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1. 发明专利

JP2008294459A Multilayer printed wiring board 审中-公开
标题翻译：多层印刷接线板
公开(公告)号：JP2008294459A
公开(公告)日：2008-12-04
申请号：JP2008181170
申请日：2008-07-11
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： O TOUTO , SEKINE KOJI , ASAI MOTOO , SHIMADA KENICHI
IPC分类号： H05K3/46 , H05K1/03
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board having a resin interlayer dielectric layer excellent in reliability of connection of conductor circuits with each other, because dielectric constant and dielectric loss tangent are small, a signal delay and a signal error scarcely occur, and mechanical characteristics are excellent. SOLUTION: The multilayer printed wiring board includes a lower layer conductor circuit 4 formed on a substrate 1, a lower layer-resin interlayer dielectric layer 2 formed on the substrate and lower layer conductor circuit, an upper layer-conductor circuit 5 formed on the lower layer-resin interlayer dielectric layer, and an upper layer-resin interlayer dielectric layer formed on the lower layer-resin interlayer dielectric layer and upper layer conductor circuit, and is configured by connecting these conductor circuits through a via hole 7, wherein the upper layer-resin interlayer dielectric layer and lower layer-resin interlayer dielectric layer are formed of thermosetting cycloolefin based resin. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种具有彼此连接导体电路的可靠性优异的树脂层间绝缘层的多层印刷布线板，因为介电常数和介电损耗角正切较小，信号延迟和信号误差几乎不发生，机械特性优异。＆lt; P＆gt;解决方案：多层印刷线路板包括形成在基板1上的下层导体电路4，形成在基板上的下层树脂层间电介质层2和下层导体电路，形成上层导体电路5 在下层树脂层间绝缘层和下层树脂层间绝缘层和上层导体电路上形成的上层树脂层间绝缘层，通过通孔7连接这些导体电路，其中，上层树脂层间电介质层和下层树脂层间电介质层由热固性环烯烃类树脂形成。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2011071557A Multilayer printed wiring board 有权
标题翻译：多层印刷接线板
公开(公告)号：JP2011071557A
公开(公告)日：2011-04-07
申请号：JP2011002434
申请日：2011-01-07
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： WANG DONGDONG , SEKINE KOJI , ASAI MOTOO , SHIMADA KENICHI
IPC分类号： H05K3/46
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board having a resin interlayer dielectric layer excellent in reliability of connection of conductor circuits with each other, because dielectric constant and dielectric loss tangent are small, a signal delay and a signal error scarcely occur even if high frequency signals are used, and mechanical characteristics are excellent. SOLUTION: The multilayer printed wiring board includes a lower layer conductor circuit formed on a substrate, a lower layer-resin interlayer dielectric layer formed on the substrate and lower layer conductor circuit, an upper layer-conductor circuit formed on the lower layer-resin interlayer dielectric layer, and an upper layer-resin interlayer dielectric layer formed on the lower layer-resin interlayer dielectric layer and upper layer conductor circuit, and is configured by connecting these conductor circuits through a via hole, wherein the upper-layer conductor circuit is formed by a semi-additive method, and the upper layer-resin interlayer dielectric layer and lower layer-resin interlayer dielectric layer are formed of thermosetting cycloolefin based resin. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种具有彼此连接导体电路的可靠性优异的树脂层间绝缘层的多层印刷布线板，因为介电常数和介电损耗角正切较小，信号延迟和信号误差即使使用高频信号也几乎不发生，机械特性优异。解决方案：多层印刷电路板包括形成在基板上的下层导体电路，形成在基板上的下层树脂层间绝缘层和下层导体电路，形成在下层导体电路上的上层导体电路在上层树脂层间介质层和上层导体电路上形成的上层树脂层间绝缘层，并且通过通孔连接这些导体电路，其中上层导体电路通过半添加法形成，上层树脂层间电介质层和下层树脂层间绝缘层由热固性环烯烃类树脂形成。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2003023222A Printed circuit board 有权
标题翻译：印刷电路板
公开(公告)号：JP2003023222A
公开(公告)日：2003-01-24
申请号：JP2001207805
申请日：2001-07-09
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： SEKINE KOJI
IPC分类号： B32B27/04 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a circuit board for multilayered circuit board in which occurrence of incomplete contact or positional shift of a conductor circuit is suppressed at the time of laying printed circuit boards in multilayer. SOLUTION: In a circuitboard where a conductor circuit is formed on at least one side of an insulating basic material, the core material of the insulating basic material is formed of organic polymer, e.g. an aramid film, and impregnated with epoxy resin and the linear thermal expansion coefficient of the insulating basic material is set in the range of +10 ppm/ deg.C to -10 ppm/ deg.C.
摘要翻译：要解决的问题：提供一种在将印刷电路板铺设在多层中时抑制导体电路的不完全接触或位置偏移的发生的多层电路板的电路板。解决方案：在绝缘基材的至少一侧上形成导体电路的电路板中，绝缘基材的芯材由有机聚合物形成，例如，芳族聚酰胺膜，浸渍有环氧树脂，绝缘基材的线性热膨胀系数设定在+ 10ppm /℃〜-10ppm /℃的范围内。

4. 发明专利

JP2001102751A MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF 失效
公开(公告)号：JP2001102751A
公开(公告)日：2001-04-13
申请号：JP27677699
申请日：1999-09-29
申请人： IBIDEN CO LTD
发明人： ASAI MOTOO , SHIMADA KENICHI , SEKINE KOJI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board superior in heat cycle resistance and the manufacturing method thereof. SOLUTION: The multilayer printed wiring board has a layer insulation resin layer 2, made of a filmy insulating material containing a resin film 2a capable of being softened in a specified heating condition, and a B-stage resin 2b pasted to one side thereof. Furthermore, the board is manufactured by forming through-holes 9 through a core board 1, forming inner conductor circuits 4 on both sides of the core board having the through-holes, forming a roughened layer 11 on the top and side faces of the inner layer conductor circuits including through-hole lands and through-hole inner walls, pasting the filmy insulating material to the core board surface having the roughened layer with the B-stage resin faced thereto, softening the B-stage resin at specified heating and pressing conditions to fill up recesses defined by the side faces of the inner conductor circuits and the board surface and the through-holes, softening the resin film on the B-stage resin, and curing both the resins.

5. 发明专利

JP2001102750A MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF 失效
公开(公告)号：JP2001102750A
公开(公告)日：2001-04-13
申请号：JP27677599
申请日：1999-09-29
申请人： IBIDEN CO LTD
发明人： ASAI MOTOO , SHIMADA KENICHI , SEKINE KOJI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board superior in heat cycle resistance characteristics and the manufacturing method thereof. SOLUTION: This multilayer printed wiring board comprises a layer insulation resin material for electrically insulating conductor circuits 4 formed on a core board 1, a resin insulating material for burying recesses defined by the core board surface and the side faces of the conductor circuits, and the same resin material for filling through-holes 9 as the resin insulating material. It is made by forming the through-holes through the core board, forming the conductor circuits on both sides of the apertured board, forming a roughened layer 11 on the surface and side faces of the conductor circuits and through-hole inner walls, pasting resin films on both sides of the core board having the roughened layer, and filling and curing the softened resin film in the recesses between the core board and the conductor circuits and the through-holes in prescribed heating and pressing conditions.

6. 发明专利

JP2001094264A MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD 失效
公开(公告)号：JP2001094264A
公开(公告)日：2001-04-06
申请号：JP26932299
申请日：1999-09-22
申请人： IBIDEN CO LTD
发明人： SEKINE KOJI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board layer insulation resin layers having vias, superior in crack resistance and high in connection reliability. SOLUTION: The multilayer printed board has conductor circuits and layer insulation resin layers stacked one above the other on a board, the conductor circuits being connected by vias, and the insulation resin layers are made of a thermoplastic elastomer resin.

7. 发明专利

JP2001094258A METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD 失效
公开(公告)号：JP2001094258A
公开(公告)日：2001-04-06
申请号：JP26932199
申请日：1999-09-22
申请人： IBIDEN CO LTD
发明人： SHIMADA KENICHI , ASAI MOTOO , O TOUTO , SEKINE KOJI
IPC分类号： H05K3/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer printed wiring board whereby openings for vias having a uniform shape can be formed for a short time in manufacturing the multilayer printed wiring board which has a low dielectric constant or dielectric tangent and hardly causes the signal delay or signal errors, even if using high frequency signals at GHz bands. SOLUTION: The method of manufacturing a multilayer printed wiring board by repeating steps of laminating a resin insulation layer 102 on a board 1 having a conductor circuit 105 on the surface, forming openings 106 for vias into the resin insulation layer and forming a conductor circuit 5 including vias 7 on the insulation resin layer, uses a polyolefinic resin for the insulation resin layer, and irradiates it with a laser beam from an excimer laser through a mask 103 having through-holes 107 formed at portions corresponding to parts for forming the openings for the vias, thereby forming the openings for vias at once into the resin insulation layer.

8. 发明专利

JP2000244115A MANUFACTURE OF PRINTED WIRING BOARD 失效
公开(公告)号：JP2000244115A
公开(公告)日：2000-09-08
申请号：JP3859799
申请日：1999-02-17
申请人： IBIDEN CO LTD
发明人： ASAI MOTOO , SHIMADA KENICHI , O TOUTO , SEKINE KOJI
IPC分类号： H05K3/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To obtain a printed wiring board which exhibits a dimensional stability at high and low temperatures and which can be manufactured without being subjected to a roughening treatment. SOLUTION: In a method of manufacturing a printed wiring board by stacking a conductor layer and a resin-insulating layer on an insulating substrate 1, a thermosetting polyolefin resin film is stacked on the surface of the conductor layer and adhered thereto by thermal compression under a reduced pressure, thereby forming a resin- insulating layer 12. The method also includes during the manufacturing process, the steps of (1) forming the layer 12 by stacking a resin film made from a polyolefin resin on the surface of the conductor layer, bonding the resin film to the surface by thermocompression bonding under a reduced pressure, and thereafter curing the resulting resin film through heating, whereby the layer 12 is formed, (2) forming via hole forming openings by having the layer 12 irradiated with a laser beam and thereafter forming a metallic thin film on the surface of the layer 12 and on the inner wall surfaces of the via hole forming openings through sputtering, (3) forming a plating resist 16 on the metallic thin film, and thereafter forming an electrolytically plated film, and (4) forming a conductor circuit made of the metallic thin film and the electrolytically plated film through etching, after the resist 16 has been removed.

9. 发明专利

JP2000196225A PRINTED WIRING BOARD AND ITS MANUFACTURE 失效
公开(公告)号：JP2000196225A
公开(公告)日：2000-07-14
申请号：JP37447398
申请日：1998-12-28
申请人： IBIDEN CO LTD
发明人： ASAI MOTOO , SHIMADA KENICHI , O TOUTO , SEKINE KOJI
IPC分类号： H05K3/18 , C08L87/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board which can prevent generation of etching residue and cracks without lowering adhesion property between a layer resin insulation layer and a conductor circuit and a manufacturing method thereof. SOLUTION: The manufacturing method of a printed wiring substrate wherein a conductor circuit is formed with a conductive polymer layer 14 interposed on an insulation substrate 1 comprises at least following manufacturing processes (1) to (4); (1) a process for forming a conductive polymer layer 14 on an insulation substrate 1, (2) a process for forming plating resist 16 on the conductive polymer layer 14, (3) a process for forming a conductor layer 10 by electric plating on the conductive polymer 14 wherein the plating resist 16 is formed, and (4) a process for removing the conductive polymer 14 below the plating resist 16 by dissolving or decomposing the conductive polymer 14 after peeling the plating resist 16.

10. 发明专利

JP2001102752A MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF 失效
公开(公告)号：JP2001102752A
公开(公告)日：2001-04-13
申请号：JP27677799
申请日：1999-09-29
申请人： IBIDEN CO LTD
发明人： ASAI MOTOO , SHIMADA KENICHI , SEKINE KOJI
IPC分类号： H05K3/42 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board and the manufacturing method thereof which blocks the strippings or crackings due to the thermal expansion coefficient difference between a resin filler and layer insulation resin material, and eliminates deformation of the layer insulation resin layer under the condition of the heat cycle, etc. SOLUTION: This multilayer printed wiring board has a layer insulation resin layer 2 made of a three-layer filmy insulating material containing a first resin film 2a softening in a prescribed heating condition, a second resin film 2b which has a strength greater than that of the first resin 2a and softens in a higher temperature heating condition than that of the first resin 2a, and a B-stage resin 2c. The manufacturing method comprises pressing and heating the filmy insulating material at a prescribed pressure to soften or heating it to soften after pressing, filling and curing the fluidity-increased insulating material in recesses defined by the side faces of inner conductor circuits, including through-hole lands and the board surface and through-holes defined by the inner walls of the through-holes.

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