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1. 发明专利

JP2014177509A Production method of inorganic phosphor 有权
标题翻译：无机磷的生产方法
公开(公告)号：JP2014177509A
公开(公告)日：2014-09-25
申请号：JP2013050469
申请日：2013-03-13
申请人： Kaneka Corp , 株式会社カネカ
发明人： KANAI KAZUAKI , MATSUMOTO KAZUAKI
IPC分类号： C09K11/08 , C09K11/64
摘要： PROBLEM TO BE SOLVED: To provide a production method of an inorganic phosphor, with which an activator in raw material compounds can certainly be reduced, further sintering can be advanced with uniform heat distribution, and consequently the inorganic phosphor having excellent light emission intensity can certainly be produced.SOLUTION: In a production method of an inorganic phosphor, after raw material compounds are mixed, the obtained mixture is wrapped with a graphite sheet and heated so that the mixture is sintered in a reducing atmosphere.
摘要翻译：要解决的问题：为了提供无机磷光体的制造方法，能够确定原料化合物中的活化剂可以被还原，可以进一步进行烧结，并且发光强度优异的无机荧光体可以肯定地发挥在无机磷光体的制造方法中，将原料化合物混合后，将所得混合物用石墨片包裹并加热，使混合物在还原气氛中烧结。

2. 发明专利

JP2013079331A Resin molding for led module 有权
标题翻译： LED模块树脂模具
公开(公告)号：JP2013079331A
公开(公告)日：2013-05-02
申请号：JP2011220040
申请日：2011-10-04
申请人： Kaneka Corp , 株式会社カネカ
发明人： TOZAWA TOMOKAZU , IWAHARA TAKANAO , OGOSHI HIROSHI , IBA TOSHIAKI , HIRABAYASHI KAZUHIKO , OZAKI SHUHEI , KANAI KAZUAKI , KAKEHASHI YASUSHI
IPC分类号： C08J5/00 , C08K3/00 , C08L83/05 , C08L83/07 , H01L33/48
摘要： PROBLEM TO BE SOLVED: To provide an LED module whose bezel width can be narrowed and which can embody a uniform linear light source property as a light source of an edge-type BLU, and a backlight unit having the same.SOLUTION: The LED module using one side surface has a bar-type circuit substrate in which at least one groove is formed so as to have a reflection cup, a plurality of LED chips disposed in the groove of the circuit substrate and linearly arrayed along the longitudinal direction of the circuit substrate, and a fluorescent film separated from the LED chips and arranged on the circuit substrate so as to cover the whole groove.
摘要翻译：要解决的问题：提供一种LED模块，其边框宽度可以变窄并且可以具有均匀的线性光源特性作为边缘型BLU的光源，以及具有该LED模块的背光单元。解决方案：使用一个侧面的LED模块具有条形电路基板，其中形成至少一个凹槽以具有反射杯，设置在电路基板的凹槽中的多个LED芯片和线性沿着电路基板的纵向方向排列的荧光膜和与LED芯片分离并布置在电路基板上以覆盖整个槽的荧光膜。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2013080821A Resin molding and side surface light emitting type semiconductor light emitting device 审中-公开
标题翻译：树脂模制和侧面发光型半导体发光装置
公开(公告)号：JP2013080821A
公开(公告)日：2013-05-02
申请号：JP2011220038
申请日：2011-10-04
申请人： Kaneka Corp , 株式会社カネカ
发明人： TOZAWA TOMOKAZU , IWAHARA TAKANAO , OGOSHI HIROSHI , IBA TOSHIAKI , HIRABAYASHI KAZUHIKO , OZAKI SHUHEI , KANAI KAZUAKI , KAKEHASHI YASUSHI
IPC分类号： H01L33/60 , C08K3/00 , C08L101/02
CPC分类号： H01L24/97 , H01L2224/48091 , H01L2224/48227 , H01L2924/12041 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a resin molding suitable for a side surface light emitting type semiconductor light emitting device which has high durability and is downsized.SOLUTION: Semiconductor light emitting elements 50 are mounted on a material plate for a substrate where multiple substrates 20, each of which forms a semiconductor light emitting device 1, are integrally connected. Then, the material plate for the substrate is transfer-molded with a translucent resin 70 and is transfer-molded with a non translucent resin 80. Further, the translucent resin 70 and the non translucent resin 80 are removed so that the translucent resin 70 is partially exposed to the exterior and the material plate for the substrate is separated into the respective semiconductor light emitting devices 1.
摘要翻译：要解决的问题：提供一种适合于具有高耐久性和小尺寸的侧面发光型半导体发光器件的树脂模制品。解决方案：半导体发光元件50安装在用于基板的材料板上，其中形成半导体发光器件1的多个基板20被一体地连接。然后，用透光性树脂70将基板用材料板转印成型，并用不透光性树脂80进行转印成型。此外，除去透光性树脂70和非透光性树脂80，使透光性树脂70为部分地暴露于外部，并且用于基板的材料板被分离成各自的半导体发光器件1.版权所有（C）2013，JPO和INPIT

4. 发明专利

JP2013080820A Resin molding and light emitting device 审中-公开
标题翻译：树脂模制和发光装置
公开(公告)号：JP2013080820A
公开(公告)日：2013-05-02
申请号：JP2011220037
申请日：2011-10-04
申请人： Kaneka Corp , 株式会社カネカ
发明人： TOZAWA TOMOKAZU , IWAHARA TAKANAO , OGOSHI HIROSHI , IBA TOSHIAKI , HIRABAYASHI KAZUHIKO , OZAKI SHUHEI , KANAI KAZUAKI , KAKEHASHI YASUSHI
IPC分类号： H01L33/60 , C08G77/50 , C08K3/00 , C08L83/05 , C08L83/07
CPC分类号： H01L2224/4809 , H01L2224/48097 , H01L2224/48247 , H01L2224/48465 , H01L2924/00 , H01L2224/48095
摘要： PROBLEM TO BE SOLVED: To provide a light emitting device which decreases the dark luminance thereby forming a high definition display device having a high contrast ratio.SOLUTION: A light emitting device has: multiple light emitting elements having different emission wavelengths; a substrate having multiple recessed parts where the light emitting elements are placed; and sealing members provided at the respective recessed parts. The recessed parts are spaced away from each other and are provided with the sealing members, each of which contains a coloring member of a similar color to the emission wavelength of the light emitting element.
摘要翻译：解决的问题：提供一种减少暗亮度从而形成具有高对比度的高分辨率显示装置的发光装置。解决方案：发光器件具有：具有不同发射波长的多个发光元件; 具有放置发光元件的多个凹部的基板; 以及设置在各凹部的密封构件。凹部彼此间隔开，设置有密封构件，每个密封构件包含与发光元件的发射波长相似的着色构件。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2013082834A Image sensor using organopolysiloxane-based composition 有权
标题翻译：使用基于有机硅氧烷的组合物的图像传感器
公开(公告)号：JP2013082834A
公开(公告)日：2013-05-09
申请号：JP2011224954
申请日：2011-10-12
申请人： Kaneka Corp , 株式会社カネカ
发明人： KANAI KAZUAKI , MANABE TAKAO
IPC分类号： C09J183/05 , C08L83/05 , C08L83/07 , C08L83/14 , C09J5/00 , C09J183/07 , H01L27/14
摘要： PROBLEM TO BE SOLVED: To provide an image sensor excellent in productivity and durability, by using, as an adhesive, an organopolysiloxane-based composition having high heat resistance and light resistance, excellent in thermal cycle shock resistance and gas barrier properties, and having a reduced modulus of elasticity.SOLUTION: This image sensor uses, as an adhesive, a cured product of an organosiloxane-based composition including: (A) a modified polyhedron-structured polysiloxane obtained by reacting a hydrosilyl group-containing compound (b) with an alkenyl group-containing polyhedron-structured polysiloxane-based compound (a); (B) an organopolysiloxane having two or more alkenyl groups in one molecule; and (C) an organosilicon compound having one alkenyl group or hydrosilyl group in one molecule.
摘要翻译：解决问题：为了提供生产率和耐久性优异的图像传感器，通过使用具有高耐热性和耐光性，耐热循环耐冲击性和阻气性优异的有机聚硅氧烷基组合物作为粘合剂，并具有降低的弹性模量。该图像传感器使用作为粘合剂的有机硅氧烷类组合物的固化物，其包含：（A）通过使含氢化甲硅烷基的化合物（b）与烯基进行反应得到的改性多面体结构的聚硅氧烷含有多面体结构的聚硅氧烷类化合物（a）; （B）在一个分子中具有两个或多个烯基的有机聚硅氧烷; 和（C）在一个分子中具有一个烯基或氢化硅烷基的有机硅化合物。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2013080822A Package mold, method of manufacturing the same, and light-emitting device 审中-公开
标题翻译：包装模具，其制造方法和发光装置
公开(公告)号：JP2013080822A
公开(公告)日：2013-05-02
申请号：JP2011220039
申请日：2011-10-04
申请人： Kaneka Corp , 株式会社カネカ
发明人： TOZAWA TOMOKAZU , IWAHARA TAKANAO , OGOSHI HIROSHI , IBA TOSHIAKI , HIRABAYASHI KAZUHIKO , OZAKI SHUHEI , KANAI KAZUAKI , KAKEHASHI YASUSHI
IPC分类号： H01L33/48 , C08K5/06 , C08K5/3492 , C08L83/05
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a high-durable package mold that allows improving manufacturing yield, to provide a method of manufacturing the same, and to provide a light-emitting device using the package.SOLUTION: A package mold includes a recess 14 housing a light-emitting element chip, and positive and negative lead electrodes 21 and 22. On the bottom surface of the recess, one primary surface of the positive lead electrode and one primary surface of the negative lead electrode are exposed, and one end surface of the positive lead electrode and one end surface of the negative lead electrode are disposed so as to face each other with a predetermined distance. The positive lead electrode and the negative lead electrode are integrally formed so that a molding resin 10 is filled between the one end surface of the positive lead electrode and the one end surface of the negative lead electrode. Each of the positive and negative lead electrodes rises so that the angle of an end portion where the one primary surface and the one end surface are crossed is an acute angle.
摘要翻译：要解决的问题：提供一种高耐用的包装模具，其能够提高制造成品率，提供其制造方法，并提供使用该包装的发光装置。解决方案：封装模具包括容纳发光元件芯片的凹部14，以及正和负引线电极21和22.在凹部的底表面上，正引线电极的一个主表面和一个主表面露出负极引线电极的一个端面，并且将正极引线电极的一个端面和负极引线电极的一个端面配置成彼此面对预定的距离。正极引线电极和负极引线电极整体形成，使得在正极引线电极的一个端面和负极引线电极的一个端面之间填充模制树脂10。正极引线电极和负极引线电极中的每一个上升，使得一个主表面和一个端部表面交叉的端部的角度是锐角。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2013080819A Resin molding for light-emitting device 审中-公开
标题翻译：用于发光装置的树脂模塑
公开(公告)号：JP2013080819A
公开(公告)日：2013-05-02
申请号：JP2011220036
申请日：2011-10-04
申请人： Kaneka Corp , 株式会社カネカ
发明人： TOZAWA TOMOKAZU , IWAHARA TAKANAO , OGOSHI HIROSHI , IBA TOSHIAKI , HIRABAYASHI KAZUHIKO , OZAKI SHUHEI , KANAI KAZUAKI , KAKEHASHI YASUSHI
IPC分类号： H01L33/48
CPC分类号： H01L2224/14 , H01L2224/16225 , H01L2924/181 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To improve energy efficiency and heighten light emission intensity per unit area.SOLUTION: A light-emitting device 1 comprises: a base part 3a; a support substrate 3, formed on the base part 3a, and having a light reflection part 3b provided with a plurality of opening parts 3c; a light emitting element 5, disposed in the plurality of the opening parts 3c, and having an anode electrode 13 and a cathode electrode 15; and a plurality of electrode wirings 7, extending in a belt-shape between the base part 3a and the light reflection part 3b, for supplying a current to the light emitting element 5.

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