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1. 发明专利

JP2012204828A Heating apparatus 有权
标题翻译：加热装置
公开(公告)号：JP2012204828A
公开(公告)日：2012-10-22
申请号：JP2011071246
申请日：2011-03-28
申请人： Komatsu Ltd , 株式会社小松製作所
发明人： AKIBA HIRONAGA , KUBOTA KAZUHIKO , HATANAKA TSUTOMU
IPC分类号： H01L21/027 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a heating apparatus which can decrease occurrence of substrate warp even when a substrate is thinned a great deal to accelerate a temperature change.SOLUTION: A heating apparatus comprises: a base plate 2; and a faceplate arranged above the base plate 2, on which a wafer is placed. The faceplate comprises: an aluminum substrate; and a film heater provided on the aluminum substrate for heating the wafer. At an outer periphery of the film heater, terminals 33 for power feeding connected to a terminal block 9 are provided. The terminal 33 is formed in a channel shape having bent parts 33A and 33B provided along a longer direction of the terminal block. The terminal block 9 is attached to an undersurface of the base plate 2.
摘要翻译：要解决的问题：提供一种加热装置，即使当基板变薄而加速温度变化时，也可以减少基板翘曲的发生。解决方案：加热装置包括：底板2; 以及布置在基板2上方的面板，其上放置有晶片。面板包括：铝基板; 以及设置在铝基板上用于加热晶片的薄膜加热器。在薄膜加热器的外周设置有用于连接到端子块9的用于供电的端子33。端子33形成为具有沿端子台的长度方向设置的弯曲部33A，33B的通道形状。接线端子9安装在基板2的下表面上。版权所有：（C）2013，JPO＆INPIT

2. 发明专利

JP2012204827A Heating apparatus 有权
标题翻译：加热装置
公开(公告)号：JP2012204827A
公开(公告)日：2012-10-22
申请号：JP2011071245
申请日：2011-03-28
申请人： Komatsu Ltd , 株式会社小松製作所
发明人： AKIBA HIRONAGA , KUBOTA KAZUHIKO , HATANAKA TSUTOMU
IPC分类号： H01L21/027 , H05B3/20
摘要： PROBLEM TO BE SOLVED: To provide a heating apparatus which can decrease occurrence of substrate warp and reduce an influence of heat losses while being grounded reliably even when a substrate is thinned a great deal to accelerate a temperature change.SOLUTION: A heating apparatus comprises: a conductive base plate 2; a faceplate 3 arranged above the base plate 2, on which a wafer is placed; and a grounding member 8 arranged between the base plate 2 and the faceplate 3 to allow the base plate 2 and the faceplate 3 to be electrically conducted with each other. The faceplate 3 comprises: an aluminum substrate with a surface electrically insulated except a conduction portion with the grounding member 8; and a film heater provided on the aluminum substrate for heating the wafer. The conduction portion of the aluminum substrate with the grounding member 8 is provided at a center of the aluminum substrate and a plurality of bent parts 8A-8D are provided along a longer direction of the grounding member 8.
摘要翻译：解决问题：提供一种能够减少基板翘曲的发生并且即使当基板变薄而大幅度地加热温度变化时也能够可靠地接地的同时降低热损失的影响的加热装置。解决方案：加热装置包括：导电基板2; 布置在基板2上方的面板3，其上放置晶片; 以及布置在基板2和面板3之间的接地构件8，以允许基板2和面板3彼此电导电。面板3包括：铝基板，具有与接地部件8的导电部分电绝缘的表面; 以及设置在铝基板上用于加热晶片的薄膜加热器。具有接地构件8的铝基板的导通部分设置在铝基板的中心，沿着接地构件8的较长方向设置多个弯曲部分8A-8D。（C） 2013年，JPO＆INPIT

3. 发明专利

JP2012204826A Heating device 有权
标题翻译：加热装置
公开(公告)号：JP2012204826A
公开(公告)日：2012-10-22
申请号：JP2011071244
申请日：2011-03-28
申请人： Komatsu Ltd , Tokyo Electron Ltd , 東京エレクトロン株式会社 , 株式会社小松製作所
发明人： AKIBA HIRONAGA , KUBOTA KAZUHIKO , HATANAKA TSUTOMU , SAKAI YUICHI , YONEMIZU AKIRA , OSHIMA KAZUHIKO
IPC分类号： H01L21/027 , H01L21/683 , H05B3/68
CPC分类号： H01L21/02002 , H01L21/67103 , H01L21/68728 , H01L21/68785 , H05B3/143
摘要： PROBLEM TO BE SOLVED: To provide a heating device capable of reliably preventing flexion due to the weight of a substrate and warpage due to heat, and changing a temperature for a short time by specially thinning the substrate.SOLUTION: A heating device comprises: a face plate 3 as a substrate that is positioned above a base plate 2, on which a wafer W is located, and that is provided with a film heater heating the wafer W; a column 5 standing between the base plate 2 and the face plate 3 and supporting the face plate 3; and a tension member 7 pulling the face plate 3 toward the base plate. The column 5 and the tension member 7 are provided at a position at which at least a portion of the face plate 3 corresponding to a locating area of the wafer W is supported and pulled. The tension member 7 has: a shaft 71, whose upper end is locked by the face plate 3 and whose bottom end penetrates through the base plate 2; and a coil spring 73 positioned on the base plate 2 side, and energizing a lower end side of the shaft 71 downward.
摘要翻译：要解决的问题：提供一种能够可靠地防止由于基板的重量和由于热引起的翘曲而产生弯曲并且通过特别地使基板变薄来短时间地改变温度的加热装置。解决方案：加热装置包括：作为基板的面板3，其位于基板2上方，晶片W位于其上，并且设置有加热晶片W的膜加热器; 站立在基板2和面板3之间并支撑面板3的柱5; 以及将面板3朝向基板拉动的张力构件7。柱5和张力构件7设置在与晶片W的定位区域对应的面板3的至少一部分被支撑和拉动的位置处。张紧构件7具有：轴71，其上端被面板3锁定，其底端穿过底板2; 以及位于基板2侧的螺旋弹簧73，向下方向轴71的下端侧通电。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2012204825A Heating apparatus 有权
标题翻译：加热装置
公开(公告)号：JP2012204825A
公开(公告)日：2012-10-22
申请号：JP2011071243
申请日：2011-03-28
申请人： Komatsu Ltd , Tokyo Electron Ltd , 東京エレクトロン株式会社 , 株式会社小松製作所
发明人： AKIBA HIRONAGA , KUBOTA KAZUHIKO , HATANAKA TSUTOMU , SAKAI YUICHI , YONEMIZU AKIRA , OSHIMA KAZUHIKO
IPC分类号： H01L21/02 , H01L21/027 , H01L21/683
CPC分类号： H01L21/67103 , H01L21/67098 , H01L21/68728 , H01L21/68785
摘要： PROBLEM TO BE SOLVED: To provide a heating apparatus which can keep a wafer supported at a proper position by stabilizing positions of balls even when a substrate is thinned a great deal to accelerate a temperature change.SOLUTION: A heating apparatus comprises: a base plate; and a faceplate 3 arranged above the base plate, on which a wafer is placed. The faceplate 3 comprises: an aluminum substrate 31; a film heater 32B provided on the aluminum substrate 31 to heat the wafer W; and gap balls 6 provided on the aluminum substrate to be interposed between with the wafer W. The aluminum substrate 31 includes second mounting holes 3B in each of which the gap ball is press fit. The gap ball 6 is only held by an internal surface of the second mounting hole 3B by press fitting.
摘要翻译：要解决的问题：提供一种加热装置，其可以通过稳定球体的位置来将晶片保持在适当的位置，即使当基板变薄以致加速温度变化时。解决方案：加热装置包括：基板; 以及布置在基板上方的面板3，其上放置晶片。面板3包括：铝基板31; 设置在铝基板31上以加热晶片W的薄膜加热器32B; 以及设置在铝基板上的间隙球6，以夹在晶片W之间。铝基板31包括第二安装孔3B，每个安装孔中的间隙球被压配合。间隙球6仅通过压配合被第二安装孔3B的内表面保持。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2008282413A Fluid temperature controller and control method 有权
标题翻译：流体温度控制器和控制方法
公开(公告)号：JP2008282413A
公开(公告)日：2008-11-20
申请号：JP2008157097
申请日：2008-06-16
申请人： Komatsu Ltd , 株式会社小松製作所
发明人： SATO TOMOHISA , HATANAKA TSUTOMU , SUGIHARA TAKUMI
IPC分类号： G05D23/19 , G05B11/36
摘要： PROBLEM TO BE SOLVED: To provide a fluid temperature controller capable of coping with an individual difference in a flow control valve, capable of restraining satisfactorily overshooting, and capable of coping sufficiently with a load disturbance.
SOLUTION: A hydraulic fluid is cooled by cooling water in a heat exchanger, and is heated by a lamp heater to be brought into a target temperature. The flow control valve for the cooling water is controlled using two kinds of tables of the table for compensating a nonlinear cooling characteristic of the heat exchanger, and the table for compensating a nonlinear cooling characteristic of a proportional valve. The table for compensating the characteristic of the proportional valve defines a change rate of a flow rate generated when moved by one pulse from each pulse number position with respect to the position. The table for compensating the characteristic of the proportional valve is matched to a characteristic of the individual proportional valve, by applying a parameter expressing the individual difference of the proportional valve. The proportional valve is controlled in response to a change speed of a current temperature, in a transition period. The proportional valve is controlled to bring an output from the lamp heater within a prescribed proper output range, in a setting period.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供能够应对流量控制阀中的个体差异的流体温度控制器，其能够抑制满意地过冲，并且能够充分地承受负载扰动。解决方案：液压油通过热交换器中的冷却水冷却，并被灯加热器加热以达到目标温度。用于冷却水的流量控制阀使用两台用于补偿热交换器的非线性冷却特性的工作台和用于补偿比例阀的非线性冷却特性的工作台进行控制。用于补偿比例阀的特性的表限定了从相对于位置的每个脉冲数位置移动一个脉冲时产生的流量的变化率。通过应用表示比例阀的个体差异的参数，用于补偿比例阀的特性的表与各个比例阀的特性相匹配。在过渡期间，响应于当前温度的变化速度来控制比例阀。控制比例阀，在设定期间使灯加热器的输出在规定的合适的输出范围内。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JPH11282545A Temperature controller and method therefor 有权
标题翻译：温度控制器及其方法
公开(公告)号：JPH11282545A
公开(公告)日：1999-10-15
申请号：JP30258698
申请日：1998-10-23
申请人： Komatsu Ltd , 株式会社小松製作所
发明人： OSANAI HITOSHI , MIYAMOTO SHUNSUKE , SATO TOMOHISA , TAKECHI HIROAKI , HATANAKA TSUTOMU , TAKAHASHI NORIO , KAMEI TOSHIYUKI , SUGIHARA TAKUMI , SHIBATA ISAO , AKIBA HIRONAGA
IPC分类号： F04B49/06 , F04B41/00 , F25B1/00 , G05D23/00 , G05D23/19
CPC分类号： G05D23/1919 , Y02P80/156
摘要： PROBLEM TO BE SOLVED: To provide a temperature controller for controlling an object whose temperature should be controlled as accurately as possible. SOLUTION: This temperature controller is provided with a chiller 18 interposed in a fluid circulating and supplying system 3 for cooling temperature fluid returned from a vacuum chamber 1, a first flow rate control valve 40 interposed in the fluid circulating and supply system 3 intending from the chiller 10 to the vacuum chamber 1, a by-pass passage 50 for branching and supplying the temperature fluid returned from the vacuum chamber 1 to a position from the first flow rate control valve 40 to the vacuum chamber 1 before the temperature fluid reaches the chiller 10, a second flow rate control valve 60 interposed on the by-pass passage 50, and a halogen lamp heater 30 interposed in the fluid circulating and supply system 3 from a junction point X with the by-pass passage 50 to the vacuum chamber 1 for adjusting the temperature of the passing temperature fluid to a set temperature.
摘要翻译：要解决的问题：提供一种用于控制温度应尽可能准确地控制的物体的温度控制器。解决方案：该温度控制器设置有冷冻机18，该制冷机18插入在用于冷却从真空室1返回的温度的流体的流体循环供给系统3中，第一流量控制阀40插入在流体循环供给系统3中，冷冻机10到真空室1，旁通通路50，用于在温度流体到达冷却器之前将从真空室1返回的温度流体分支和供给到从第一流量控制阀40到真空室1的位置如图10所示，设置在旁路通路50上的第二流量控制阀60和从流路循环供给系统3中插入到旁路通路50的连接点X到真空室1的卤素灯加热器30 用于将通过的温度流体的温度调节到设定温度。

7. 发明专利

JP2009194299A Thermoelectric generator 有权
标题翻译：热电发生器
公开(公告)号：JP2009194299A
公开(公告)日：2009-08-27
申请号：JP2008035966
申请日：2008-02-18
申请人： Komatsu Ltd , 株式会社小松製作所
发明人： CHO JINSAI , MUKOJIMA MIKA , HATANAKA TSUTOMU
IPC分类号： H01L35/30 , H02N11/00
摘要： PROBLEM TO BE SOLVED: To provide a compact thermoelectric generator which has high thermoelectric conversion efficiency, excellent durability and reliability, and favorable space efficiency and maintainability.
SOLUTION: The thermoelectric generator comprises: first and second low-temperature-side heat exchangers 30 disposed to be opposed to each other for introducing a coolant therein; a plurality of springs 40 located to be dispersed between first and second opposing surfaces of the first and second low-temperature-side heat exchangers; a first thermoelectric conversion module 20 on a surface of the first low-temperature-side heat exchanger opposed to the first surface; a second thermoelectric conversion module mounted on a surface of the second low-temperature-side thermoelectric heat exchanger; first high-temperature-side heat exchangers 10 located to sandwich the first thermoelectric conversion module with the first low-temperature-side heat exchanger for introducing a gas therein; and second high-temperature-side heat exchangers located to sandwich the second thermoelectric conversion module with the second low-temperature-side heat exchanger for introducing gas therein.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有高热电转换效率，优异的耐久性和可靠性以及有利的空间效率和可维护性的紧凑型热电发电机。解决方案：热电发电机包括：第一和第二低温侧热交换器30，彼此相对设置以将冷却剂引入其中; 多个弹簧40，位于分散在第一和第二低温侧热交换器的第一和第二相对表面之间; 所述第一低温侧热交换器的与所述第一表面相对的表面上的第一热电转换模块20; 安装在所述第二低温侧热电式热交换器的表面上的第二热电转换模块; 第一高温侧热交换器10，其将第一热电转换模块与第一低温侧热交换器夹持，将其中的气体导入; 以及第二高温侧热交换器，其位于将第二热电转换模块夹在第二低温侧热交换器中，用于在其中引入气体。版权所有（C）2009，JPO＆INPIT

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