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JP2010007155A Plating apparatus 有权
标题翻译：电镀设备
公开(公告)号：JP2010007155A
公开(公告)日：2010-01-14
申请号：JP2008170516
申请日：2008-06-30
申请人： Kida Seiko Kk , Sugiura Seisakusho Co Ltd , 木田精工株式会社 , 株式会社杉浦製作所
发明人： KIDA KIYOSHI , NAKAGAWA YOJI , KOYAMA MIEKO , ISHIKAWA HIDEMI
IPC分类号： C25D17/06 , C25D17/08
摘要： PROBLEM TO BE SOLVED: To provide a compact plating apparatus which is used for a plating line. SOLUTION: The plating apparatus includes a workpiece holder 10, a moving device 20 (moving means), and a rotating device 30 (rotating means). Workpiece holding tools 40 (holding part) which are mounted on the workpiece holder 10 hold cap nuts 1 (workpiece) so that the cap nuts 1 can be laterally aligned at chp parts which extend outward against an axis line L1. The moving device 20 moves the workpiece holder 10 from one position to another position in a liquid tank 101. The rotating device 30 rotates the workpiece holder 10 around the axis line L1. The rotating device 30 rotates the workpiece holding tools 40 to the lower side when immersing the cap nuts 1 which are held by the workpiece holding tools 40 into a plating solution, and rotates the workpiece holding tools 40 to the upper side when the moving device 20 moves the cap nuts 1 held by the workpiece holding tools 40 from one position to the another position in the liquid tank 101. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于电镀线的紧凑的电镀装置。解决方案：电镀装置包括工件保持件10，移动装置20（移动装置）和旋转装置30（旋转装置）。安装在工件保持件10上的工件保持工具40（保持部）保持盖螺母1（工件），使得盖螺母1能够相对于轴线L1向外延伸的chp部分侧向对齐。移动装置20将工件保持器10从液体罐101中的一个位置移动到另一位置。旋转装置30使工件保持器10绕轴线L1旋转。旋转装置30将工件保持工具40保持的盖螺母1浸入电镀液中时，将工件夹持工具40旋转到下侧，并且当移动装置20将工件保持工具40旋转到上侧时将由工件保持工具40保持的盖螺母1从一个位置移动到液体罐101中的另一位置。（C）2010，JPO＆INPIT

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