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1. 发明专利

JP2008176072A Circuit chip transfer sheet and method for manufacturing circuit board 审中-公开
标题翻译：电路板转移片和制造电路板的方法
公开(公告)号：JP2008176072A
公开(公告)日：2008-07-31
申请号：JP2007009595
申请日：2007-01-18
申请人： Japan Advanced Institute Of Science & Technology Hokuriku , Lintec Corp , リンテック株式会社 , 国立大学法人北陸先端科学技術大学院大学
发明人： MATSUMURA HIDEKI , NAKABAYASHI MASAHITO , IZUMI TADASHI , FUKUDA TATSUO
IPC分类号： G09F9/00 , G02F1/1345
CPC分类号： H01L21/6835 , G02F1/1303 , H01L24/29 , H01L24/83 , H01L2221/68322 , H01L2221/68354 , H01L2221/68359 , H01L2224/2919 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01054 , H01L2924/01078 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/3025 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide techniques for easily and inexpensively laying a circuit chip on a circuit board sheet so as to easily manufacture a display circuit board with high yield in which a circuit chip to control each pixel of the display is embedded. SOLUTION: A circuit chip transfer sheet is used to get a given number of circuit chips by sticking and transferring from a circuit chip holding member holding circuit chips and to transfer the given number of circuit chips onto a mounting position of circuit chips on a circuit board. The sheet used as the circuit chip transfer sheet to transfer a desired number of circuit chips comprises a material that can be selectively set to an adhesive part and a non-adhesive part on the exposed surface. A required number of circuit chips are laid on a circuit board sheet by using the transfer sheet. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供在电路板片上容易且廉价地铺设电路芯片的技术，以便容易地制造高成本的显示电路板，其中嵌入显示器的每个像素的电路芯片被嵌入。
解决方案：电路芯片转印片用于通过从电路芯片保持构件保持电路芯片粘附和转移来获得给定数量的电路芯片，并将给定数量的电路芯片传送到电路芯片的安装位置电路板。用作电路芯片转印片以转印所需数量的电路芯片的片材包括可以选择性地设置在暴露表面上的粘合部分和非粘合部分的材料。通过使用转印片将所需数量的电路芯片放置在电路板片上。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2008177371A Method of manufacturing circuit board 审中-公开
标题翻译：制造电路板的方法
公开(公告)号：JP2008177371A
公开(公告)日：2008-07-31
申请号：JP2007009597
申请日：2007-01-18
申请人： Japan Advanced Institute Of Science & Technology Hokuriku , Lintec Corp , リンテック株式会社 , 国立大学法人北陸先端科学技術大学院大学
发明人： MATSUMURA HIDEKI , OHIRA KEISUKE , ISHIZUKA RYOHEI , NAKABAYASHI MASAHITO , IZUMI TADASHI , FUKUDA TATSUO
IPC分类号： H01L21/52 , G02F1/13 , G02F1/133 , G02F1/1345 , G09F9/00 , H01L23/12
CPC分类号： H01L24/83 , G02F1/1303 , H01L21/6835 , H01L24/29 , H01L2221/68322 , H01L2221/68354 , H01L2221/68359 , H01L2224/2919 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01054 , H01L2924/01058 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/3025 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a technique which can inexpensively arrange a circuit chip on a circuit board sheet in an easy and simple manner to manufacture a display circuit board having the circuit chip buried therein in an easy and simple manner with a high yield for controlling respective display pixels.
SOLUTION: In the method of manufacturing a circuit board by transferring a predetermined number of circuit chips on a circuit board sheet from a circuit chip holder member for holding the circuit chips thereon, locations for transfer of the predetermined number of circuit chips are selectively set for adhesion parts. The circuit board is manufactured by selectively arranging unset adhesion parts on an unset layer of the circuit board sheet and arranging the predetermined number of circuit chips on the surface thereof.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种以简单和简单的方式将电路芯片廉价地布置在电路板上的方法，以简单和简单的方式制造具有埋入其中的电路芯片的显示电路板，高产率用于控制各个显示像素。解决方案：在通过从用于保持电路芯片的电路芯片保持器构件将电路板片上的预定数量的电路芯片传送到电路板的制造方法中，用于传送预定数量的电路芯片的位置选择性地设置粘合部件。通过在电路板片的未设定层上选择性地布置未固定的粘合部分并在其表面上布置预定数量的电路芯片来制造电路板。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2008176073A Circuit board sheet and method for manufacturing circuit board 审中-公开
标题翻译：电路板电路板及制造电路板的方法
公开(公告)号：JP2008176073A
公开(公告)日：2008-07-31
申请号：JP2007009596
申请日：2007-01-18
申请人： Japan Advanced Institute Of Science & Technology Hokuriku , Lintec Corp , リンテック株式会社 , 国立大学法人北陸先端科学技術大学院大学
发明人： MATSUMURA HIDEKI , OHIRA KEISUKE , ISHIZUKA RYOHEI , NAKABAYASHI MASAHITO , IZUMI TADASHI , FUKUDA TATSUO
IPC分类号： G09F9/30 , G02F1/1345 , G09F9/00
摘要： PROBLEM TO BE SOLVED: To provide a technique for easily and inexpensively laying a circuit chip on a circuit board sheet so as to easily manufacture a display circuit board with high yield in which a circuit chip to control each pixel of a display is embedded.
SOLUTION: The circuit board sheet is provided to get a required number of circuit chips by selectively sticking and transferring from a circuit chip holding member holding circuit chips to the surface of the board sheet. The board sheet comprises a resin layer and a release mask with holes covering the surface of the resin layer, wherein the openings of the release mask with holes are formed corresponding to the positions where the required number of circuit chips are to be transferred. As the resin layer is selectively exposed on the surface of the circuit board sheet through the openings of the release mask with holes, the selectively exposed surface is used to lay the required number of circuit chips on its surface to manufacture a circuit board.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种在电路板片上容易且廉价地铺设电路芯片的技术，以便容易地制造高成品率的显示电路板，其中控制显示器的每个像素的电路芯片是嵌入式。解决方案：电路板片被提供以通过选择性地从电路芯片保持构件保持电路芯片粘附并转移到板片的表面来获得所需数量的电路芯片。板片包括树脂层和具有覆盖树脂层表面的孔的剥离掩模，其中具有孔的剥离掩模的开口对应于要传送所需数量的电路芯片的位置形成。当通过具有孔的释放掩模的开口将树脂层选择性地暴露在电路板片的表面上时，选择性地暴露的表面用于在其表面上铺设所需数量的电路芯片以制造电路板。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2007281156A Rear-surface-electrode type semiconductor heterojunction solar battery, and manufacturing method and apparatus thereof 审中-公开
标题翻译：后表面电极型半导体异质电池太阳能电池及其制造方法及装置
公开(公告)号：JP2007281156A
公开(公告)日：2007-10-25
申请号：JP2006104897
申请日：2006-04-06
申请人： Japan Advanced Institute Of Science & Technology Hokuriku , 国立大学法人北陸先端科学技術大学院大学
发明人： MATSUMURA HIDEKI , OHIRA KEISUKE
IPC分类号： H01L31/04 , H01L21/205
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To improve the productivity and the converting efficiency of a rear-surface-electrode type semiconductor heterojunction solar battery which is the solar battery having a semiconductor constituting an active region for so absorbing sunlight as to generate therein electrons and holes and having the n-type and p-type semiconductors constituting the regions for storing collectively the generated electrons and holes therein respectively, and wherein the n-type and p-type semiconductors and the semiconductor constituting the active region are made different from each other in their crystal structures and their basic compositions. SOLUTION: In the rear-surface-electrode type semiconductor heterojunction solar battery, both the n-type and p-type semiconductors for storing collectively electrons and holes therein respectively and the current deriving electrodes connected respectively with the semiconductors are disposed in the rear surface present on the opposite side to the surface irradiated by sunlight, and the n-type and p-type semiconductors are formed by a catalytic chemistry vapor-phase depositing method. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提高作为太阳能电池的后表面电极型半导体异质结太阳能电池的生产率和转换效率，该太阳能电池具有构成用于吸收太阳光的有源区域的半导体以产生电子，并且分别具有构成用于共同存储所产生的电子和空穴的区域的n型和p型半导体，并且其中构成有源区的n型和p型半导体和半导体彼此不同其晶体结构及其基本组成。解决方案：在后表面电极型半导体异质结太阳能电池中，分别用于共同存储电子和空穴的n型和p型半导体以及分别与半导体连接的电流导出电极设置在后表面存在于由太阳光照射的表面的相对侧上，并且通过催化化学气相沉积方法形成n型和p型半导体。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2007242661A Method of manufacturing semiconductor chip 审中-公开
标题翻译：制造半导体芯片的方法
公开(公告)号：JP2007242661A
公开(公告)日：2007-09-20
申请号：JP2006058960
申请日：2006-03-06
申请人： Ishikawa Seisakusho Ltd , Japan Advanced Institute Of Science & Technology Hokuriku , Japan Science & Technology Agency , 国立大学法人北陸先端科学技術大学院大学 , 株式会社石川製作所 , 独立行政法人科学技術振興機構
发明人： MATSUMURA HIDEKI , KIDA KENICHIRO
IPC分类号： H01L21/683 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor chips which can be positively peeled off from an adhesive tape, while maintaining a regular arrangement of the semiconductor chip, as it is. SOLUTION: The semiconductor chips 1 are fitted in a chip-forming adhesive tape t1 with the chips 1 gripped by a gripping means H for detachably gripping it, and the adhesive tape t1 on which the semiconductor chips 1 are stuck is etched in a fitting state. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造半导体芯片的方法，其可以保持半导体芯片的规则排列，从而可以从粘合带上肯定地剥离。解决方案：将半导体芯片1装配在芯片形成用胶带t1中，用夹持装置H夹持的芯片1可拆卸地夹持芯片1，并将其上粘附有半导体芯片1的粘合带t1蚀刻适合状态。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2007240574A Display device and driving method of display device 审中-公开
标题翻译：显示装置的显示装置和驱动方法
公开(公告)号：JP2007240574A
公开(公告)日：2007-09-20
申请号：JP2006058963
申请日：2006-03-06
申请人： Ishikawa Seisakusho Ltd , Japan Advanced Institute Of Science & Technology Hokuriku , Japan Science & Technology Agency , 国立大学法人北陸先端科学技術大学院大学 , 株式会社石川製作所 , 独立行政法人科学技術振興機構
发明人： MATSUMURA HIDEKI , MAENAKA KIMIHIRO
IPC分类号： G09G3/36 , G02F1/133 , G09G3/20 , G09G3/34
摘要： PROBLEM TO BE SOLVED: To provide a display device capable of improving image quality and reducing power consumption in spite of a large screen by providing a new technique which allows all pixels to be simultaneously driven at the same timing. SOLUTION: Each of a plurality of pixel driving elements 11 in the display device includes: a decoder 21 which separates a color signal, a luminance signal, a pixel address signal, and a pixel driving timing signal from a display pixel driving signal having these signals superposed one over another; a comparison circuit 26 which compares and collates the separated pixel signal with address information of a pertinent pixel driving element 11; and a storage circuit 27 wherein the separated luminance signal is temporarily stored. When comparison and collation result of the comparison circuit 26 indicates that the pixel address signal is identical to the address information of the pixel driving element 11, the pixel driving element 11 drives pixels in accordance with the timing of the luminance signal read from the storage circuit 27 on the basis of the pixel driving timing signal separated by the decoder 21. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够通过提供允许在相同定时同时驱动所有像素的新技术来提高图像质量并降低功耗的显示装置。解决方案：显示装置中的多个像素驱动元件11中的每一个包括：解码器21，其从显示像素驱动信号分离彩色信号，亮度信号，像素地址信号和像素驱动定时信号这些信号叠加在一起; 将分离的像素信号与相关像素驱动元件11的地址信息进行比较和比较的比较电路26; 以及存储电路27，其中分离的亮度信号被临时存储。当比较电路26的比较结果和对比结果表示像素地址信号与像素驱动元件11的地址信息相同时，像素驱动元件11根据从存储电路读取的亮度信号的定时来驱动像素基于由解码器21分离的像素驱动定时信号。（P）版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2007092166A Apparatus and method for thin film deposition, and compound thin film 审中-公开
标题翻译：薄膜沉积的装置和方法以及复合薄膜
公开(公告)号：JP2007092166A
公开(公告)日：2007-04-12
申请号：JP2006193747
申请日：2006-07-14
申请人： Japan Advanced Institute Of Science & Technology Hokuriku , 国立大学法人北陸先端科学技術大学院大学
发明人： MURATA HIDEYUKI , MATSUMURA HIDEKI , SUGITA TAKESHI , YOSHIDA MASAHIRO
IPC分类号： C23C16/44 , H01L21/31 , H01L21/312
摘要： PROBLEM TO BE SOLVED: To efficiently decompose each raw material gas when depositing a thin film by using a plurality of kinds of raw material gas. SOLUTION: A thin film deposition apparatus deposits a thin film on a substrate 2 by decomposition species generated by performing the contact decomposition of raw material gas with a catalyst 8, and comprises a raw material gas introduction mechanism (a shower head 4) for introducing two or more raw material gases, and at least two catalysts 8X, 8Y different in construction material and having selectivity for the decomposition of raw material gas. Two or more catalysts include, for example, a first catalyst containing nickel, and a second catalyst containing at least one to be selected from tungsten, tantalum, molybdenum, iridium, and rhenium. A polytetrafluoroethylene thin film is deposited by introducing hexafluoropropylene oxide as a first raw material gas, and at least one to be selected from hydrogen and ammonium as a second raw material gas. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了在通过使用多种原料气体沉积薄膜时有效地分解原料气体。解决方案：薄膜沉积设备通过用催化剂8进行原料气体的接触分解而产生的分解物质将基板2上的薄膜沉积在基板2上，并且包括原料气体导入机构（喷淋头4）用于引入两种或更多种原料气体，以及至少两种不同于建筑材料的催化剂8X，8Y，并且具有选择性的原料气体的分解。两种或更多种催化剂包括例如含镍的第一催化剂和含有至少一种选自钨，钽，钼，铱和铼的第二催化剂。通过引入作为第一原料气体的六氟环氧丙烷和作为第二原料气体的至少一个选自氢和铵的至少一种来沉积聚四氟乙烯薄膜。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2007067308A Method and apparatus for detecting end point, and phase reaction processing apparatus provided with end point detecting apparatus 审中-公开
标题翻译：用于检测端点的方法和装置，以及用端点检测装置提供的相位反应处理装置
公开(公告)号：JP2007067308A
公开(公告)日：2007-03-15
申请号：JP2005254343
申请日：2005-09-02
申请人： Japan Advanced Institute Of Science & Technology Hokuriku , Tokyo Ohka Kogyo Co Ltd , 国立大学法人北陸先端科学技術大学院大学 , 東京応化工業株式会社
发明人： TAKAO KAZUHISA , IKEDA HIROSHI , MATSUMURA HIDEKI , MASUDA ATSUSHI , UMEMOTO HIRONOBU
IPC分类号： H01L21/3065 , C23C14/54 , C23C16/44 , C23C16/52
摘要： PROBLEM TO BE SOLVED: To provide an end point detecting apparatus of peeling processing in a phase reaction processing apparatus. SOLUTION: In the end point detecting method, a catalyst arranged in a processing chamber is supplied with power and is heated at high temperature, and a reaction gas is decomposed by the heated catalyst to perform processing. In this method, a bypass passage 21 is provided on an exhaust line 17, and a discharge tube 22 through which an exhaust gas circulates is connected to the bypass passage 21. Emission spectrum of a specific component contained in the discharge gas generated from the discharge tube 22 is detected, and an end point of processing is determined based on a result of this detection. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供在相位反应处理装置中的剥离处理的终点检测装置。解决方案：在终点检测方法中，将布置在处理室中的催化剂供电并在高温下加热，并且反应气体被加热的催化剂分解以进行处理。在这种方法中，旁通通道21设置在排气管17上，排气循环的排放管22连接到旁路通道21.包含在从排出口产生的排放气体中的特定成分的排放光谱检测管22，并且基于该检测的结果确定处理的终点。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2005294559A Radical generating method and radical generator, thin film deposition equipment 审中-公开
标题翻译：辐射发生器和放电发生器，薄膜沉积设备
公开(公告)号：JP2005294559A
公开(公告)日：2005-10-20
申请号：JP2004108016
申请日：2004-03-31
申请人： Japan Advanced Institute Of Science & Technology Hokuriku , 国立大学法人北陸先端科学技術大学院大学
发明人： MATSUMURA HIDEKI , MASUDA ATSUSHI
IPC分类号： B01J35/02 , B01J35/04 , B01J35/06 , C23C16/44 , H01L21/3065 , H01L21/31
摘要： PROBLEM TO BE SOLVED: To supply uniform and high density radicals or cracked species by a small-scale structure.
SOLUTION: This thin film deposition equipment for catalytically cracking a feedstock gas by a catalyst and transporting and depositing the produced radicals or the cracked species on a substrate comprises a decompression chamber 101 for receiving the substrate 103, a plurality of holes 107a for supplying the feedstock gas supplied from a feedstock gas supply means into the decompression chamber 101, and the catalyst 107 disposed at a predetermined position the hole 107a for catalytically cracking the feedstock gas. The inner wall of the hole 107a is covered with the catalyst or covered with an insulating material which does not extinguish the radicals or the cracked species produced by the catalytic cracking of the feedstock gas, and the linear catalyst 107 is inserted into the hole 107a.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过小规模结构提供均匀和高密度自由基或裂纹物质。解决方案：用于通过催化剂催化裂化原料气体并将所产生的自由基或裂化物质输送和沉积在基材上的该薄膜沉积设备包括用于接收基材103的减压室101，用于接收基材103的多个孔107a 将从原料气体供给装置供给的原料气体供给到减压室101中，以及设置在预定位置的催化剂107用于催化裂化原料气体的孔107a。孔107a的内壁被催化剂覆盖，或被绝缘材料覆盖，绝缘材料不会消除由原料气体的催化裂化产生的自由基或裂化物质，并且线性催化剂107插入到孔107a中。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2014123689A Back surface electrode type solar cell element and method of manufacturing the same 审中-公开
标题翻译：背面电极型太阳能电池元件及其制造方法
公开(公告)号：JP2014123689A
公开(公告)日：2014-07-03
申请号：JP2012280379
申请日：2012-12-24
申请人： Japan Advanced Institute Of Science & Technology Hokuriku , 国立大学法人北陸先端科学技術大学院大学
发明人： MATSUMURA HIDEKI , KOYAMA KOICHI
IPC分类号： H01L31/04
CPC分类号： Y02E10/548
摘要： PROBLEM TO BE SOLVED: To provide a back surface electrode type solar cell element having a structure in which carrier surface recombination with crystalline silicon can be dramatically suppressed and a large part of the crystalline silicon surface is protected from ambient air.SOLUTION: A solar cell element 1 in which amorphous silicon thin films 3 and 13 are formed on the light receiving surface and the rear surface of a crystalline silicon substrate 2, and furthermore covered with silicon nitride films 4 and 14, has a structure in which pores are opened in the silicon nitride film 4 on the rear surface side of the silicon substrate 2 at a predetermined interval, point electrode groups 25 and 26 are formed in a position of the pore group, and electrodes are formed only on the rear surface side of the crystalline silicon substrate 2.
摘要翻译：要解决的问题：提供一种背面电极型太阳能电池元件，其具有能够显着抑制与晶体硅的载流子表面复合的结构，并且大部分晶体硅表面被保护免受环境空气的影响。解决方案：太阳能电池在晶体硅衬底2的光接收表面和后表面上形成非晶硅薄膜3和13的元件1，并且还被氮化硅膜4和14覆盖，具有在其中开孔的结构硅基板2的背面侧的氮化硅膜4以规定间隔形成，点电极组25,26形成在孔组的位置，电极只形成于晶体硅衬底的背面侧 2。

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