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1. 发明专利

JP2005182962A Optical disk apparatus 有权
标题翻译：光盘设备
公开(公告)号：JP2005182962A
公开(公告)日：2005-07-07
申请号：JP2003426106
申请日：2003-12-24
申请人： Hitachi Ltd , Hitachi-Lg Data Storage Inc , 株式会社日立エルジーデータストレージ , 株式会社日立製作所
发明人： TOYODA HIROYUKI , OHASHI SHIGEO , YAMAUCHI YOSHIAKI , ODA KAZUHIRO , IBE MAKOTO
IPC分类号： G11B33/12 , G11B7/085 , G11B7/12 , G11B7/20 , G11B25/04 , G11B33/08 , G11B33/14
CPC分类号： G11B7/12 , G11B25/043 , G11B33/1406
摘要： PROBLEM TO BE SOLVED: To keep dustproof property and suppress rise of temperature of a pickup without increasing noise in an optical disk apparatus.
SOLUTION: It is prevented that heat of an electronic substrate affects a pickup through a case by providing a slit sealed by a tape at a case. It is prevented that heat of the electronic substrate affects the pickup side by a stream of air by providing a windbreak plate for blocking the stream from the electronic substrate to the pickup in the optical disk apparatus. Heat effect of the electronic substrate affecting the pickup is prevented by providing structure in which the electronic substrate and a top case are in contact with each other and propagating heat of the electronic substrate by a top cover which affect the pickup slightly.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了防止光学设备中的噪声，防止拾取器的温度上升，防止高温。解决方案：通过在壳体上设置由带密封的狭缝，防止电子基板的热量通过壳体影响拾取器。通过设置用于阻挡从电子基板到光盘装置中的拾取器的流的防风板，防止电子基板的热量受到空气流的影响。通过提供其中电子基板和顶壳彼此接触并且通过稍微影响拾取器的顶盖传播电子基板的热量的结构来防止影响拾取器的电子基板的热效应。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2006228262A Optical disk device 有权
标题翻译：光盘设备
公开(公告)号：JP2006228262A
公开(公告)日：2006-08-31
申请号：JP2005037040
申请日：2005-02-15
申请人： Hitachi Ltd , Hitachi-Lg Data Storage Inc , 株式会社日立エルジーデータストレージ , 株式会社日立製作所
发明人： SHIZUTANI MITSUTAKA , IBE MAKOTO , KONUMA HIDEYUKI , TSUBOTA SHINYA , YAMAUCHI YOSHIAKI , SASAO YOSHIFUMI , OCHI MANABU , TOYODA HIROYUKI
IPC分类号： G11B33/14 , G11B7/12 , G11B25/04
CPC分类号： G11B17/056 , G11B33/121
摘要： PROBLEM TO BE SOLVED: To improve heat radiation characteristics of an optical disk device for driving an optical disk medium such as a CD or a DVD. SOLUTION: This optical disk device includes a casing. The casing is provided with a top case 2 for covering the top surface of an optical disk 4, and a bottom case 3 combined with the top case to cover a part of the optical disk. A tray 5 for mounting the optical disk is received to move in the casing. An exhaust opening 16 is formed in at least one of the top surface of the top case and the part of the bottom case to cover the optical disk. The exhaust opening is disposed in the position of an outer-diameter side apart from the outer edge of the optical disk. Cool air introduced from the front bottom part of the casing into the casing is discharged from the exhaust opening to the outside of the casing. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了改善用于驱动诸如CD或DVD的光盘介质的光盘装置的散热特性。解决方案：该光盘装置包括壳体。壳体设置有用于覆盖光盘4的顶表面的顶壳体2和与顶壳体结合以覆盖光盘的一部分的底壳体3。接收用于安装光盘的托盘5以在壳体中移动。排气口16形成在顶壳的顶表面和底壳的一部分中的至少一个中以覆盖光盘。排气口设置在与光盘的外缘分开的外径侧的位置。从壳体的前底部引入壳体的冷空气从排气口排出到壳体的外部。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2013182439A Cooling system of electronic device 有权
标题翻译：电子设备冷却系统
公开(公告)号：JP2013182439A
公开(公告)日：2013-09-12
申请号：JP2012046057
申请日：2012-03-02
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： TAKEDA FUMIO , KONDO YOSHIHIRO , FUJII TATSURO , TOYODA HIROYUKI
IPC分类号： G06F1/20 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To improve heat transfer performance of an evaporator built in a thermal connector of a second vaporization-type cooling device (thermal highway) in an allowable installation space in a cooling system of an electronic device, and to prevent dryness of a heat transfer surface due to lowering of a liquid level during an operation.SOLUTION: The evaporator of the second vaporization-type cooling device (thermal highway) is provided with a slit formed in a direction orthogonal to an evaporation side surface of a heat transfer plate vertically arranged. The evaporator is provided with a liquid supply guide parallel with a liquid level of a coolant at an intermediate position in the height direction of the heat transfer plate. An opening of a steam/liquid pipe is arranged above the liquid supply guide to form a flow passage of a steam generated by the evaporator and the coolant condensed by a condenser. A wire net is provided on a top surface of the liquid supply guide, and a steam passage is provided in the liquid supply guide. A side plate having a height capable of storing the coolant is provided in a restriction-free edge of the liquid supply guide.
摘要翻译：要解决的问题：为了提高在电子设备的冷却系统中的允许的设置空间中的第二蒸发型冷却装置（热路公路）的热连接器内置的蒸发器的传热性能，并且防止干燥由于在操作期间由于液面的降低导致的传热面。解决方案：第二蒸发式冷却装置（热路公路）的蒸发器设置有沿与传热板的蒸发侧表面正交的方向形成的狭缝垂直排列。蒸发器在传热板的高度方向的中间位置处设置有与冷却剂的液面平行的液体供应引导件。蒸汽/液体管的开口布置在液体供应引导件的上方，以形成由蒸发器产生的蒸汽和由冷凝器冷凝的冷却剂的流动通道。在液体供给引导件的上表面上设有丝网，在液体供给引导件中设置有蒸汽通路。具有能够存储冷却剂的高度的侧板设置在液体供应引导件的无限制边缘中。

4. 发明专利

JP2011242077A Outside air introducing type data center 有权
标题翻译：外部引进型数据中心
公开(公告)号：JP2011242077A
公开(公告)日：2011-12-01
申请号：JP2010115602
申请日：2010-05-19
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KONDO YOSHIHIRO , NAKAJIMA TADAKATSU , TOYODA HIROYUKI , IDEI AKIO , SATO SHIGETADA
IPC分类号： F24F3/153 , F24F11/02
CPC分类号： H05K7/20745 , F24F2001/0088 , H05K7/20345 , Y02B30/545
摘要： PROBLEM TO BE SOLVED: To provide a cooling technique of an IT apparatus capable of performing a humidity control upon introducing an outside air for energy saving.SOLUTION: The data center includes: an outside air introducing blower 13 for introducing the outside air; an air conditioner room 10 with an air conditioner, which applies a temperature control to the introduced outside air, and which supplies a temperature-controlled air to a machine room housing IT equipment; an exhaust blower 14 for exhausting the air heated by the IT equipment of the machine room; and a water spray device 15 for spraying water on the air heated in the machine room, and for supplying the air with the water sprayed to an air-conditioned room. The air conditioner applies the temperature control to a mixed air consisting of the air with water sprayed and the air ventilated by an outside air introducing blower, and the mixed air is supplied to the machine room.
摘要翻译：要解决的问题：提供一种能够在引入外部空气以进行节能的情况下能够进行湿度控制的IT设备的冷却技术。
解决方案：数据中心包括：外部空气引入鼓风机13，用于引入外部空气; 具有空调的空调室10，其向引入的外部空气施加温度控制，并且将温度控制的空气供应到容纳IT设备的机器室; 用于排出由机房的IT设备加热的空气的排气鼓风机14; 以及喷水装置15，用于在机房内加热的空气上喷洒水，并向空气供给喷射到空调房间的水。空调机将温度控制器施加到由空气喷射的空气和由外部空气引入鼓风机通风的空气中的混合空气中，混合空气被供应到机器室。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2011047616A Cooling system and electronic device using the same 有权
标题翻译：使用该冷却系统和电子设备
公开(公告)号：JP2011047616A
公开(公告)日：2011-03-10
申请号：JP2009198179
申请日：2009-08-28
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： TOYODA HIROYUKI , NAKAJIMA TADAKATSU , KONDO YOSHIHIRO , SASAKI SHIGEYUKI , IDEI AKIO , SATO SHIGETADA
IPC分类号： F28D15/02 , H01L23/427
CPC分类号： F28D15/0266 , F28D1/05366 , F28D15/046 , F28F1/325 , F28F13/187 , F28F2215/12 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a cooling system utilizing a thermosyphon having superior energy-saving performance and ecological measure by efficient cooling, and a structure of an electronic device suitable for the cooling system. SOLUTION: This cooling system for the electronic device for cooling a CPU 200 loaded on a circuit board 100 in a housing, includes a heat receiving jacket 310 thermally connected with a surface of the CPU generating heat, and evaporating a liquid refrigerant received in an internal space of which a pressure is reduced by the heat generation, a condenser 320 receiving refrigerant vapor from the cooling jacket in the pressure-reduced internal space and transporting heat to the external of the device to condense the refrigerant vapor into liquid, a steam pipe 331, and a liquid return pipe 332, and utilizes the thermosyphon circulating the refrigerant by phase change. The condenser is composed of a flat tube having fine grooves along the refrigerant flowing direction on its inner wall surface and having a flat cross-section to efficiently cool the refrigerant vapor from the heat receiving jacket by its inner wall face. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种利用具有优异的节能性能和有效冷却的生态测量的热虹吸管的冷却系统，以及适用于冷却系统的电子设备的结构。解决方案：用于冷却装载在外壳中的电路板100上的CPU200的电子设备的该冷却系统包括与CPU产生热量的表面热连接的热接收套310，并且蒸发接收到的液体制冷剂在通过发热降压的内部空间中，冷凝器320从减压内部空间中的冷却套接收制冷剂蒸气，并将热量输送到装置的外部，以将制冷剂蒸气冷凝成液体，蒸汽管331和液体返回管332，并且利用通过相变来循环制冷剂的热虹吸管。冷凝器由在其内壁面上沿着制冷剂流动方向具有细槽的扁平管构成，并具有平坦的横截面，以通过其内壁面有效地冷却来自受热套的制冷剂蒸汽。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2010079406A Cooling device and electronic equipment equipped with the same 有权
标题翻译：冷却装置和与此相同的电子设备
公开(公告)号：JP2010079406A
公开(公告)日：2010-04-08
申请号：JP2008244279
申请日：2008-09-24
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： TOYODA HIROYUKI , IDEI AKIO , TSUBAKI SHIGEHIRO , NAKAJIMA TADAKATSU , KONDO YOSHIHIRO , HAYASHI TOMOO
IPC分类号： G06F1/20 , F28D15/02 , H01L23/427 , H05K7/20
CPC分类号： F28D15/043 , F28D15/046 , H01L2924/0002 , H05K7/20809 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a blade server equipped with a cooling structure on which a high performance CPU is mounted. SOLUTION: A groove is formed in a direction almost in parallel with a tube axial direction on the internal surface of a tube, and the cross-section of a fin column is exposed on the groove side face so that drainage performance of condensed operating fluid staying between fins can be increased. In installing a steam condensing tube, the groove is arranged at the lower side in the vertical direction of the center line of the tube axial direction of the steam condensing tube, and a steam condensing tube packed with wicks whose wire spacings are smaller than the fin spacings of the fin column is used for the inside of the groove. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种配备有安装有高性能CPU的冷却结构的刀片服务器。解决方案：在管内表面上沿与管轴方向几乎平行的方向形成槽，并且翅片柱的横截面暴露在槽侧面上，使得冷凝的排水性能可以增加在翅片之间保持的工作流体。在安装蒸汽冷凝管时，槽沿蒸汽冷凝管的管轴方向的中心线的垂直方向的下侧布置，并且包含芯线的蒸汽冷凝管，其芯间距小于翅片鳍状物的间距用于槽的内部。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2010079403A Cooling system for electronic equipment 审中-公开
标题翻译：电子设备冷却系统
公开(公告)号：JP2010079403A
公开(公告)日：2010-04-08
申请号：JP2008244271
申请日：2008-09-24
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： SHIN TAKAYUKI , NAKAJIMA TADAKATSU , MATSUSHIMA HITOSHI , KONDO YOSHIHIRO , TOYODA HIROYUKI , HAYASHI TOMOO , IDEI AKIO , TSUBAKI SHIGEHIRO
IPC分类号： G06F1/20 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To provide a cooling system for electronic equipment for efficiently transporting heat from a heating source such as a CPU in the electronic equipment such as a blade server to the outside. SOLUTION: The cooling system of electronic equipment such as the blade server in which a plurality of blades are mounted so as to be freely attached and detached in a casing, and a semiconductor device including a plurality of CPU whose heating values are different is mounted on the inside includes: a thermostat siphon 64 for transferring heating from a device whose heating value is relatively large to the outside; a heat tube 65 for transferring heat from the device whose heating value is relatively small to the thermostat siphon; a thermal highway 51 thermally connected to the plurality of thermostat siphons for transferring heat from the device to the outside; and a thermal connector 7 for thermally connecting the thermostat siphon with the thermal highway according as the blade is inserted into the device casing. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于电子设备的冷却系统，用于将诸如刀片服务器的电子设备中的诸如CPU之类的加热源的热量有效地传送到外部。解决方案：诸如叶片服务器的电子设备的冷却系统，其中安装多个叶片以便在壳体中自由地安装和拆卸;以及半导体器件，其包括多个CPU，其加热值不同安装在内部的装置包括：恒温器虹吸管64，用于将加热从发热量相对较大的装置传送到外部; 用于将热量从热值相对较小的装置传递到恒温器虹吸管的热管65; 热连接到多个恒温器虹吸管，用于将热量从装置传递到外部; 以及热连接器7，用于将恒温器虹吸管与热路由器按照叶片插入设备外壳中。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2009147156A Cooling device, and electronic apparatus using the same 有权
标题翻译：冷却装置和使用该装置的电子装置
公开(公告)号：JP2009147156A
公开(公告)日：2009-07-02
申请号：JP2007323623
申请日：2007-12-14
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KONDO YOSHIHIRO , IDEI AKIO , TSUBAKI SHIGEHIRO , MATSUSHIMA HITOSHI , NAKAJIMA TADAKATSU , TOYODA HIROYUKI , HAYASHI TOMOO , SAITO TATSUYA , KATO TAKESHI , OGIJI KENJI
IPC分类号： H05K7/20 , H01L23/427 , H05K7/18
CPC分类号： H05K7/20809 , G06F1/20 , G06F2200/201 , H05K7/20781
摘要： PROBLEM TO BE SOLVED: To provide a cooling device capable of optimally cooling a semiconductor device on a CPU blade which is freely attachable and detachable to/from an electronic apparatus, and to provide the small-sized electronic apparatus using it and capable of reducing power consumption.
SOLUTION: The cooling device for cooling the semiconductor device disposed on an electronic circuit board in a casing of the electronic apparatus includes a first cooling means having a first heat absorbing portion and a first heat releasing portion, and a second cooling means having a second heat absorbing portion and a second heat releasing portion. The first heat absorbing portion is disposed in contact with the semiconductor device, the second heat absorbing portion is detachably disposed in contact with the first heat releasing portion, a phase-change refrigerant is contained in the first cooling means, and the second heat releasing portion is disposed outside the casing.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够最佳地冷却可从电子设备自由地安装和拆卸的CPU刀片上的半导体器件的冷却装置，并且提供使用它的小型电子设备，并且能够降低功耗。解决方案：用于冷却设置在电子设备的壳体中的电子电路板上的半导体器件的冷却装置包括具有第一吸热部分和第一放热部分的第一冷却装置和具有第一冷却装置的第二冷却装置，第二吸热部和第二散热部。第一吸热部与半导体装置接触配置，第二吸热部与第一散热部可拆卸地配置，第一冷却机构包含相变制冷剂，第二散热部设置在壳体外部。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2012177959A Server device and electronic apparatus cooling system 有权
标题翻译：服务器设备和电子设备冷却系统
公开(公告)号：JP2012177959A
公开(公告)日：2012-09-13
申请号：JP2011039174
申请日：2011-02-25
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： TOYODA HIROYUKI , IDEI AKIO , TSUBAKI SHIGEHIRO , NAKAJIMA TADAKATSU , KONDO YOSHIHIRO , SATO SHIGETADA
IPC分类号： G06F1/20 , H05K7/18 , H05K7/20
CPC分类号： Y02D10/16
摘要： PROBLEM TO BE SOLVED: To reduce power of a fan and to reduce noise by the fan in an electronic apparatus such as a server.SOLUTION: In a server device, a plurality of servers are loaded on a rack, an air heat exchanger and a fan are provided on the upper part of the rack, the fan is provided inside the server as well, heat of main heat generating components inside the server is radiated by the air heat exchanger through heat transport means, heat other than the heat of the main heat generating components inside the server is cooled using the flow of air sucked from a server front surface by the fan loaded inside the server, and the exhaust is discharged to a server rear part. The air heat exchanger at the upper part of the rack is divided into a first air heat exchanger for sucking the air and radiating the heat from a rack front surface side and a second air heat exchanger for sucking the air and radiating the heat from a back surface side, and a coolant flowing through the heat transport means passes through the second air heat exchanger first and then passes through the first air heat exchanger.
摘要翻译：要解决的问题：为了降低风扇的功率，并降低诸如服务器的电子设备中的风扇的噪音。
解决方案：在服务器设备中，多个服务器被装载在机架上，空气热交换器和风扇设置在机架的上部，风扇也设置在服务器的内部，主体的热量服务器内部的发热部件通过热传输装置被空气热交换器辐射，除了服务器内部的主发热部件的热量之外，使用从服务器前表面吸入的空气流被冷却的风扇冷却服务器和排气被排放到服务器后部。机架上部的空气热交换器被分成第一空气热交换器，用于吸入空气并辐射来自齿条前表面的热量和第二空气热交换器，用于吸入空气并从后面散发热量并且流过热传输装置的冷却剂先通过第二空气热交换器，然后通过第一空气热交换器。版权所有（C）2012，JPO＆INPIT

10. 发明专利

JP2010080506A Electronic device and thermal connector used for the same 有权
标题翻译：电子设备和使用该设备的热连接器
公开(公告)号：JP2010080506A
公开(公告)日：2010-04-08
申请号：JP2008244238
申请日：2008-09-24
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： HAYASHI TOMOO , NAKAJIMA TADAKATSU , KONDO YOSHIHIRO , TOYODA HIROYUKI , IDEI AKIO , TSUBAKI SHIGEHIRO
IPC分类号： H05K7/20
CPC分类号： G06F1/185 , G06F1/20 , H05K7/20772
摘要： PROBLEM TO BE SOLVED: To provide an electronic device such as a blade server, in which a first cooling means fixed to a CPU exchanges heat with a second cooling means fixed to a housing and blades and the cooling means can be attached to or detached from the electronic device.
SOLUTION: The electronic device includes the first cooling means 61 of taking heat generated in the blade out of the blade and the second cooling means fixed to the housing to discharge the heat conducted from the first cooling means to outside the housing. The heat absorption portion 612 of the second cooling means has a thin and long cylindrical hole capable of enclosing the heat radiation portion of the first cooling means, and further includes a medium reservoir portion 6321 communicating with a gap in a thin and long pipe shape formed between the heat radiation portion of the first cooling means and the heat absorption portion of the second cooling means, when the heat radiation portion of the first cooling means is inserted into the heat absorption portion of the second cooling means, a heat conductive medium stored in the medium reservoir portion, and a pressing means of pressing the heat conductive medium stored in the medium reservoir portion to supply the heat conductive medium to the gap.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种电子装置，例如刀片服务器，其中固定到CPU的第一冷却装置与固定到外壳和刀片的第二冷却装置进行热交换，并且冷却装置可以附接到或从电子设备分离。解决方案：电子设备包括第一冷却装置61，其将在叶片中产生的热量从叶片中产生，而第二冷却装置固定到壳体，以将从第一冷却装置传导的热量排出到壳体的外部。第二冷却装置的吸热部分612具有能够包围第一冷却装置的散热部分的薄而长的圆柱形孔，并且还包括与形成有薄管状形状的间隙连通的介质储存部分6321 在第一冷却装置的散热部分和第二冷却装置的吸热部分之间，当第一冷却装置的散热部分插入第二冷却装置的吸热部分时，存储在介质储存部分和按压装置，用于挤压存储在介质储存部分中的导热介质以将导热介质供应到间隙。版权所有（C）2010，JPO＆INPIT

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