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1. 发明专利

JP2015046495A 発光素子搭載用基板および発光装置审中-公开
标题翻译：用于安装发光元件和发光装置的基板
公开(公告)号：JP2015046495A
公开(公告)日：2015-03-12
申请号：JP2013176893
申请日：2013-08-28
申请人：京セラ株式会社 , Kyocera Corp
发明人： ANURA MASANORI , IMUTA KAZUHITO
IPC分类号： H01L33/64 , H01S5/022
摘要：【課題】放熱性の向上等において有利な発光素子搭載用基板および発光装置を提供すること。【解決手段】発光素子4の搭載部1aaを含む上面を有する平板状の基部1aを含む絶縁基体1と、搭載部1aaに、この搭載部1aaの中央領域を挟んで互いに対向し合うように設けられた一対の電極パッド2と、搭載部1aa中央領域において、搭載部1aaから上方向に突出して設けられた凸状体3とを有する発光素子搭載用基板9等である。【選択図】図1
摘要翻译：要解决的问题：提供一种用于安装有利于提高散热性能等的发光元件的基板，并提供发光器件。解决方案：用于安装发光元件等的基板9包括：绝缘底座1包括具有包括发光元件4的安装部分1aa的上表面的平板形基座部分1a; 一对电极焊盘2，其设置在安装部分1aa上，以跨过安装部分1aa的中心区域彼此面对; 以及设置在从安装部1aa向上突出的安装部1aa的中心区域的突出体3。

2. 发明专利

JP2009175116A Tilt sensor device 审中-公开
标题翻译：倾斜传感器装置
公开(公告)号：JP2009175116A
公开(公告)日：2009-08-06
申请号：JP2008112051
申请日：2008-04-23
申请人： Kyocera Corp , 京セラ株式会社
发明人： IMUTA KAZUHITO , HIRAYAMA KOICHI
IPC分类号： G01C9/06 , G01C9/10
摘要： PROBLEM TO BE SOLVED: To provide an easily-miniaturizable tilt sensor device having high detection accuracy of tilt (inclination) or high long-term reliability.
SOLUTION: In this tilt sensor device 9, a plurality of coil-shaped conductors 2 enclosing a space 1 are arrayed in the longitudinal direction on the outside of the columnar space 1, and a high-permeability body block 3, movable between the plurality of coil-shaped conductors 2, is arranged inside corresponding to tilt of the space 1. Each inductance of the arrayed coil-shaped conductors 2 is changed successively by the high-permeability body block 3 moving corresponding to the tilt of the space 1, and the tilt of the space 1 can be readily detected by the inductance change. In addition, since the coil-shaped conductors 2 are not in direct contact with the high-permeability body block 3, abrasion of the coil-shaped conductors 2 is suppressed and long-term reliability is enhanced.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供具有高倾斜（倾斜）检测精度或高长期可靠性的易于小型化的倾斜传感器装置。解决方案：在该倾斜传感器装置9中，包围空间1的多个线圈状导体2在柱状空间1的外侧沿长度方向排列，高导磁体块3可在多个线圈状导体2配置在与空间1的倾斜对应的内侧。排列的线圈状导体2的各个电感通过与空间1的倾斜相对应的高磁导率体块3相继变化，并且可以容易地通过电感变化来检测空间1的倾斜。此外，由于线圈状导体2不与高磁导体体块3直接接触，因此能够抑制线圈状导体2的磨损，提高长期可靠性。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2007096246A Wiring substrate and electronic device using the same 审中-公开
标题翻译：接线基板和使用该基板的电子设备
公开(公告)号：JP2007096246A
公开(公告)日：2007-04-12
申请号：JP2005370991
申请日：2005-12-22
申请人： Kyocera Corp , 京セラ株式会社
发明人： MIYAWAKI TADASHI , IMUTA KAZUHITO
IPC分类号： H01L23/12 , H05K1/11 , H05K3/46
CPC分类号： H01L2224/16225 , H01L2924/15174
摘要： PROBLEM TO BE SOLVED: To provide a wiring substrate that suppresses the affection of noise over and from electrode pads formed on one principal plane of an insulated substrate through electrode pads formed on the other principal plane, hardly causes voltage drop of signals, and is excellent in transmission characteristics of the signals. SOLUTION: The system is provided with: the insulated substrate 2; a plurality of first electrode pads 3 disposed on one principal plane of the insulated substrate 2; a plurality of second electrode pads 4 that correspond to a plurality of the first electrode pads 3, and are disposed on the other principal plane of the insulated substrate 2 so as to allow a clearance to be bigger than at least the clearances of the adjacent first electrode pads 3; and a plurality of conductors 6 that electrically connect a plurality of the first electrode pads 3 and a plurality of the second electrode pads 4. The conductors 6 that electrically connect at least the adjacent second electrode pads 4 to the first electrode pads 3 corresponding thereto have different inclination angles at least partially. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：为了提供一种布线基板，其通过形成在另一个主平面上的电极焊盘抑制形成在绝缘基板的一个主平面上的电极焊盘的噪声的影响，几乎不引起信号的电压降，并且信号的传输特性优异。解决方案：系统设有：绝缘基板2; 设置在绝缘基板2的一个主面上的多个第一电极焊盘3; 多个第二电极焊盘4，其对应于多个第一电极焊盘3，并且设置在绝缘基板2的另一个主面上，以便允许间隙大于至少相邻的第一电极焊盘3的间隙电极焊盘3; 以及多个电连接多个第一电极焊盘3和多个第二电极焊盘4的导体6.将至少相邻的第二电极焊盘4电连接到与其对应的第一电极焊盘3的导体6具有至少部分地具有不同的倾斜角度。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2006237300A Wiring board 有权
标题翻译：接线板
公开(公告)号：JP2006237300A
公开(公告)日：2006-09-07
申请号：JP2005050192
申请日：2005-02-25
申请人： Kyocera Corp , 京セラ株式会社
发明人： YAGIMURA KENJI , IMUTA KAZUHITO
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a wiring board in which thickness of a signal line that is formed in the same layer as ground wiring and transmits a high frequency signal is made thin even if ground wiring is made thick since inductance is low and grounding property of low resistance is given, and which is more superior in a high frequency characteristic and has a firm grounding property. SOLUTION: In the wiring board 9, ground wiring 3 and the signal line 2 thinner than ground wiring 3 are arranged in a parallel between insulating layers 1a inside an insulating substrate 1 where a plurality of insulting layers 1a are laminated. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种布线基板，其中即使由于电感低而使得接地布线变厚，其中形成在与接地布线相同的层中并且传输高频信号的信号线的厚度变薄给出了低电阻的接地特性，在高频特性方面更加优越，具有坚固的接地性能。解决方案：在布线板9中，接地布线3和比接地布线3薄的信号线2平行布置在层叠有多个绝缘层1a的绝缘基板1内的绝缘层1a之间。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2006128264A Wiring board and method for manufacturing electronic device 审中-公开
标题翻译：接线板及制造电子器件的方法
公开(公告)号：JP2006128264A
公开(公告)日：2006-05-18
申请号：JP2004312158
申请日：2004-10-27
申请人： Kyocera Corp , 京セラ株式会社
发明人： HIRAYAMA KOICHI , IMUTA KAZUHITO
IPC分类号： H01L23/02
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a wiring board, wherein high heat hardly affects an electronic component and faulty operation can be effectively prevented, when the mounted electronic component is packaged, and to provide a method for manufacturing electronic components. SOLUTION: The wiring board 9 is provided with an insulating substrate 1, having the mounting part 1a of an electronic component 7 on its upper surface, a wiring conductor 2 led to the side surface or the lower surface of the insulating substrate 1 from the mounting part 1a of the insulating substrate 1, a band-like conductor 3 which is formed so as to surround the mounting part 1a on the upper surface of the insulating substrate 1 and joint a metallic cover 5, and a linear conductor 4 which is formed along the band-like 3 on the inside of the insulating substrate 1. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种布线板，其中高热量几乎不影响电子部件，并且当安装的电子部件被封装时，可以有效地防止故障操作，并且提供一种用于制造电子部件的方法。解决方案：布线板9设置有绝缘基板1，其上表面具有电子部件7的安装部分1a，引导到绝缘基板1的侧表面或下表面的布线导体2 从绝缘基板1的安装部分1a，形成为围绕绝缘基板1的上表面上的安装部分1a并且接合金属盖5的带状导体3和直线导体4，沿绝缘基板1的内侧的带状3形成。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2005159129A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2005159129A
公开(公告)日：2005-06-16
申请号：JP2003397236
申请日：2003-11-27
申请人： Kyocera Corp , 京セラ株式会社
发明人： IMUTA KAZUHITO
IPC分类号： H01L23/12
CPC分类号： H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a small-sized semiconductor device whose outer shape has the same size with an outer shape of a semiconductor element.
SOLUTION: The semiconductor device is provided with the plate-shaped semiconductor element 1 wherein an electrode 1a is formed on the outer peripheral part of one main surface; a first insulating layer 3a which is laminated on the central part of the one main surface of the semiconductor element 1, and in which a connection pad 4 is formed on the outer peripheral part; a second insulating layer 3b which is laminated on a central part of the first insulating layer, and in which an external connection pad 5 is formed on the surface; a bonding wire 7 which connects electrically the electrode 1a and the connection pad 4; and resin 8 for sealing which covers the one main surface exposing the surface on which the external connection pad 5 of the second insulating layer 3b was formed.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供外形与半导体元件的外形相同尺寸的小尺寸半导体器件。解决方案：半导体器件设置有板状半导体元件1，其中电极1a形成在一个主表面的外周部分上; 层叠在半导体元件1的一个主面的中央部的第一绝缘层3a，在外周部形成有连接焊盘4，第二绝缘层3b层压在第一绝缘层的中心部分上，其中在表面上形成有外部连接焊盘5; 将电极1a和连接焊盘4电连接的接合线7; 以及用于密封的树脂8，其覆盖形成有第二绝缘层3b的外部连接焊盘5的表面的一个主表面。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2011171696A Electronic device and method of manufacturing the same 审中-公开
标题翻译：电子设备及其制造方法
公开(公告)号：JP2011171696A
公开(公告)日：2011-09-01
申请号：JP2010187271
申请日：2010-08-24
申请人： Kyocera Corp , 京セラ株式会社
发明人： IMUTA KAZUHITO
IPC分类号： H01L23/02
CPC分类号： H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To provide an electronic device that is easily reduced height, and a method of manufacturing the same. SOLUTION: An electronic device includes an insulating substrate 1 that has a recess 2 for accommodating an electronic component 4 at the upper face and a wiring conductor 3 disposed from the bottom face of the recess 2 to the outer surface and the electronic component 4 that has an electrode 6 on one principal plane of the plate-like body 5 and is accommodated in the recess 2 with one principal plane facing downward and the electrode 6 electrically connected with the wiring conductor 3. Part of an inner side face of the recessed portion 2 in the height direction hangs over so as to surround the side face of the electronic component 4. The tip of the hanged-over portion 1a is joined all over the circumference of the side face of the electronic component 4 to hermetically seal the electrode 6. Since the electrode 6 is hermetically sealed by the joint of the hanged-over portion 1a to the electronic component 4, the recess 2 can be made shallow, no cover is required, and a low height can easily be achieved. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种易于降低高度的电子设备及其制造方法。解决方案：电子设备包括绝缘基板1，其具有用于容纳上表面的电子部件4的凹部2和从凹部2的底面到外表面配置的布线导体3，电子部件 4，其在板状体5的一个主平面上具有电极6，并且容纳在凹部2中，一个主面朝下，电极6与布线导体3电连接。凹部2在高度方向上悬挂以包围电子部件4的侧面。悬挂部分1a的末端在电子部件4的侧面的整个圆周上接合，以气密地密封由于电极6被悬挂部1a与电子部件4的接合部气密地密封，所以能够使凹部2变浅，不需要盖体，低高度ca 很容易实现。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2009264809A Acceleration sensor device 审中-公开
标题翻译：加速传感器装置
公开(公告)号：JP2009264809A
公开(公告)日：2009-11-12
申请号：JP2008112052
申请日：2008-04-23
申请人： Kyocera Corp , 京セラ株式会社
发明人： IMUTA KAZUHITO , HIRAYAMA KOICHI
IPC分类号： G01P15/11
摘要： PROBLEM TO BE SOLVED: To provide an acceleration sensor device which has a simple structure, is easy to manufacture and has high reliability and accuracy in detection of acceleration. SOLUTION: The acceleration sensor device has a plurality of coiled conductors 2 which are arranged in the length direction outside a columnar space 1 and surround the space 1, respectively, elastic members 4 which are disposed respectively from the opposite ends of the space 1 toward the central part and a high permeability material block 3 which is held between the elastic members 4 in the space 1. The high permeability material block 3 comes to a standstill at a position where the inertial force according to acceleration and a stress working from the elastic member 4 are in balance, and changes the inductance of the coiled conductor 2. By measuring beforehand the stress associated with a change in the shape of the elastic member 4, therefore, the acceleration can be easily detected by calculation based on the position of the high permeability material block 3 and the mass of the block 3. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决问题：提供一种结构简单，易于制造，加速度检测的可靠性和精度高的加速度传感器装置。解决方案：加速度传感器装置具有多个螺旋导体2，它们分别沿圆柱形空间1的长度方向布置并围绕空间1，分别从空间的相对端分别设置的弹性构件4 1，并且保持在空间1中的弹性构件4之间的高磁导率材料块3.高导磁性材料块3在根据加速度和应力作用的惯性力的位置处停止弹性构件4平衡，并且改变线圈导体2的电感。通过预先测量与弹性构件4的形状变化相关联的应力，因此可以通过基于位置的计算容易地检测加速度的高磁导率材料块3和块3的质量。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2009030982A Fine powder sensor device 审中-公开
标题翻译：精细粉末传感器设备
公开(公告)号：JP2009030982A
公开(公告)日：2009-02-12
申请号：JP2007192002
申请日：2007-07-24
申请人： Kyocera Corp , 京セラ株式会社
发明人： HIRAYAMA KOICHI , IMUTA KAZUHITO
IPC分类号： G01N21/05 , G01N21/53 , G01N21/59
摘要： PROBLEM TO BE SOLVED: To provide a fine powder sensor device in which a fine powder remains hardly in a flow channel.
SOLUTION: In the fine powder sensor device 9 constituted so that a flow channel 2, through which gas moves, is formed in a substrate 1 to be irradiated with light from the light emitting element 3 attached to the substrate 1 and the reflected light or transmitted light from the flow channel 2 is measured by the light receiving element 4 attached to the substrate 1 to detect the fine powder contained in the gas, the flow channel 2 is formed in the substrate 1 so as to pierce through the substrate 1 in up and down directions while a heating element 61 or a cooling member 62 is arranged in the substrate 1 so as to surround the flow channel 2, and the light emitting element 3 and the light receiving element 4 are arranged so that the surfaces of both of a light emitting part and a light receiving part smoothly continue to the inner surface of the flow channel 2. The gas flows in an upper or lower direction (the length direction of the flow channel 2) by heating or cooling the gas and, since the inner unevenness of the flow channel 2 is suppressed, the fine powder remains hardly in the flow channel 2.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种精细粉末传感器装置，其中细粉末几乎不保留在流动通道中。解决方案：在精细粉末传感器装置9中，构成为使得气体移动的流路2形成在基板1中，以照射来自安装在基板1上的发光元件3的光和被反射的通过安装在基板1上的受光元件4测量来自流路2的光或透射光，以检测气体中所含的细粉末，在基板1上形成流路2，从而穿过基板1 沿着上下方向，同时在基板1上配置加热元件61或冷却部件62以围绕流动通道2，并且发光元件3和光接收元件4被布置成使得两者的表面发光部分和光接收部分平滑地延续到流动通道2的内表面。气体通过加热或冷却气体沿上下方向（流动通道2的长度方向）流动，并且s 因此抑制了流路2的内部不均匀，细粉在流路2中几乎不存在。版权所有（C）2009，JPO＆INPIT

10. 发明专利

JP2009002833A Acceleration sensor device 审中-公开
标题翻译：加速传感器装置
公开(公告)号：JP2009002833A
公开(公告)日：2009-01-08
申请号：JP2007164924
申请日：2007-06-22
申请人： Kyocera Corp , 京セラ株式会社
发明人： HIRAYAMA KOICHI , IMUTA KAZUHITO
IPC分类号： G01P15/125
摘要： PROBLEM TO BE SOLVED: To provide an acceleration sensor device having a simple structure, easily manufactured, with high reliability and accuracy for sensing acceleration.
SOLUTION: The acceleration sensor device 9 comprises: a capacitance electrode 2 in which a plurality of electrodes 2a, 2b are arrayed in a row and vertically face each other through a space 1; elastic members 4 disposed from both ends toward the center in the space 1; and a dielectric block 3 accommodated between the elastic members 4 in the space 1. Since the dielectric block 3 rests in a position in which an inertial force corresponding to the acceleration and a stress due to an action from the elastic members 4 are balanced and an electrostatic capacitance is varied between the capacitance electrode 2(2a, 2b), the acceleration can be easily calculated and sensed by previously measuring the stress due to a deformation of the elastic members 4 based on the position and the mass of the dielectric block 3.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有简单结构的加速度传感器装置，容易制造，具有高可靠性和精确度的感测加速度。解决方案：加速度传感器装置9包括：电容电极2，其中多个电极2a，2b排成一行并且通过空间1彼此垂直相对; 弹性构件4从两端朝向空间1中的中心设置; 以及容纳在空间1中的弹性构件4之间的介质块3.由于介质块3停留在与弹性构件4的作用下的加速度和应力相对应的惯性力平衡的位置，静电电容在电容电极2（2a，2b）之间变化，通过预先测量基于介质块3的位置和质量的弹性构件4的变形引起的应力，可以容易地计算和检测加速度。版权所有（C）2009，JPO＆INPIT

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