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1. 发明专利

JP2003129278A PROCESS FOR INHIBITING TIN WHISKER THROUGH PRE-TREATMENT 审中-公开
公开(公告)号：JP2003129278A
公开(公告)日：2003-05-08
申请号：JP2001318564
申请日：2001-10-16
申请人： ISHIHARA CHEMICAL CO LTD , DAIWA KASEI KENKYUSHO
发明人： UCHIDA MAMORU , TAMURA YASUSHI , TANAKA KAORU , NAWAFUNE HIDEMI , OBATA KEIGO , YOSHIMOTO MASAKAZU
IPC分类号： C25D5/34 , C25D7/00
摘要： PROBLEM TO BE SOLVED: To effectively inhibit tin whisker generation through a simple operation in a tin-coated film formed on the surface of a copper matrix or other materials to be plated to ensure good solderability, or the like. SOLUTION: In the subject process, tin whisker generation is inhibited through a pre-treatment step wherein (a) a metal thin film for base coating selected from silver, palladium, platinum, bismuth, indium, nickel, zinc, titanium, zirconium, aluminum, chromium and antimony is formed on the material to be plated, and (b) a tin- or thin alloy-plated film is formed on the metal thin film. The specific metal thin film interposed as a barrier between the material to be plated and the tin film in the upper layer prevents the formation of intermetallic compounds between tin and copper, and effectively inhibiting tin whisker. Compared to the conventional annealing treatment, the tin whisker-inhibiting process is more simplified, especially by forming the thin film by soaking the material to be plated into the pre-treatment solution.

2. 发明专利

JP2002356783A ELECTROLESS SILVER PLATING BATH 失效
公开(公告)号：JP2002356783A
公开(公告)日：2002-12-13
申请号：JP2001163465
申请日：2001-05-30
申请人： ISHIHARA CHEMICAL CO LTD
发明人： UCHIDA MAMORU , OKADA TAKASHI , TANAKA KAORU
IPC分类号： C23C18/42
摘要： PROBLEM TO BE SOLVED: To improve the stability of an electroless silver plating bath and the appearance of a silver film. SOLUTION: The electroless silver plating bath contains an aliphatic sulfide compound having one mono or disulfide bond and one or plural hydroxyl groups in molecules as a complexing agent. As the aliphatic sulfide compound, an oxyalkylene aliphatic sulfide compound having an oxyethylene group, an oxypropylene group or an oxy(hydroxypropylene) group in molecules adjacently to both sides or one side of a mono or disulfide bond is cited as a representative example. This sulfide compound smoothly works on silver ions in the bath, so that the aging stability of the bath is improved, and the color tone of the silver plated film obtained from the bath becomes homogeneous. Further, when thioureas, aminocarboxylic acids or the like are incorporated into the silver plating bath, the stability of the bath further improves.

3. 发明专利

JP2002004060A ELECTROLESS GOLD PLATING BATH 失效
公开(公告)号：JP2002004060A
公开(公告)日：2002-01-09
申请号：JP2000186079
申请日：2000-06-21
申请人： ISHIHARA CHEMICAL CO LTD
发明人： UCHIDA MAMORU , OKADA TAKASHI , TANAKA KAORU
IPC分类号： C23C18/42 , C23C18/44
摘要： PROBLEM TO BE SOLVED: To provide an electroless gold plating bath which is stable after being used for plating and with which a having an excellent appearance can be obtained. SOLUTION: The electroless gold plating bath contains, as a complexing agent, at least one of aliphatic sulfide compounds selected from oxyalkylene type sulfide compounds, each containing an oxyethylene group, an oxypropylene group or an oxy(hydroxyethylene) group or these groups in the repeated state, bonding to one side or both sides of a monosulfide or a disulfide in the molecule and carboxylic acid-type sulfide compounds, each having a carboxy group or carboxy groups bonding to an alkylene chain or alkylene chains bonded to one side or both sides of a monosulfide or a disulfide. For example, in the case of each oxyalkylene type sulfide compound, the sulfide-based compound forms a complex effectively with a gold ion by synergic electron-donating functions of the sulfur atom in the sulfide group and oxygen atoms in the repeated oxyalkylene chain, and thereby the plating bath is stabilized.

4. 发明专利

JPH1121673A LEAD-FREE ELECTROLESS TIN ALLOY PLATING BATH AND PLATING METHOD, AND ELECTRONIC PARTS HAVING LEAD-FREE TIN ALLOY FILM FORMED BY USING THE ELECTROLFSS PLATING BATH 失效
公开(公告)号：JPH1121673A
公开(公告)日：1999-01-26
申请号：JP19777197
申请日：1997-07-07
申请人： ISHIHARA CHEMICAL CO LTD
发明人： TSUJI SEIKI , NISHIKAWA TETSUJI , TANAKA KAORU
IPC分类号： C23C18/31 , C23C18/48 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To obtain a plating bath excellent in the joining strength and corrosion resistance of a film to be obtained and increased in the velocity of precipitation by making it possible to regulate a bath so as to form a lead-free tin alloy film which contains a mixture of stannous salt and salts of one or more kinds among eight metals such as Bi, one or more kinds among organic acids and inorganic acids, and a complexing agent and in which the composition ratio of the above metals forming an alloy together with tin is regulated to a specific value or above. SOLUTION: The plating bath contains the following (A), (B), (C): (A) a soluble metallic salt mixture of stannous salt and a salt of at least one metal selected from the group consisting of Bi, In, Sb, Zn, Co, Ag, and Cu; (B) at least one acid selected from organic acids, such as organic sulfonic acid and carboxylic acid, and inorganic acids, such as hydrochloric acid, sulfuric acid, and borofluoric acid; (C) a complexing agent. Further, the composition ratio of the above metals, such as Bi, forming an alloy together with tin is regulated to >=3 wt.% in total. The velocity of precipitation and the quality of a plating film are improved by further adding a reducing agent and a surface active agent.

5. 发明专利

JP2000192248A SUBSTITUTED GOLD PLATING BATH AND METAL PLATING METHOD USING THE BATH 失效
公开(公告)号：JP2000192248A
公开(公告)日：2000-07-11
申请号：JP36710798
申请日：1998-12-24
申请人： ISHIHARA CHEMICAL CO LTD
发明人： UCHIDA MAMORU , OKADA TAKASHI , TANAKA KAORU
IPC分类号： C23C18/42
摘要： PROBLEM TO BE SOLVED: To prevent the plating spreading, abnormal deposition, unequal deposition, etc., at the time of applying gold plating and extend the life of a substituted gold plating bath. SOLUTION: This plating bath contains a soluble gold salt, a complexing agent consisting of sulfite and thiosulfite, a concealing complexing agent consisting of oxycarboxylic acid, such as tartaric acid, an amine compound, such as aminoacetic acid or ethylenediamine and ammonium compd., a pH control agent, an amphoteric surfactant or a mixture composed of the amphoteric surfactant and a nonionic surfactant. The plating bath is characterized in that the sulfite and the thiosulfite are combined as the complexing agent, that the concealing complexing agent is used and that the kind of the surfactant is limited to the mixture of the amphoteric or amphoteric and nonionic system. The stabilization of the gold ions in the plating bath and the suppression of the plating spreading, etc., at the time of gold plating may be simultaneously achieved by the synergistic effect based on the constitution.

6. 发明专利

JP2000087252A ELECTROLESS TIN-BISMUTH ALLOY PLATING BATH 失效
公开(公告)号：JP2000087252A
公开(公告)日：2000-03-28
申请号：JP27936098
申请日：1998-09-14
申请人： ISHIHARA CHEMICAL CO LTD
发明人： TSUJI SEIKI , NISHIKAWA TETSUJI , TANAKA KAORU
IPC分类号： C23C18/48
摘要： PROBLEM TO BE SOLVED: To surely make eutectic tin-bismuth in an electroless tin-bismuth alloy plating bath and to obtain a plating film having bonding strength and appearance comparable to those of a tin coating or the like. SOLUTION: The electroless tin-bismuth alloy plating bath contains a soluble stannous salt, a soluble bismuth salt, at least one of an org. acid such as an org. sulfonic acid or an aliphatic carboxylic acid and an inorg. acid such as hydroborofluoric acid, hydrosilicofluoric acid or sulfamic acid and a complexing agent comprising a thiourea deriv. or a mixture of a thiourea compd. (thiourea or its deriv.) and an amine compd. such as an aminocarboxylic acid compd., a polyamine or an amino-alcohol. Since the complexing agent is used, it is not necessary to reduce the concn. of the bismuth salt and the ratio of the bismuth salt to the stannous salt in the bath, tin and bismuth are smoothly coprecipitated from the bath and the objective tin-bismuth alloy plating film is formed.

7. 发明专利

JPH11343578A ELECTROLESS TIN AND TIN-LEAD ALLOY PLATING BATH 失效
公开(公告)号：JPH11343578A
公开(公告)日：1999-12-14
申请号：JP16921498
申请日：1998-06-01
申请人： ISHIHARA CHEMICAL CO LTD
发明人： NISHIKAWA TETSUJI , TANAKA KAORU
IPC分类号： C23C18/48
摘要： PROBLEM TO BE SOLVED: To increase the adhesion and compactness, to enhance the high-temp. ageing stability of a plating bath and to prolong the service life of the bath by incorporating at least one kind among soluble metallic salts, org. acids and inorg. acids and at least one kind between a mixture of thiourea and thiourea derivative and a nitrogen-contg. compd. SOLUTION: The soluble metallic salt consists of either a stannous salt or a mixture of stannous salt and lead salt. The org. acid consists of org. sulfonic acid, aliphatic carboxylic acid, etc. The thiourea derivative is formed by linking a substituent to >=1 nitrogen atom or sulfur atom and has a larger moelcular volume than thiourea. The nitrogen-contg. compd. consists of imidazoline betaine, carboxybetaine and alkylamine oxide. Consequently, the bath is not decomposed or changed in color, hence the bath is extremely stable, and the bath is effective as an electroless plating bath. Further, since the electroless plating bath contains a reducing agent, the deposition rate of a plated film is increased, and the service life of the bath is also prolonged.

8. 发明专利

JPH05320918A TREATMENT OF SURFACE METAL BY PASTE COATING 失效
公开(公告)号：JPH05320918A
公开(公告)日：1993-12-07
申请号：JP15603992
申请日：1992-05-22
申请人： ISHIHARA CHEMICAL CO LTD
发明人： TSUJI SEIKI , SATO YOSHINOBU , TANAKA KAORU
IPC分类号： B23K35/22 , C23C20/02 , H05K3/24 , H05K3/34 , C23C18/08
摘要： PURPOSE:To enable precise metal coating by applying an org. sulfonate paste in a manner that the metal which constitutes the org. metal sulfonate is used as a donor metal and a metal having higher ionization degree tendency than the donor metal is used as an acceptor metal. CONSTITUTION:An org. sulfonate paste is prepared from a metal salt of org. sulfonic acid as the main component. The metal which constitutes the org. metal sulfonate is used as a donor metal and a metal having higher ionization degree tendency than the donor metal is used as an acceptor metal. This org. sulfonate paste is applied on the acceptor metal and maintained in an atmosphere heated at high temp. Thus, the donor metal precipitates due to the ionization tendency on the surface of the acceptor metal. Even when the paste print layer deviates from a pad in the process of applying the paste on a print circuit board, precipitation of the donor metal is limited to the area for the chemical substitution reaction where the acceptor metal is present, and thereby, the coating film can be selectively and precisely formed on the acceptor metal.

9. 发明专利

JP2003105553A REPLACED BISMUTH PLATING BATH 审中-公开
公开(公告)号：JP2003105553A
公开(公告)日：2003-04-09
申请号：JP2001295685
申请日：2001-09-27
申请人： ISHIHARA CHEMICAL CO LTD
发明人： UCHIDA MAMORU , TANAKA KAORU
IPC分类号： C23C18/31
摘要： PROBLEM TO BE SOLVED: To provide a bismuth plating bath of a replacement type which is stable for a long period of time, does not decompose and makes an excellent film obtainable. SOLUTION: This replaced bismuth plating bath uses aminocarboxylic acids and thioureas as a complexing agent, in which the aminocarboxylic acids are particularly preferably a diethylenetriamine pentaacetic acid having >=5 carboxy groups in the molecule, triethylenetetramine hexaacetic acid or hydroxyethylethylenediamine triacetic acid having a hydroxy group within the molecule. The aminocarboxylic acids of this replaced bismuth plating bath complex with the bismuth salt in the bath and stabilize the bath and the thiourea acts on a base metal (for example, a copper base metal) to accelerate the replacement reaction of the base metal and the mismuth and therefore the bath is excellent in the high-temperature stability with lapse of time and the film appearance obtainable from the bath.

10. 发明专利

JPH1161426A ELECTROLESS TIN AND TIN ALLOY PLATING BATH, ELECTROLESS PLATING AND ELECTRONIC PART COATED WITH TIN OR TIN ALLOY FILM IN THE ELECTROLESS PLATING BATH 失效
公开(公告)号：JPH1161426A
公开(公告)日：1999-03-05
申请号：JP24196897
申请日：1997-08-22
申请人： ISHIHARA CHEMICAL CO LTD
发明人： TSUJI SEIKI , NISHIKAWA TETSUJI , TANAKA KAORU
IPC分类号： C23C18/48 , C23C18/52 , H01L21/60 , H05K3/24
摘要： PROBLEM TO BE SOLVED: To decrease the growing activity of a dendrite in a plating film to be formed, to increase film forming property and joining strength and to improve reliability of a high-density product such as a fine pitch printed circuit board by adding a phosphorus compd. to a plating bath. SOLUTION: The plating bath consists of a soluble salt of either a stannous salt or a mixture of stannous salt and a specified metal such as bismuth, zinc and copper, and one of org. acids such as org. sulfonic acid and carboxylic acid and inorg. acids such as hydrochloric acid and sulfuric acid, and a complexing agent, and a dendrite inhibitor comprising a phosphorus compd. The phosphorus compd. is selected from inorg. phorphorus compds. such as orthophosphoric acid, pyrophosphoric acid, polyphosphoric acid, hypophosphorous acid, phosphorus acid, and their salts and org. phosphorus compds. such as methylene phosphonic acid, alkylphosphate and their salts. The phosphorus compd. may be used in a single state or a mixture and is added by 0.01 to 100 g/l, preferably 0.1 to 5 g/l in the plating bath.

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