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1. 发明专利

JP2000076895A Semiconductor integrated circuit device 审中-公开
标题翻译：半导体集成电路设备
公开(公告)号：JP2000076895A
公开(公告)日：2000-03-14
申请号：JP24023298
申请日：1998-08-26
申请人： Hitachi Ltd , Hitachi Ulsi Systems Co Ltd , 株式会社日立製作所 , 株式会社日立超エル・エス・アイ・システムズ
发明人： ITO YUTAKA , MURANAKA MASAYA , OYAMADA MASAHIRO , TAKAHASHI AKIRA , SAKASHITA TADAMICHI , MATSUMOTO YOSHINORI
IPC分类号： G01R31/28 , G11C11/401 , G11C11/407 , G11C29/00 , G11C29/06
摘要： PROBLEM TO BE SOLVED: To shorten the applied time of stress voltage, and to conduct a screening test efficiently in a short time.
SOLUTION: When a bender test mode conducting a voltage acceleration test is entered, a test signal TM1 at a low level is input to step-down power circuits 15, 16 from a bender test circuit, a transistor 19 is turned on, and operation as an operational amplifier is stopped. An inverter 27 reaches a high-level output and a transistor 26 is turned on, a transistor 22 is turned on and voltage in the same extent as power-supply voltage Vcc is output from the step-down power circuits 15, 16, and optimum voltage stress is applied even to a peripheral circuit driven by power-supply voltage Vcc and step-down voltage VPERI, VDL and the voltage acceleration test can be performed.
COPYRIGHT: (C)2000,JPO
摘要翻译：要解决的问题：缩短应力电压的施加时间，并在短时间内有效进行筛选试验。解决方案：进入进行电压加速试验的弯曲试验模式时，从弯曲试验电路向低压电路15,16输入低电平的试验信号TM1，将晶体管19导通，将其作为运算放大器停止。反相器27到达高电平输出并且晶体管26导通，晶体管22导通，并且从降压功率电路15,16输出与电源电压Vcc相同程度的电压，并且最佳甚至对由电源电压Vcc和降压电压VPERI，VDL驱动的外围电路施加电压应力，并且可以执行电压加速度测试。

2. 发明专利

JP2000076896A Semiconductor integrated circuit apparatus 审中-公开
标题翻译：半导体集成电路设备
公开(公告)号：JP2000076896A
公开(公告)日：2000-03-14
申请号：JP24160398
申请日：1998-08-27
申请人： Hitachi Ltd , Hitachi Ulsi Systems Co Ltd , 株式会社日立製作所 , 株式会社日立超エル・エス・アイ・システムズ
发明人： MURANAKA MASAYA , TAKAHASHI AKIRA , ITO YUTAKA , OYAMADA MASAHIRO
IPC分类号： G01R31/28 , G06F12/14 , G06F12/16 , G06F21/24 , G11C11/401 , G11C11/407 , G11C29/00 , G11C29/14
摘要： PROBLEM TO BE SOLVED: To prevent an operation mode from starting wrong and from being set by a third party by making a count operation of a first counter circuit correspond to an input operation for input signals, practically stopping the operation of the first counter circuit when the operations do not coincide and permitting the operation mode by a maximum value output of the counted value.
SOLUTION: A comparing circuit CP compares complementary count signals of non-inversions Q0-Q3 and inversions Q0B-Q3B from a counter circuit CNT with address signals LA0-LA3 and inverting signals LA0B-LA3B from an input circuit INC, and outputs comparison outputs C0-C3. A judging circuit LC1 turns an output signal COIN to a low level when one of the comparison outputs C0-C3 is in an incoincidence state and clears the counter circuit CNT. A logic circuit LC5 counts count outputs of the counter circuit CND, that is, high levels of the non-inversions Q0-Q3 and forms a start signal OPEN when a counted value becomes 1111 in binary notation.
COPYRIGHT: (C)2000,JPO
摘要翻译：要解决的问题：为了防止操作模式从第三方开始错误并由第一计数器电路的计数操作对应于输入信号的输入操作，实际上停止第一计数器电路的操作，当操作不一致并允许操作模式通过计数值的最大值输出。解决方案：比较电路CP将来自计数器电路CNT的非反相Q0-Q3和反相Q0B-Q3B的互补计数信号与来自输入电路INC的地址信号LA0-LA3和反相信号LA0B-LA3B进行比较，并输出比较输出C0 -C3。当比较输出C0-C3中的一个处于不一致状态时，判断电路LC1使输出信号COIN变为低电平，并清除计数器电路CNT。逻辑电路LC5对计数器电路CND的计数输出进行计数，即非反相Q0-Q3的高电平，并且当以二进制符号计数值变为1111时，逻辑电路LC5形成起始信号OPEN。

3. 发明专利

JP2014041907A Electronic component mounting apparatus, a printed circuit board, and an electronic component mounting method 审中-公开
标题翻译：电子元件安装设备，印刷电路板和电子元件安装方法
公开(公告)号：JP2014041907A
公开(公告)日：2014-03-06
申请号：JP2012183218
申请日：2012-08-22
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： HAYASHI HIROTO , TAKAHASHI AKIRA
IPC分类号： H05K3/34 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus which improves the yield at the time of mounting electronic components.SOLUTION: The electronic component mounting apparatus comprises: heating means 14a to solder a plurality of component-side terminals 31 which a BGA 30 has and a plurality of substrate-side terminals 21 which a printed circuit board 20 has by heating paste solder p which has insulation properties before melting and conductive properties after melting; a converter 41 which applies voltage to predetermined terminals 21a-21e among the substrate-side terminals 21; a conductivity detection section 43 which detects conductivity with the voltage applied by the converter 41 through the BGA 30, from the printed circuit board 20; and a control section 44 which determines success or failure of soldering by monitoring the conductivity state by the conductivity detection section 43.
摘要翻译：要解决的问题：提供一种提高电子部件安装时的成品率的电子部件安装装置。解决方案：电子部件安装装置包括：加热装置14a，其焊接多个部件侧端子31，BGA 30 具有多个基板侧端子21，印刷电路板20具有通过加热在熔融之前具有绝缘性能的熔融焊料p和熔融后的导电性能而具有的; 对基板侧端子21之间的规定端子21a〜21e施加电压的转换器41; 电导率检测部43，其从印刷电路板20检测由转换器41通过BGA 30施加的电压的电导率; 以及控制部分44，其通过由电导检测部分43监测导电状态来确定焊接成功或失败。

4. 发明专利

JP2009141012A Printed-circuit board repairing equipment 有权
标题翻译：印刷电路板修理设备
公开(公告)号：JP2009141012A
公开(公告)日：2009-06-25
申请号：JP2007313828
申请日：2007-12-04
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： CHIBA SATOSHI , TAKAHASHI AKIRA
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide printed-circuit board repairing equipment which can heat an electronic component uniformly. SOLUTION: Printed-circuit board repairing equipment includes a supporting base 6 for holding and fixing a printed-circuit board on which a surface mounting component is mounted on a fixing base, and a nozzle 3 for supplying hot wind to the surface of the surface mounting component mounted on the printed-circuit board and melting solder for joining the printed-circuit board and the surface mounting component. The printed-circuit board repairing equipment supplies hot wind from the nozzle and melts the solder and removes the surface mounting component 1 which is a failed component in the printed-circuit board 2 on which the surface mounting component is mounted and replaces the component with a normal component. The nozzle includes a panel-shaped heater on the inner periphery wall side of the nozzle and heats the outer periphery portion of air flow ejected from the nozzle using the heater. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供能够均匀加热电子部件的印刷电路板修理设备。解决方案：印刷电路板修理设备包括用于保持和固定其上安装有表面安装部件的印刷电路板的支撑基座6，以及用于将热风供应到固定基座的表面上的喷嘴3 安装在印刷电路板上的表面安装部件和用于接合印刷电路板和表面安装部件的熔化焊料。印刷电路板修理设备从喷嘴供应热风，熔化焊料并除去作为安装表面安装部件的印刷电路板2中的故障部件的表面安装部件1，并且用正常组件。喷嘴在喷嘴的内周壁侧具有面板状的加热器，利用加热器加热从喷嘴喷出的气流的外周部。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2008182049A Repair device of electronic part 有权
标题翻译：电子部件维修设备
公开(公告)号：JP2008182049A
公开(公告)日：2008-08-07
申请号：JP2007014366
申请日：2007-01-24
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： ABE SHINSUKE , TAKAHASHI AKIRA , CHIBA SATOSHI
IPC分类号： H05K3/34 , B23K1/00 , B23K3/00 , B23K101/42
CPC分类号： H01L2224/14 , H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To provide a repair device of an electronic part like a BGA in which a terminal is in a concealed state upon mounting, wherein the terminal on the electronic part side upon remounting, is positioned to the terminal on the printed board side with a high accuracy.
SOLUTION: The repair device 1 of the electronic part comprises an X-ray photographing means 14 which captures each see-through image of a printed board 17 retained by an XY table 12 and a remounting electronic part 21 retained by an electronic part retainer 13. Based on a part side terminal group image and a board side terminal group image created for each of a part side terminal 23 and a board side terminal 26 from photographing data by this X-ray photographing means, the part side terminal group and board side terminal group are positioned with a high accuracy, and they are soldered in a positioning state with a high accuracy to remount the electronic part.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种如安装在终端处于隐藏状态的诸如BGA的电子部件的修理装置，其中重新安装时电子部件侧的终端位于终端上印刷板面精度高。解决方案：电子部件的修理装置1包括X射线摄影装置14，其捕获由XY台12保持的印刷电路板17和由电子部件保持的重新安装电子部件21的每个透明图像保持器13.基于通过该X射线拍摄装置拍摄数据，对部分侧端子23和板侧端子26中的每一个而产生的侧面端子组图像和板侧端子组图像，部分侧端子组和板侧端子组以高精度定位，并且以高精度焊接在定位状态以重新安装电子部件。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2007208294A Printed circuit board with rfid tag 有权
标题翻译：带RFID标签的印刷电路板
公开(公告)号：JP2007208294A
公开(公告)日：2007-08-16
申请号：JP2007118742
申请日：2007-04-27
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： TAKAHASHI AKIRA , KUSHIDA NORIYUKI , CHIBA SATOSHI , IMAMURA MAKOTO
IPC分类号： H05K1/02 , G06K19/07 , G06K19/077 , H05K1/18
CPC分类号： H05K1/0266 , H05K2201/10098
摘要： PROBLEM TO BE SOLVED: To fully secure communication distance of an RFID tag mounted on a printed circuit board and facilitate product management by the RFID tag in all parts mounting process thereon.
SOLUTION: In the printed circuit board 1 where at least one conductor layer is formed, and the RFID tag is mounted inside or on the surface, no wiring conductor pattern 3 is provided above and below the mounted RFID tag 2. Further, in the printed circuit board where one conductor layer is formed, and the RFID tag is mounted, at the portion of the printed circuit board where no wiring conductor pattern is provided, a through hole having equivalent sizes in length and width of the RFID tag is formed and the RFID tag is inserted therein.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了充分确保安装在印刷电路板上的RFID标签的通信距离，并且在其上的所有部件安装过程中促进RFID标签的产品管理。解决方案：在形成有至少一个导体层并且RFID标签安装在内部或表面上的印刷电路板1中，在安装的RFID标签2的上方和下方不设置布线导体图案3.此外，在形成有一个导体层的印刷电路板和RFID标签安装在不设置布线导体图形的印刷电路板的部分处，具有与RFID标签的长度和宽度相当的尺寸的通孔为并且将RFID标签插入其中。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2006269508A Printed-wiring board and method of determining erosion state 有权
标题翻译：印刷线路板和确定腐蚀状态的方法
公开(公告)号：JP2006269508A
公开(公告)日：2006-10-05
申请号：JP2005081849
申请日：2005-03-22
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： TAKAHASHI AKIRA , MIHARA MAKOTO , KUSHIDA NORIYUKI
IPC分类号： H05K3/34 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To precisely and easily determine the degree of erosion at a plated section in soldering for a printed-wiring board.
SOLUTION: For the printed-wiring board in which the plated section of a through-land 3, a wiring pattern 4, or the like is eroded by soldering in the soldering treatment for packaging components, a dummy pad 5 is provided that is a means for displaying the degree of erosion for specifying the degree of erosion at the plated section visually. The dummy pad is formed by a plurality of dummy pads 7a-7e in which erosion properties differ in steps. By visually recognizing the erosion state of the dummy pads, the erosion state of the plated section can be determined precisely and easily.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了精确和容易地确定印刷电路板的焊接中的电镀部分的侵蚀程度。解决方案：对于通过在包装部件的焊接处理中通过焊接侵蚀通过焊盘3，布线图案4等的电镀部分的印刷电路板，提供了虚拟焊盘5，是用于显示用于指定电镀部分的侵蚀程度的侵蚀程度的手段。虚拟焊盘由其中侵蚀性能不同步骤的多个虚拟焊盘7a-7e形成。通过目视识别虚拟焊盘的侵蚀状态，可以精确且容易地确定电镀部的侵蚀状态。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2013038108A Soldering reflow device 有权
标题翻译：焊接反射装置
公开(公告)号：JP2013038108A
公开(公告)日：2013-02-21
申请号：JP2011170511
申请日：2011-08-03
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： TAJIRI MASARU , TAKAHASHI AKIRA , SEYA HIROYUKI
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a soldering reflow device capable of mounting printed-wiring boards having difference widths on a transfer carrier and continuously doing soldering work when soldering the printed-wiring boards by using the transfer carrier.SOLUTION: A soldering reflow device comprises: a first conveyance path which conveys a substrate to/from a soldering reflow furnace 1; a carrying-in device 21 which mounts the substrate on a transfer carrier and carries the transfer carrier into the first conveyance path; a carrying-out device 22 which carries out the substrate from the transport carrier to a conveyance path of the next step; an adjustment device 23 for adjusting a transport carrier width dimension which adjusts the mounting width of the substrate of the transport carrier installed in the carrying-in device 21; a tag reader which reads information from an IC tag of the substrate; a control device 25 which instructs the adjustment device 23 for adjusting the transport carrier width dimension to adjust the width dimension on the basis of the substrate width information read by the tag reader; and a cooling device 24 which is installed in a second conveyance path which conveys the transport carrier and cools the transport carrier to a prescribed temperature.
摘要翻译：要解决的问题：提供一种焊接回流装置，其能够将具有差别宽度的印刷电路板安装在转印支架上，并且在通过使用转印支架焊接印刷电路板时不断进行焊接工作。焊接回流装置包括：向/从焊接回流炉1输送基板的第一输送路径; 携带装置21，其将基板安装在转印支架上，并将转印支架运送到第一输送路径中; 执行装置22，其将基板从运输托架运送到下一步骤的输送路径; 调节装置23，用于调节调节安装在搬运装置21中的运输工具的基板的安装宽度的运输工具宽度尺寸; 标签读取器，其从所述基板的IC标签读取信息; 控制装置25，其指示调整装置23调整传送载体宽度尺寸，以根据由标签读取器读取的基板宽度信息调整宽度尺寸; 以及冷却装置24，其安装在输送运输工具的第二输送路径中并将运输托架冷却至规定温度。版权所有（C）2013，JPO＆INPIT

9. 发明专利

JP2007066989A Printed circuit board with rfid tag 审中-公开
标题翻译：带RFID标签的印刷电路板
公开(公告)号：JP2007066989A
公开(公告)日：2007-03-15
申请号：JP2005247965
申请日：2005-08-29
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： TAKAHASHI AKIRA , KUSHIDA NORIYUKI , CHIBA SATOSHI , IMAMURA MAKOTO
IPC分类号： H05K1/02 , G01S13/75 , G01S13/76 , G01S13/79 , H05K3/46
CPC分类号： H05K1/0266 , H05K2201/10098
摘要： PROBLEM TO BE SOLVED: To secure a sufficient communication distance for an RFID tag attached to a printed circuit board and to conduct an easy product management by using the RFID tag in all steps of a process of mounting components on the printed circuit board.
SOLUTION: In the printed circuit board 1 which includes at least one conductor layer and has the RFID tag attached to the surface of the board or incorporated therein, there is no wiring pattern 3 of the conductor layer on the top and bottom faces of the RFID tag 2. In this printed circuit board 1, a through-hole having the same both crosswise and lengthwise sizes as the RFID tag is formed in a part of the printed circuit board which is not formed with a wiring pattern of the conductor layer, and the RFID tag is embedded in the through-hole.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了确保连接到印刷电路板的RFID标签的足够的通信距离，并且通过在印刷电路板上安装部件的过程的所有步骤中使用RFID标签来进行简单的产品管理。解决方案：在包括至少一个导体层并且具有附接到板的表面或并入其中的RFID标签的印刷电路板1中，在顶部和底部表面上不存在导体层的布线图案3 在该印刷电路板1中，在没有形成导体的布线图形的印刷电路板的一部分中形成有与RFID标签相同的横向和纵向尺寸的通孔层，并且RFID标签嵌入在通孔中。版权所有（C）2007，JPO＆INPIT

10. 发明专利

JP2012028712A Soldering apparatus and soldering method 有权
标题翻译：焊接设备和焊接方法
公开(公告)号：JP2012028712A
公开(公告)日：2012-02-09
申请号：JP2010168772
申请日：2010-07-28
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： ABE SHINSUKE , TAKAHASHI AKIRA
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To solve the problem in the conventional soldering with a large substrate in which: soldering cannot be completed because a printed substrate is curved; soldering jet splatters because molten solder is too close to the printed substrate; and the printed substrate and components are damaged because a nozzle touches a surface-mounted component.SOLUTION: A soldering apparatus comprises: a jet pump 6 for sucking molten solder up from a solder bath 5 where the molten solder is pooled and jetting it; and a nozzle 3 for guiding the sucked molten solder to a proper position for soldering. The soldering apparatus further comprises a wiring 15 for connecting wiring formed in a printed substrate 2 and the soldering bath 5. Electrical conduction in a circuit through the wiring helps a status to be detected in which an X-Y-Z table 7 controls a position of the nozzle or the printed substrate and the molten solder coming out of the nozzle contacts a through hole 12. When the conduction is detected, position control is conducted to adjust the X-Y-Z table at a proper position.
摘要翻译：要解决的问题：为了解决传统焊接中由于印刷基板弯曲而无法完成焊接的大型基板的问题，由于熔融焊料太靠近印刷基板，焊接喷溅飞溅; 并且印刷的基板和部件因为喷嘴接触表面安装部件而被损坏。焊接装置包括：喷射泵6，用于从焊料池5吸入熔融的焊料，熔融焊料被汇集并喷射; 以及用于将吸入的熔融焊料引导到用于焊接的适当位置的喷嘴3。焊接装置还包括用于连接形成在印刷基板2中的布线的布线15和焊接槽5.通过布线的电路中的导电有助于检测XYZ台7控制喷嘴位置的状态印刷基板和从喷嘴出来的熔融焊料接触通孔12.当检测到导通时，进行位置控制以将XYZ台调整到适当的位置。版权所有（C）2012，JPO＆INPIT

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