发明人： TERASONO HIROBUMI , YAMAMOTO SENTARO , MATSUI TAKESHI , TAMI YASUHIDE
IPC分类号： C04B35/26 , C01G49/00 , H01B3/02 , H01B3/12 , H01G4/40
摘要： PROBLEM TO BE SOLVED: To provide a composite sintered compact of a magnetic substance and a dielectric substance which is sinterable even at a temperature of ≤1,000°C and can heighten the relative magnetic permeability and relative permittivity at 100 MHz, and also to provide an LC composite electronic component using the same. SOLUTION: The composite sintered compact of the magnetic substance and the dielectric substance comprises a Y type hexagonal Ba ferrite as a main crystal, M type hexagonal Ba ferrite, SrTiO 3 crystal and Bi-Fe-O crystal, in which the sum of the Y type hexagonal Ba ferrite and the M type hexagonal Ba ferrite is 73.4-76.8 mass% and that of SrTiO 3 crystal and Bi-Fe-O crystal is 22.3-26.2 mass% in the crystal of the composite sintered compact, and the Bi content in the composite sintered compact is 5.7-12.0 mass% in terms of Bi 2 O 3 . COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供即使在≤1,000℃的温度下也可烧结的磁性物质和电介质的复合烧结体，并且可以提高100MHz的相对导磁率和相对介电常数，并且还以提供使用其的LC复合电子部件。解决方案：磁性物质和介电物质的复合烧结体包括Y型六方晶系Ba铁氧体作为主晶体，M型六方晶系Ba铁氧体，SrTiO 3 晶体和Bi-Fe- Y型六方晶系Ba铁氧体和M型六方晶系Ba铁素体之和为73.4-76.8质量％，SrTiO 3 晶体和Bi-Fe-O晶体的总和为22.3- 复合烧结体的结晶中的26.2质量％，复合烧结体中的Bi含量以Bi 2 SB 3 O 3 / SB 3为5.7〜10.0质量％。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2008109052A Circuit board and manufacturing method thereof 审中-公开
标题翻译：电路板及其制造方法
公开(公告)号：JP2008109052A
公开(公告)日：2008-05-08
申请号：JP2006292861
申请日：2006-10-27
申请人： Kyocera Corp , 京セラ株式会社
发明人： YAMAMOTO SENTARO , YAMAMOTO KOJI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a circuit board capable of satisfying high dimensional accuracy even when a continuous kiln is used and a method for manufacturing the circuit board.
SOLUTION: In the circuit board, a substrate body is constituted by laminating a first ceramic insulating layer, a second ceramic insulating layer whose burning shrinkage starting temperature is higher than that of the first ceramic insulating layer and conductive layers, and has a rectangular main surface, a rectangular circuit formation part of which respective sides are parallel with respective sides of the main surface of the substrate body is formed on a center part observed from the rectangular main surface side of the substrate body, and on the surface of one of four areas on the main surface of the substrate body between respective sides of the circuit formation part and the sides of the substrate body which are opposed to respective sides of the circuit formation parts, a ceramic coat layer made of a ceramic material whose burning shrinkage starting time is lower than that of the second ceramic insulating layer is formed.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：即使使用连续窑也能够提供能够满足高尺寸精度的电路板和制造电路板的方法。解决方案：在电路板中，通过层叠第一陶瓷绝缘层，第二陶瓷绝缘层的烧结收缩起始温度高于第一陶瓷绝缘层和导电层的第二陶瓷绝缘层，并且具有矩形主表面，在从基板主体的矩形主表面侧观察的中心部分上形成有与基板主体的主表面的各侧平行的矩形电路形成部分，并且在一个表面上形成在电路形成部分的两侧与基板主体的与电路形成部分的各个侧面相对的两侧之间的基板主体表面上的四个区域，由陶瓷材料制成的陶瓷涂层，其燃烧收缩率起始时间低于形成第二陶瓷绝缘层的时间。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2013168426A Substrate for mounting light-emitting element and light-emitting device using the same 有权
标题翻译：用于安装发光元件和使用其的发光器件的基板
公开(公告)号：JP2013168426A
公开(公告)日：2013-08-29
申请号：JP2012029546
申请日：2012-02-14
申请人： Kyocera Corp , 京セラ株式会社
发明人： YAMAMOTO SENTARO , NISHIURA SOSUKE , OKAMOTO MASANORI , HASHIMOTO KAZUYA , INUYAMA SHIGETOSHI , YUBAZAKI ATSUSHI
IPC分类号： H01L33/60
摘要： PROBLEM TO BE SOLVED: To provide a substrate for mounting a light-emitting element, multiple substrates for mounting a light-emitting element and a manufacturing method of using the same, which can achieve cost reduction and high emission intensity even when a frame part has a silver film on an inner wall.SOLUTION: A substrate for mounting a light-emitting element comprises: a base part 3 having a mounting face 1 for a light-emitting element 21 at the central part; and a frame part 5 arranged on the base part 3 so as to enclose the mounting face 1. The frame part 5 includes a part 11a where a silver film is provided and a part 11b where a silver film is not provided, which are alternately arranged in a peripheral direction of an inner wall 9. The part 11a where the silver film is provided and the part 11b where a silver film is not provided have different porosities in sintered bodies such that the porosity in the sintered body of the part 11b where the silver film is not formed is higher than the porosity in the sintered body of the part 11a where the silver film is formed.
摘要翻译：要解决的问题：为了提供一种用于安装发光元件的基板，用于安装发光元件的多个基板及其制造方法，即使当框架部件具有可以实现成本降低和高发光强度时在内壁上的银膜。解决方案：用于安装发光元件的基板包括：基部3，其具有在中心部分处的发光元件21的安装面1; 以及框架部分5，其布置在基部3上以包围安装面1.框架部分5包括设置有银膜的部分11a和不设置银膜的部分11b，其交替布置在内壁9的周向上。设置银膜的部分11a和没有设置银膜的部分11b在烧结体中具有不同的孔隙率，使得部分11b的烧结体中的孔隙率不形成银膜比形成有银膜的部分11a的烧结体的孔隙率高。

10. 发明专利

JP2010228936A Magnetic sintered body, composite sintered body of magnetic body and dielectric body, method for manufacturing them and electronic components using them 审中-公开
标题翻译：磁性烧结体，磁性体和电介体的复合烧结体，使用它们制造它们的电子元件的方法
公开(公告)号：JP2010228936A
公开(公告)日：2010-10-14
申请号：JP2009075754
申请日：2009-03-26
申请人： Kyocera Corp , 京セラ株式会社
发明人： MATSUI TAKESHI , YAMAMOTO SENTARO
IPC分类号： C04B35/26 , H01B3/12 , H01F1/34 , H01F27/00
摘要： PROBLEM TO BE SOLVED: To provide a magnetic sintered body usable in GHz band region, a composite sintered body of a magnetic body and a dielectric body and a method for manufacturing them. SOLUTION: The magnetic sintered body has an Li-Zn-Cu-Fe-O spinel type crystal as a main crystal which is obtained by mixing hexagonal Ba ferrite powder and glass powder containing ≥5.0 mol% Li expressed in terms of Li 2 O and 17.0-24.1 mol% Si expressed in terms of SiO 2 and having 400-470°C softening point so as to contain 15-30 vol.% glass powder to the total of the hexagonal Ba ferrite powder and the glass powder, and molding the mixture. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供可用于GHz带区的磁性烧结体，磁体和电介质体的复合烧结体及其制造方法。解决方案：磁性烧结体具有Li-Zn-Cu-Fe-O尖晶石型晶体作为主晶体，其通过将六方晶系Ba铁氧体粉末和含有≥5.0mol％Li的玻璃粉末以Li表示 SiO 2和17.0-24.1摩尔％的Si，以SiO 2 SB表示，并且具有400-470℃软化点，以便含有15-30体积％的玻璃粉末与六角形Ba铁氧体粉末和玻璃粉末的总量，并将其混合。版权所有（C）2011，JPO＆INPIT

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