专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2004331783A Flame-retardant adhesive composition, flexible copper-clad laminate, cover lay and adhesive film 有权
标题翻译：阻燃粘合剂组合物，柔性铜箔层压板，覆盖层和胶粘膜
公开(公告)号：JP2004331783A
公开(公告)日：2004-11-25
申请号：JP2003128622
申请日：2003-05-07
申请人： Kyocera Chemical Corp , Otsuka Chemical Co Ltd , 京セラケミカル株式会社 , 大塚化学株式会社
发明人： INMAKI NORIKO , OGAWA KATSURA , TADA YUJI
IPC分类号： B32B15/088 , B32B15/08 , C09J7/02 , C09J121/00 , C09J163/02 , C09J171/10 , H05K1/02 , H05K3/00 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To obtain an adhesive composition which is halogen-free and has excellent heat resistance, folding resistance, electrical insulating properties and exhibits excellent handleability, etc., in a state of cover lay and adhesive film.
SOLUTION: The halogen-free flame-retardant adhesive composition comprises (A) an epoxy resin obtained by glycidylating a polyfunctional resin containing a biphenyl and phenol skeleton represented by the formula, (B) a curing agent, (C) a curing promoter, (D) synthetic rubber, (E) a phenoxy resin having 5,000-100,000 weight-average molecular weight, (F) a phosphazene compound and (G) an inorganic filler as essential components in which the phenoxy resin has a biphenyl skeleton or a bisphenol F skeleton. The composition is useful for an FPC (flexible printed circuit board), the copper-clad laminate for an FPC, the cover lay and the adhesive film.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：在覆盖层和粘合膜的状态下获得无卤素且具有优异的耐热性，耐折叠性，电绝缘性和显示出优异的可操作性等的粘合剂组合物。解决方案：无卤阻燃粘合剂组合物包含（A）通过缩水甘油化由式（B）表示的联苯和苯酚骨架的多官能树脂获得的环氧树脂，（B）固化剂，（C）固化促进剂，（D）合成橡胶，（E）具有5,000-100,000重均分子量的苯氧基树脂，（F）磷腈化合物和（G）无机填料作为必需组分，其中苯氧基树脂具有联苯骨架或双酚F骨架。该组合物可用于FPC（柔性印刷电路板），用于FPC的覆铜层压板，覆盖层和粘合剂膜。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2014111694A Thin film adhesive sheet and method for producing the same 有权
标题翻译：薄膜胶粘片及其制造方法
公开(公告)号：JP2014111694A
公开(公告)日：2014-06-19
申请号：JP2012266545
申请日：2012-12-05
申请人： Kyocera Chemical Corp , 京セラケミカル株式会社
发明人： SAWAI MARINA , KAZAMA SHINICHI , INMAKI NORIKO
IPC分类号： C08G59/40 , C09J7/02 , C09J11/06 , C09J163/00
摘要： PROBLEM TO BE SOLVED: To provide a thin film adhesive sheet which is suitable for the production of a thinned electronic apparatus and has low temperature curability.SOLUTION: There is provided a thin film adhesive sheet which comprises, as essential components: an epoxy resin (A); a dicyandiamide (B) as a curing agent; an urea derivative (C) having a structure represented by the following general formula (1) as a curing accelerator: (wherein, Rrepresents an aromatic hydrocarbon group having 6 to 24 carbon atoms or an alicyclic hydrocarbon group having 5 to 24 carbon atoms; Rand Reach independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 4 carbon atoms or a divalent aliphatic hydrocarbon group having 4 or 5 carbon atoms formed by mutual bonding of Rand R; n is an integer of 1 to 3.) and is formed to have a thickness of 30 μm or less.
摘要翻译：要解决的问题：提供一种适用于生产薄型电子设备并具有低温固化性的薄膜粘合片。解决方案：提供一种薄膜粘合片，其包括作为必要组分的环氧树脂（一个）; 双氰胺（B）作为固化剂; 具有由以下通式（1）表示的结构的脲衍生物（C）作为固化促进剂：（其中，R表示碳原子数为6〜24的芳香族烃基或碳原子数为5〜24的脂环式烃基;兰独立地表示氢原子，具有1至4个碳原子的脂族烃基或通过兰德R相互键合形成的具有4或5个碳原子的二价脂族烃基; n是1至3的整数）并形成厚度为30μm以下。

3. 发明专利

JP2007081151A Flexible wiring board 审中-公开
标题翻译：柔性布线板
公开(公告)号：JP2007081151A
公开(公告)日：2007-03-29
申请号：JP2005267338
申请日：2005-09-14
申请人： Kyocera Chemical Corp , 京セラケミカル株式会社
发明人： INMAKI NORIKO , NAKAMI HIROAKI
IPC分类号： H05K3/38
摘要： PROBLEM TO BE SOLVED: To provide a flexible wiring board that uses a fire retardant adhesive halogen-free composition which has sufficient flex life even at a high temperature, and generates no toxic gas such as hydrogen bromide in combustion with good fire retardancy.
SOLUTION: The flexible wiring board is made from a fire retardant adhesive halogen free composition that contains (A) an epoxy resin which is glycidyl compound of polyfunctional resin containing phenol frame and biphenyl frame represented by a general formula (n represents integer of 1-10), (B) curing agent for epoxy, (C) curing accelerator for epoxy, (D) elastomer, (E) at least one kind of cyclophosphasen compound, and (F) inorganic filler. The content of (D) is 5-50 mass% based on solid content of composition.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种柔性布线板，其使用即使在高温也具有足够的弯曲寿命的阻燃粘合剂无卤素组合物，并且在燃烧中不产生有毒气体，例如溴化氢，具有良好的阻燃性。解决方案：柔性布线板由阻燃粘合剂无卤素组合物制成，该组合物含有（A）环氧树脂，其为含有苯酚骨架的多官能树脂和由通式表示的联苯骨架的缩水甘油基化合物（n表示整数 1-10），（B）环氧固化剂，（C）环氧固化促进剂，（D）弹性体，（E）至少一种环磷化合物和（F）无机填料。（D）的含量基于组合物的固体含量为5-50质量％。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2004075748A Flame-retardant adhesive composition, flexible copper-clad laminae, cover lay, and adhesive film 审中-公开
公开(公告)号：JP2004075748A
公开(公告)日：2004-03-11
申请号：JP2002234901
申请日：2002-08-12
申请人： Kyocera Chemical Corp , 京セラケミカル株式会社
发明人： INMAKI NORIKO , OGAWA KATSURA
IPC分类号： B32B15/08 , B32B15/088 , C09J7/00 , C09J121/00 , C09J161/06 , C09J163/00 , C09J201/00 , H05K3/28 , H05K3/38
摘要： PROBLEM TO BE SOLVED: To provide an adhesive which is halogen-free and flame-retardant and gives a flexible copper-clad laminate, a cover lay, and an adhesive film excellent in heat resistance.
SOLUTION: The halogen-free flame-retardant adhesive composition essentially comprises (A) an epoxy resin, (B) a polyfunctional aralkylphenol resin having biphenyl skeletons and phenol skeletons represented by the structural formula, (C) a cure accelerator, (D) an elastomer (e.g. a carboxylated acrylonitrile-butadiene rubber), (E) a phosphazene compound (e.g. cyclophenoxyphosphazene), and (F) an inorganic filler, the amount of the elastomer (D) being 5-80wt% based on the total amount of the composition.
COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2006070198A Thermally curable adhesive sheet 审中-公开
标题翻译：热固性胶粘剂
公开(公告)号：JP2006070198A
公开(公告)日：2006-03-16
申请号：JP2004257011
申请日：2004-09-03
申请人： Kyocera Chemical Corp , 京セラケミカル株式会社
发明人： INMAKI NORIKO , TSUBAKI YUICHI , OGAWA KATSURA , KAZAMA SHINICHI
IPC分类号： C09J7/02 , C09J11/04 , C09J121/00 , C09J163/00 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide an adhesive sheet improved in handling properties, capable of preventing a falling resin powder from adhering thereto, and capable of producing a flexible printed-wiring board in a good yield.
SOLUTION: This thermally curable adhesive sheet is formed by impregnating a fiber base material with an adhesive composition, wherein a cured material of the adhesive composition has an elastic modulus of 500-7,000 MPa and a mass ratio of an elastomer to an inorganic filler [elastomer/inorganic filler] contained in the composition is not less than 0.1 and less than 4.05. It is preferable that the adhesive composition contains (A) an epoxy resin, (B) a curing agent for the epoxy resin, (C) a curing accelerator, (D) the elastomer, and (E) the inorganic filler as essential components.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种改善处理性能的粘合片，其能够防止树脂粉末粘附，并且能够以良好的产率制造柔性印刷电路板。解决方案：该热固性粘合片通过用粘合剂组合物浸渍纤维基材而形成，其中粘合剂组合物的固化材料具有500-7,000MPa的弹性模量和弹性体与无机材料的质量比包含在组合物中的填料[弹性体/无机填料]不小于0.1且小于4.05。粘合剂组合物优选含有（A）环氧树脂，（B）环氧树脂用固化剂，（C）固化促进剂，（D）弹性体，（E）无机填料作为必要成分。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2005347701A Manufacturing method of multilayer printed circuit board 审中-公开
标题翻译：多层印刷电路板的制造方法
公开(公告)号：JP2005347701A
公开(公告)日：2005-12-15
申请号：JP2004168813
申请日：2004-06-07
申请人： Kyocera Chemical Corp , 京セラケミカル株式会社
发明人： KUROKAWA TOKUO , MAEZAWA HIDEKI , INMAKI NORIKO
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a buildup type multilayer printed circuit board by which a roughening process of a resin surface is omitted, and disconnection at pattern forming in thinning of 30 μm or less, and an increase in a transmission loss by a roughened surface involved in making a frequency higher are suppressed, in manufacturing the printed circuit board.
SOLUTION: In the manufacturing method of the buildup type multilayer printed circuit board by alternately combining inside layer circuit boards and adhesive sheets and then by hot forming, the adhesive sheets are bonded with the inside layer circuit boards, the sheets are perforated, then electroless depositing treatment is applied, after which the adhesive sheets are thoroughly cured by thermoforming.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种累积型多层印刷电路板的制造方法，其中省略了树脂表面的粗糙化处理，并且在30μm或更小的变薄的图案形成中断开，并且增加了在制造印刷电路板时，抑制了涉及使频率更高的粗糙表面的传输损耗被抑制。解决方案：在积层型多层印刷电路板的制造方法中，通过交替组合内层电路板和粘合片，然后通过热成型，粘合片与内层电路板接合，片材穿孔，然后进行无电沉积处理，然后通过热成型彻底固化粘合片。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2014133811A Double-sided adhesive sheet 有权
标题翻译：双面粘合片
公开(公告)号：JP2014133811A
公开(公告)日：2014-07-24
申请号：JP2013002482
申请日：2013-01-10
申请人： Kyocera Chemical Corp , 京セラケミカル株式会社
发明人： KURA YUTO , KAZAMA SHINICHI , FUJIURA HIROSHI , INMAKI NORIKO
IPC分类号： C09J7/02 , C09J11/04 , C09J201/00
摘要： PROBLEM TO BE SOLVED: To provide a double-sided adhesive sheet good in appearance of an adhesive layer and capable of preventing warpage during adhesion.SOLUTION: A double-sided adhesive sheet has a base material, a first adhesive layer containing a thermosetting resin composition arranged on one main face of the base material, and a second adhesive layer containing the thermosetting resin composition arranged on another main face of the base material. The thickness of the double-sided adhesive sheet is 500 μm or less. The thickness of the first adhesive layer is 2 to 10 times as thick as that of the second adhesive layer. The thermosetting resin composition constituting the first adhesive layer contains an inorganic filler having a mass average particle diameter of 5 to 30 μm of 50 to 80 mass%. The thermosetting resin composition constituting the second adhesive layer contains an inorganic filler having the mass average particle diameter of less than 5 μm of 15 to 30 mass%.
摘要翻译：要解决的问题：提供粘合剂层的外观良好的双面粘合片，并且能够防止粘合期间的翘曲。解决方案：双面粘合片具有基材，含有热固性树脂组合物的第一粘合层布置在所述基材的一个主面上，以及第二粘合剂层，其包含设置在所述基材的另一主面上的所述热固性树脂组合物。双面粘合片的厚度为500μm以下。第一粘合剂层的厚度为第二粘合剂层的厚度的2至10倍。构成第一粘合层的热固性树脂组合物含有质量平均粒径为5〜30μm的无机填料为50〜80质量％。构成第二粘合层的热固性树脂组合物含有质量平均粒径小于5μm的无机填料为15〜30质量％。

8. 发明专利

JP2014096429A Method of manufacturing laminated core 有权
标题翻译：制造层压芯的方法
公开(公告)号：JP2014096429A
公开(公告)日：2014-05-22
申请号：JP2012246113
申请日：2012-11-08
申请人： Kyocera Chemical Corp , 京セラケミカル株式会社
发明人： KAZAMA SHINICHI , INMAKI NORIKO , OKAZAKI FUMIAKI
IPC分类号： H01F41/02 , H02K15/02
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated core exhibiting excellent characteristics by enhancing the film thickness accuracy of an adhesive layer, and having excellent appearance by suppressing extrusion of an adhesive layer from the inner and outer peripheries of a magnetic steel sheet.SOLUTION: A method of manufacturing a laminated core 10 includes a molding step and a bonding step. In the molding step, a magnetic steel sheet 11 having an adhesive layer 12 on one principal surface is punched into a predetermined shape. In the bonding step, a plurality of the magnetic steel sheets are superposed, and then hot pressed entirely thus bonding the magnetic steel sheets by means of an adhesive layer. The adhesive layer is composed of a thermosetting resin composition containing (A) an epoxy resin, (B) a hardener for epoxy resin, and (C) a synthetic rubber, in which the (C) rubber component is contained 40 mass% or more in the solid content. After the bonding step, the amount of protrusion L of the adhesive layer from the outer periphery and inner periphery of the magnetic steel sheet is -10 through 10 μm.
摘要翻译：要解决的问题：提供一种通过提高粘合剂层的膜厚精度来提供具有优异特性的层压芯的方法，并且通过抑制粘合剂层从电磁钢板的内周和外周的挤出而具有优异的外观解决方案：层压芯10的制造方法包括成型工序和接合工序。在成形步骤中，将在一个主表面上具有粘合剂层12的电磁钢板11冲压成预定形状。在接合步骤中，将多个电磁钢板叠加，然后全部热压，借助于粘合剂层粘合电磁钢板。粘合剂层由（A）环氧树脂，（B）环氧树脂用固化剂和（C）合成橡胶构成，其中，（C）橡胶成分含有40质量％以上在固体含量。在粘合步骤之后，粘合层从电磁钢板的外周和内周的突出量L为-10〜10μm。

9. 发明专利

JP2010087013A Method for manufacturing inter-layer insulating sheet, built-up multilayer substrate, and circuit board 审中-公开
标题翻译：制造层间绝缘片，内置多层基板和电路板的方法
公开(公告)号：JP2010087013A
公开(公告)日：2010-04-15
申请号：JP2008251232
申请日：2008-09-29
申请人： Kyocera Chemical Corp , 京セラケミカル株式会社
发明人： TANO MASARU , UCHIDA KAZUMICHI , INMAKI NORIKO
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide an inter-layer insulating sheet for a built-up multilayer substrate that provides fine processability in a B stage, a built-up multilayer substrate using the inter-layer insulating sheet, and a method for manufacturing the insulating sheet and the multilayer substrate.
SOLUTION: According to the inter-layer insulating sheet for the built-up multilayer substrate, the built-up multilayer substrate using the inter-layer insulating sheet, and the method for manufacturing the insulating sheet and the multilayer substrate, a thermocuring resin composition includes essential elements of (A) an epoxy resin, (B) an epoxy resin curing agent, (C) a curing accelerator, (D) a polymeric epoxy resin and/or a phenoxy resin having a molecular weight of 10,000 or more, and (E) an inorganic filler. The epoxy resin (A) and/or the epoxy resin curing agent (B) contain a biphenyl skeleton and/or a naphthalene skeleton and also contains a liquid epoxy resin and/or a liquid curing agent for an epoxy resin of 1.5 to 25 wt.%.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种用于在B阶段提供精细加工性能的叠层多层基板的层间绝缘片，使用层间绝缘片的积层多层基板，以及用于制造绝缘片和多层基片。＆lt; P＆gt;解决方案：根据构成多层基板的层间绝缘片，使用层间绝缘片的积层多层基板，以及绝缘片和多层基板的制造方法，树脂组合物包含（A）环氧树脂，（B）环氧树脂固化剂，（C）固化促进剂，（D）分子量为10,000以上的聚合物环氧树脂和/或苯氧基树脂的基本要素，（E）无机填料。环氧树脂（A）和/或环氧树脂固化剂（B）含有联苯骨架和/或萘骨架，还含有液体环氧树脂和/或环氧树脂的液体固化剂为1.5〜25重量％％。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2008297429A Adhesive composition, adhesive sheet and copper foil with adhesive agent 审中-公开
标题翻译：粘合剂，胶粘剂和醋酸胶粘剂
公开(公告)号：JP2008297429A
公开(公告)日：2008-12-11
申请号：JP2007144872
申请日：2007-05-31
申请人： Kyocera Chemical Corp , 京セラケミカル株式会社
发明人： INMAKI NORIKO , MATSUMOTO RYOICHI , FUKUKAWA HIROSHI , MAEZAWA HIDEKI
IPC分类号： C09J163/00 , C09J7/02 , H01L23/36
摘要： PROBLEM TO BE SOLVED: To provide: an adhesive composition whose cured material exhibits a high thermal conductivity, and to provide an adhesive sheet and a copper foil with an adhesive agent.
SOLUTION: The adhesive composition contains, as essential components, a biphenyl-type epoxy resin having a specified structure (A), a curing agent for the epoxy resin (B), a cure-accelerating agent (C), an elastomer (D), and an inorganic filling agent (E). In the adhesive composition, the elastomer (D) is contained in a ratio of 3-50 mass% in the total amount of the composition, the inorganic filling agent (E) is contained in a ratio of 15-85 mass% in the total amount of the composition, the inorganic filling agent (E) contains aggregated particulate boron nitride in an amount of 20-70 mass% therein, and the total amount of the components (A), (B), (C) and (D) is 100 mass%. The adhesive sheet and the copper foil with the adhesive agent are obtained by using the adhesive composition.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：待解决的问题：提供：固化材料具有高导热性的粘合剂组合物，以及提供具有粘合剂的粘合片和铜箔。解决方案：粘合剂组合物含有具有特定结构（A）的联苯型环氧树脂，环氧树脂（B）的固化剂，固化促进剂（C），弹性体（D）和无机填充剂（E）。在粘合剂组合物中，弹性体（D）的含量相对于组合物的总量为3〜50质量％，无机填充剂（E）的含量比例为15〜85质量％无机填充剂（E）含有其中20-70质量％的凝集颗粒状氮化硼，组分（A），（B），（C）和（D）的总量，为100质量％。通过使用粘合剂组合物获得粘合片和具有粘合剂的铜箔。版权所有（C）2009，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式