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    • 1. 发明专利
    • Thin film adhesive sheet and method for producing the same
    • 薄膜胶粘片及其制造方法
    • JP2014111694A
    • 2014-06-19
    • JP2012266545
    • 2012-12-05
    • Kyocera Chemical Corp京セラケミカル株式会社
    • SAWAI MARINAKAZAMA SHINICHIINMAKI NORIKO
    • C08G59/40C09J7/02C09J11/06C09J163/00
    • PROBLEM TO BE SOLVED: To provide a thin film adhesive sheet which is suitable for the production of a thinned electronic apparatus and has low temperature curability.SOLUTION: There is provided a thin film adhesive sheet which comprises, as essential components: an epoxy resin (A); a dicyandiamide (B) as a curing agent; an urea derivative (C) having a structure represented by the following general formula (1) as a curing accelerator: (wherein, Rrepresents an aromatic hydrocarbon group having 6 to 24 carbon atoms or an alicyclic hydrocarbon group having 5 to 24 carbon atoms; Rand Reach independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 4 carbon atoms or a divalent aliphatic hydrocarbon group having 4 or 5 carbon atoms formed by mutual bonding of Rand R; n is an integer of 1 to 3.) and is formed to have a thickness of 30 μm or less.
    • 要解决的问题:提供一种适用于生产薄型电子设备并具有低温固化性的薄膜粘合片。解决方案:提供一种薄膜粘合片,其包括作为必要组分的环氧树脂( 一个); 双氰胺(B)作为固化剂; 具有由以下通式(1)表示的结构的脲衍生物(C)作为固化促进剂:(其中,R表示碳原子数为6〜24的芳香族烃基或碳原子数为5〜24的脂环式烃基;兰 独立地表示氢原子,具有1至4个碳原子的脂族烃基或通过兰德R相互键合形成的具有4或5个碳原子的二价脂族烃基; n是1至3的整数)并形成 厚度为30μm以下。