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1. 发明专利

JP2006001107A Mold for molding resin roller 审中-公开
标题翻译：模具树脂滚筒模具
公开(公告)号：JP2006001107A
公开(公告)日：2006-01-05
申请号：JP2004179038
申请日：2004-06-17
申请人： Kaneka Corp , Tochigi Kaneka Corp , 栃木カネカ株式会社 , 株式会社カネカ
发明人： SAITO TADAYUKI , OGOSHI HIROSHI , OSETO SADAO
IPC分类号： B29C33/12 , B29L31/32
摘要： PROBLEM TO BE SOLVED: To provide a mold which can obtain a resin roller with a core shake minimized even without being subjected to surface treatment such as polishing or cutting.
SOLUTION: The mold for molding the resin roller is used to obtain the resin roller with the core shake minimized by arranging spring type plungers around the core bar insertion hole of the mold to make the core bar inserted into the insertion hole be positioned at the center of the hole. Preferably, at least three plungers are arranged at equal intervals on the periphery of the insertion of the core bar.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供一种即使不进行诸如抛光或切割等表面处理，也能够获得最小化的芯振动的树脂辊的模具。解决方案：用于模制树脂辊的模具用于通过在模具的芯棒插入孔周围布置弹簧式柱塞来获得具有芯振动的树脂辊，使得插入到插入孔中的芯棒被定位在洞的中心。优选地，至少三个柱塞以相等的间隔布置在芯棒的插入的周边上。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2005297249A Mold for molding resin roller 审中-公开
标题翻译：模具树脂滚筒模具
公开(公告)号：JP2005297249A
公开(公告)日：2005-10-27
申请号：JP2004113374
申请日：2004-04-07
申请人： Kaneka Corp , Tochigi Kaneka Corp , 栃木カネカ株式会社 , 株式会社カネカ
发明人： SAITO TADAYUKI , NODA MITSUHISA , OGOSHI HIROSHI , OSETO SADAO , SAITO NAOTO
IPC分类号： G03G15/08 , B29C33/38 , B29C39/26 , B29L31/32 , C23C18/52 , F16C13/00 , G03G15/00 , G03G15/02 , G03G15/16
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a resin roller which can easily automate the cleaning work of a mold for molding the resin roller and is high in productivity. SOLUTION: A mold for molding the resin roller uses a cylindrical mold subjected to surface treatment to improve the mold releasing properties of a molding, a core body holding member which is arranged at the upper end of the cylindrical mold and has a space for storing a resin overflowing during injection, and an attachable/detachable valve body having a part for storing the overflowing resin. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供一种树脂辊的制造方法，其可以容易地自动化用于模制树脂辊的模具的清洁工作，并且生产率高。解决方案：用于模制树脂辊的模具使用经过表面处理的圆柱形模具来提高模制品的脱模性能，芯体保持构件设置在圆柱形模具的上端并具有空间用于储存在注射期间溢出的树脂，以及可拆卸的阀体，其具有用于存储溢出树脂的部分。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2005300675A Resin roller and its manufacturing method 审中-公开
标题翻译：树脂辊及其制造方法
公开(公告)号：JP2005300675A
公开(公告)日：2005-10-27
申请号：JP2004113378
申请日：2004-04-07
申请人： Kaneka Corp , Tochigi Kaneka Corp , 栃木カネカ株式会社 , 株式会社カネカ
发明人： SAITO TADAYUKI , NODA MITSUHISA , OGOSHI HIROSHI , OSETO SADAO , SAITO NAOTO
IPC分类号： G03G15/08 , F16C13/00 , G03G15/00 , G03G15/02
摘要： PROBLEM TO BE SOLVED: To provide a resin roller aiming at the removal of a defect at the end of a rubber elastic body layer and at the prolongation of the life of a surface layer, and its manufacturing method. SOLUTION: The resin roller and its manufacturing method are characterized by covering the surface of the rubber elastic body layer with the surface layer after cutting and removing a projection part provided at the end of the rubber elastic body layer after releasing the resin roller from a metallic mold. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种树脂辊，其目的在于消除橡胶弹性体层的端部处的缺陷并延长表面层的寿命及其制造方法。解决方案：树脂辊及其制造方法的特征在于，在剥离树脂辊之后，在切割和除去设置在橡胶弹性体层的端部的突出部之后，用表面层覆盖橡胶弹性体层的表面从金属模具。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2002052539A MOLD FEED DEVICE OF RESIN ROLLER AND MOLD ATTACHING METHOD 失效
公开(公告)号：JP2002052539A
公开(公告)日：2002-02-19
申请号：JP2000239100
申请日：2000-08-07
申请人： KANEKA CORP , TOCHIGI KANEKA CORP
发明人： KOMATSU TOSHIYUKI , OGOSHI HIROSHI , KOBAYASHI HIROYOSHI
IPC分类号： G03G15/02 , B29C33/30 , G03G15/08 , G03G15/16
摘要： PROBLEM TO BE SOLVED: To provide an apparatus and method for inexpensively attaching a core body and a cylindrical mold to a core body holding member in a short time without making the apparatus large-sized. SOLUTION: A mold feed device is equipped with a core support mechanism which inserts the core body in the cylindrical mold to support both ends thereof, and a cylindrical mold support mechanism for supporting the outer peripheral surface of the cylindrical mold.

5. 发明专利

JP2013080821A Resin molding and side surface light emitting type semiconductor light emitting device 审中-公开
标题翻译：树脂模制和侧面发光型半导体发光装置
公开(公告)号：JP2013080821A
公开(公告)日：2013-05-02
申请号：JP2011220038
申请日：2011-10-04
申请人： Kaneka Corp , 株式会社カネカ
发明人： TOZAWA TOMOKAZU , IWAHARA TAKANAO , OGOSHI HIROSHI , IBA TOSHIAKI , HIRABAYASHI KAZUHIKO , OZAKI SHUHEI , KANAI KAZUAKI , KAKEHASHI YASUSHI
IPC分类号： H01L33/60 , C08K3/00 , C08L101/02
CPC分类号： H01L24/97 , H01L2224/48091 , H01L2224/48227 , H01L2924/12041 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a resin molding suitable for a side surface light emitting type semiconductor light emitting device which has high durability and is downsized.SOLUTION: Semiconductor light emitting elements 50 are mounted on a material plate for a substrate where multiple substrates 20, each of which forms a semiconductor light emitting device 1, are integrally connected. Then, the material plate for the substrate is transfer-molded with a translucent resin 70 and is transfer-molded with a non translucent resin 80. Further, the translucent resin 70 and the non translucent resin 80 are removed so that the translucent resin 70 is partially exposed to the exterior and the material plate for the substrate is separated into the respective semiconductor light emitting devices 1.
摘要翻译：要解决的问题：提供一种适合于具有高耐久性和小尺寸的侧面发光型半导体发光器件的树脂模制品。解决方案：半导体发光元件50安装在用于基板的材料板上，其中形成半导体发光器件1的多个基板20被一体地连接。然后，用透光性树脂70将基板用材料板转印成型，并用不透光性树脂80进行转印成型。此外，除去透光性树脂70和非透光性树脂80，使透光性树脂70为部分地暴露于外部，并且用于基板的材料板被分离成各自的半导体发光器件1.版权所有（C）2013，JPO和INPIT

6. 发明专利

JP2013080820A Resin molding and light emitting device 审中-公开
标题翻译：树脂模制和发光装置
公开(公告)号：JP2013080820A
公开(公告)日：2013-05-02
申请号：JP2011220037
申请日：2011-10-04
申请人： Kaneka Corp , 株式会社カネカ
发明人： TOZAWA TOMOKAZU , IWAHARA TAKANAO , OGOSHI HIROSHI , IBA TOSHIAKI , HIRABAYASHI KAZUHIKO , OZAKI SHUHEI , KANAI KAZUAKI , KAKEHASHI YASUSHI
IPC分类号： H01L33/60 , C08G77/50 , C08K3/00 , C08L83/05 , C08L83/07
CPC分类号： H01L2224/4809 , H01L2224/48097 , H01L2224/48247 , H01L2224/48465 , H01L2924/00 , H01L2224/48095
摘要： PROBLEM TO BE SOLVED: To provide a light emitting device which decreases the dark luminance thereby forming a high definition display device having a high contrast ratio.SOLUTION: A light emitting device has: multiple light emitting elements having different emission wavelengths; a substrate having multiple recessed parts where the light emitting elements are placed; and sealing members provided at the respective recessed parts. The recessed parts are spaced away from each other and are provided with the sealing members, each of which contains a coloring member of a similar color to the emission wavelength of the light emitting element.
摘要翻译：解决的问题：提供一种减少暗亮度从而形成具有高对比度的高分辨率显示装置的发光装置。解决方案：发光器件具有：具有不同发射波长的多个发光元件; 具有放置发光元件的多个凹部的基板; 以及设置在各凹部的密封构件。凹部彼此间隔开，设置有密封构件，每个密封构件包含与发光元件的发射波长相似的着色构件。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2011012768A Adhesive waterproof packing for electronic equipment and method for manufacturing the same 审中-公开
标题翻译：用于电子设备的粘合防水包装及其制造方法
公开(公告)号：JP2011012768A
公开(公告)日：2011-01-20
申请号：JP2009158017
申请日：2009-07-02
申请人： Kaneka Corp , 株式会社カネカ
发明人： ISHIKAWA TOSHIO , OGOSHI HIROSHI , SAKAGUCHI MASAFUMI
IPC分类号： F16J15/14 , C08L83/05 , C08L101/02 , C09K3/10 , F16J15/10
摘要： PROBLEM TO BE SOLVED: To provide reliable packing exhibiting satisfactory waterproof performance even when electronic equipment sinks under water or jet water is blown against the equipment.SOLUTION: The packing made of a curable liquid resin composition having adhesiveness and rubber elasticity is characterized in that the curable liquid resin composition contains (A) an organic polymer having at least average one alkenyl group in one molecule, (B) a compound having at least two hydrosilyl groups in one molecule, and (C) a hydrosilylation catalyst.
摘要翻译：要解决的问题：为了提供可靠的包装，即使当电子设备在水下沉没或喷射水被吹送到设备上时，其表现出令人满意的防水性能。解决方案：由具有粘合性和橡胶弹性的可固化液体树脂组合物制成的填料的特征在于，可固化液体树脂组合物包含（A）在一个分子中具有至少平均一个烯基的有机聚合物，（B）在一个分子中具有至少两个氢化甲硅烷基的化合物和（C）氢化硅烷化催化剂。

8. 发明专利

JP2013215898A Molding die for optical semiconductor package 审中-公开
标题翻译：用于光学半导体封装的模具
公开(公告)号：JP2013215898A
公开(公告)日：2013-10-24
申请号：JP2012085815
申请日：2012-04-04
申请人： Kaneka Corp , 株式会社カネカ
发明人： OGOSHI HIROSHI , HIRABAYASHI KAZUHIKO , IWAHARA TAKANAO
IPC分类号： B29C33/38
摘要： PROBLEM TO BE SOLVED: To provide a molding die for a mold-releasable optical semiconductor package which causes no cohesive failure during molding.SOLUTION: A molding die is for molding a semiconductor package integrally molded with a lead frame by using a heat-curable resin composition containing a heat-curable component, (D) a white pigment, and (E) an inorganic filler. In addition, a surface roughness of a molding die horizontal plane, which comes into contact with the resin, is Rz4 or more and Rz12 or less. Besides, a surface roughness of a molding die side in contact with the resin is Rz2 or less.
摘要翻译：要解决的问题：提供一种用于可脱模光学半导体封装的成型模具，其在成型期间不引起内聚破坏。成型模具用于通过使用热固化树脂来模制与引线框架一体模制的半导体封装含有可热固化组分的组合物，（D）白色颜料和（E）无机填料。此外，与树脂接触的成型模具水平面的表面粗糙度为Rz4以上且Rz12以下。此外，与树脂接触的成型模具侧的表面粗糙度为Rz2以下。

9. 发明专利

JP2013079331A Resin molding for led module 有权
标题翻译： LED模块树脂模具
公开(公告)号：JP2013079331A
公开(公告)日：2013-05-02
申请号：JP2011220040
申请日：2011-10-04
申请人： Kaneka Corp , 株式会社カネカ
发明人： TOZAWA TOMOKAZU , IWAHARA TAKANAO , OGOSHI HIROSHI , IBA TOSHIAKI , HIRABAYASHI KAZUHIKO , OZAKI SHUHEI , KANAI KAZUAKI , KAKEHASHI YASUSHI
IPC分类号： C08J5/00 , C08K3/00 , C08L83/05 , C08L83/07 , H01L33/48
摘要： PROBLEM TO BE SOLVED: To provide an LED module whose bezel width can be narrowed and which can embody a uniform linear light source property as a light source of an edge-type BLU, and a backlight unit having the same.SOLUTION: The LED module using one side surface has a bar-type circuit substrate in which at least one groove is formed so as to have a reflection cup, a plurality of LED chips disposed in the groove of the circuit substrate and linearly arrayed along the longitudinal direction of the circuit substrate, and a fluorescent film separated from the LED chips and arranged on the circuit substrate so as to cover the whole groove.
摘要翻译：要解决的问题：提供一种LED模块，其边框宽度可以变窄并且可以具有均匀的线性光源特性作为边缘型BLU的光源，以及具有该LED模块的背光单元。解决方案：使用一个侧面的LED模块具有条形电路基板，其中形成至少一个凹槽以具有反射杯，设置在电路基板的凹槽中的多个LED芯片和线性沿着电路基板的纵向方向排列的荧光膜和与LED芯片分离并布置在电路基板上以覆盖整个槽的荧光膜。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2013079328A Curable resin composition, curable resin composition tablet, molded product, package for semiconductor, semiconductor part and light-emitting diode 有权
标题翻译：可固化树脂组合物，可固化树脂组合物片，模制产品，半导体，半导体部件和发光二极管封装
公开(公告)号：JP2013079328A
公开(公告)日：2013-05-02
申请号：JP2011220032
申请日：2011-10-04
申请人： Kaneka Corp , 株式会社カネカ
发明人： HIRABAYASHI KAZUHIKO , TOZAWA TOMOKAZU , OZAKI SHUHEI , OGOSHI HIROSHI , IBA TOSHIAKI , KAKEHASHI YASUSHI , IWAHARA TAKANAO
IPC分类号： C08L83/07 , C08K3/00 , C08K5/00 , C08K5/098 , C08K9/06 , C08K13/04 , H01L23/28 , H01L23/29 , H01L23/31 , H01L33/48
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a curable resin composition which gives a cured product having a low linear expansion coefficient and having a high reflection rate and a low transmittance.SOLUTION: The curable resin composition includes, as necessary components: (A) an organic compound having at least two carbon-carbon double bonds, reactive with a SiH group, in a molecule; (B) a compound containing at least two SiH groups in a molecule; (C) a hydrosilylation catalyst; (D) a silicone compound having at least one carbon-carbon double bonds, reactive with a SiH group, in a molecule; (E) an inorganic filler; and (F) a white pigment; wherein the spectral reflectance at 460 nm and 480 nm is at least 90% and the spectral reflectance is less than 0.4% when the thickness of the cured product is at most 0.2 mm.
摘要翻译：要解决的问题：提供一种固化产物，其具有低线性膨胀系数并具有高反射率和低透射率的固化产物。解决方案：根据需要，可固化树脂组合物包含：（A）在分子中具有至少两个与SiH基反应的碳 - 碳双键的有机化合物; （B）分子中含有至少两个SiH基的化合物; （C）氢化硅烷化催化剂; （D）在分子中具有至少一个与SiH基反应的碳 - 碳双键的硅氧烷化合物; （E）无机填料; 和（F）白色颜料; 其中当固化产物的厚度为至多0.2mm时，460nm和480nm处的光谱反射率为至少90％，光谱反射率小于0.4％。版权所有（C）2013，JPO＆INPIT

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