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    • 1. 发明专利
    • Semiconductor device automatic inspection device
    • 半导体器件自动检测器件
    • JP2003021664A
    • 2003-01-24
    • JP2001206553
    • 2001-07-06
    • Juki Corpジューキ株式会社
    • MIYASAKO MASAMIKINOSHITA TADASHIYAMAMOTO YUJITAUCHI TSUKASAYOSHIHIRA MITSUHIRO
    • G01R31/26G01R1/06G01R31/28
    • PROBLEM TO BE SOLVED: To provide a semiconductor device automatic inspection device capable of inspecting, highly accurately and efficiently, a semiconductor device to which a cable is connected.
      SOLUTION: This semiconductor device automatic inspection device 10 comprises a tray 20 for holding the semiconductor device 18, a conveyance device 24 for conveying successively the tray 20 to an inspection area 22 in the holding state of the semiconductor device 18, an inspection connector 26 to be automatically coupled with a connector 16 in the held state by the tray 20, a probe 28, a transfer device 30 for transferring the tray 20 toward the probe 28, and thereby allowing a terminal 14A of a device body 14 and a terminal 28A of the probe 28 to approach mutually, and inspection equipment 32 for inspecting the semiconductor device 18 by inputting an input signal from the inspection connector 26 and by acquiring an output signal from the probe 28.
      COPYRIGHT: (C)2003,JPO
    • 要解决的问题:提供一种半导体装置自动检查装置,其能够高精度地且有效地检测连接有电缆的半导体装置。 解决方案:该半导体装置自动检查装置10包括用于保持半导体装置18的托盘20,用于在半导体装置18的保持状态下将托盘20连续地传送到检查区域22的输送装置24,检查连接器26 在保持状态下通过托盘20自动联接连接器16,探针28,用于将托盘20朝向探针28传送的传送装置30,从而允许装置主体14的端子14A和端子28A的端子 探针28相互接近,以及检查设备32,用于通过从检查连接器26输入输入信号并且从探针28获取输出信号来检查半导体器件18。