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1. 发明专利

JPS61101044A Semiconductor device, manufacture thereof and exposing device to be used thereon 失效
标题翻译：半导体器件，其制造及其使用的裸露器件
公开(公告)号：JPS61101044A
公开(公告)日：1986-05-19
申请号：JP22217984
申请日：1984-10-24
申请人： Hitachi Ltd , Hitachi Tokyo Electronics Co Ltd
发明人： MUNAKATA HIROSHI
IPC分类号： H01L21/30 , G03F7/20 , H01L21/027 , H01L21/60 , H01L21/768 , H01L23/522
CPC分类号： H01L24/82 , H01L2224/24 , H01L2224/24225 , H01L2224/24226 , H01L2224/73267 , H01L2924/01004 , H01L2924/01033 , H01L2924/01082 , H01L2924/15311 , H01L2924/00012
摘要： PURPOSE:To reduce the area of bonding and to perform a high density wiring by a method wherein each electrode pad of a pellet and each lead are electrically connected by a wiring in which a conductive film is provided by engraving in the prescribed form. CONSTITUTION:A pellet 2 whereon a plurality of electrode pads 3 are arranged on the circumferential part is bonded on an insulative base 1. A plurality of leads 4 whereon a pin 5 is connected are formed on the base 1. An insulating film 6 is formed on the base 1, and through hole conductors 7 and 8 are formed on the prescribed part of the insulating film 6. A plurality of wiring 9 is formed on the insulating film 6 in such a manner that it is connected to the conductors 7 and 8. Moreover, a protective film 10 is formed on the insulating film 6. As a result, a high density wiring can be accomplished by connecting the pads 3 and the leads 4 using the conductors 7 and 8 as above-mentioned.
摘要翻译：目的：为了减少接合面积，通过以规定的形式通过雕刻设置导电膜的布线将每个引线的每个电极焊盘电连接的方法来减小接合面积并进行高密度布线。构成：在圆周部分上布置多个电极焊盘3的颗粒2接合在绝缘基体1上。在基座1上形成有连接针5的多个引线4.形成绝缘膜6 在绝缘膜6的规定部分上形成有通孔导体7,8。在绝缘膜6上形成多个配线9，使其与导体7,8连接此外，在绝缘膜6上形成保护膜10.结果，如上所述，可以通过使用导体7和8连接焊盘3和引线4来实现高密度布线。

2. 发明专利

JPS6269629A ASSEMBLY DEVICE 失效
公开(公告)号：JPS6269629A
公开(公告)日：1987-03-30
申请号：JP20868485
申请日：1985-09-24
申请人： HITACHI LTD , HITACHI TOKYO ELECTRONICS
发明人： OSHIMA YOSHIO , ISHII YASUSHI , HIDAKA HIDEKI , MUNAKATA HIROSHI
IPC分类号： H01L21/60
摘要： PURPOSE:To stabilize the operation of the assembly tool by providing a magnetic shielding means on the side of each one way of the position sensors and the speed sensors. CONSTITUTION:In order to enable a series of bonding operations, which are carried out by means of a wedge 8, to correctly carry out, it is important that correct information on the position and moving speed of the wedge 8 are outputted from position sensors 14 and speed sensors 15 to a control part 16. There, a voice coil type linear motor 5 which is the magnetic noise generating source is provided with a magnetic shielding cover 6 and the output accuracy of the position sensors 14 and the speed sensors 15 is prevented from reducing due to a magnetic noise to generate from the coils 5a and so on of the voice coil type linear motor 5. By this constitution, the outputs of the position sensors 14 and the speed sensors 15 become correct, thereby the bonding operations, which are carried out by the wedge 8 to be controlled, can be stably and correctly carried out.

3. 发明专利

JPS60177638A RECOGNITION METHOD 失效
公开(公告)号：JPS60177638A
公开(公告)日：1985-09-11
申请号：JP3244284
申请日：1984-02-24
申请人： HITACHI OME ELECTRONIC CO , HITACHI LTD
发明人： MUNAKATA HIROSHI , KOUNO TETSUYA
IPC分类号： H01L21/60
摘要： PURPOSE:To contrive to improve the recognition rate of a wire junction device to the positionings of various types of leads for wire junction by a method wherein both of the sampling mode and the search extent for pattern recognition of the device are varied according to the dispersion of the configurations of the leads. CONSTITUTION:In case a wire junction of a lead 10 to a multipin package is performed, the lead 10 is picked up by a camera 11 in both of the initially set sampling mode and search extent, and a pattern matching 15 is performed. When there is a part (are indicated by broken lines) impossible to be recognized, the matching is performed using the sampling mode and the search extent as a variable respectively. Furthermore, the mode and the extent are varied, and the mode and the extent at a time when the recognition became impossible are respectively assumed the maximum sampling mode Mmax and the maximum search extent lmax and the mode and the extent at a time when the recognition became initially possible are respectively assumed the minimum sampling mode Mmin and the minimum search extent lmin. From these values, the optimum sampling mode and the optimum search extent are respectively determined, and the mode and the extent are utilized for subsequent recognitions. According to this constitution, the recognition rate of the wire junction device to the positioning of various types of leads is improved and the handling measures for the device to such various types of leads is made possible.

4. 发明专利

JPS61190953A WIRE BONDER 失效
公开(公告)号：JPS61190953A
公开(公告)日：1986-08-25
申请号：JP3038985
申请日：1985-02-20
申请人： HITACHI TOKYO ELECTRONICS , HITACHI LTD
发明人： MUNAKATA HIROSHI , TAKASUGI NOBUHIRO
IPC分类号： H01L21/60
摘要： PURPOSE:To enable a bonding at the central position of a lead by mounting an arithmetic operation section computing the position of indication of optimum bonding in the actual lead to a control system. CONSTITUTION:A control system 2 has a recognition section 21, which recognizes an inner lead 18A and an electrode pad 19A for a semiconductor structure 17 form a signal from a TV camera 20 and outputs the central position of the structure 17 as a recognition data, a memory section 22, which previously memorizes the relative quantities of deviation of the positions of indication of optimum bonding (positions where the center of a capillary must be positioned) to the central position of various inner leads and electrode pads as data, and an arithmetic operation section 23 determining the absolute positions of indication of optimum bonding of the inner lead 18A and the electrode pad 19A in the present semiconductor structure 17 by outputs from the recognition section 21 and the deviation data memorized to the memory section 22. Accordingly, a wire bonder can be automated.

5. 发明专利

JPS60161627A RECOGNIZING METHOD 失效
公开(公告)号：JPS60161627A
公开(公告)日：1985-08-23
申请号：JP1523484
申请日：1984-02-01
申请人： HITACHI OME ELECTRONIC CO , HITACHI LTD
发明人： MUNAKATA HIROSHI , KOUNO TETSUYA
IPC分类号： H01L21/60
摘要： PURPOSE:To shorten recognizing time by recognizing only one of a plurality of leads and relatively determining the positions of other leads in a method through which the positions of wire bonding of the leads are recognized by recognizing patterns. CONSTITUTION:A representative lead in leads divided at every group in predetermined number of a large number of leads 3 on a ceramic package 1 is selected, and the position P2 of the recognition of the representative lead 3b is recognized through pattern matching by an ITV camera. The position P1 of the lead such as a lead 3a is positioned where separate by DX1 in the direction of lead width and by DY1 in the direction of approximately lead length from the position P2 of the representative lead 3b, and the distances of DX1 and DY1 are given previously by design data, etc., thus easily obtaining the position P1 through the compensation of the position of the basis of the result of the recognition of the position P2. Recognition-disable probability due to dispersion of lead surfaces is reduced, and the rate of recognition is improved.

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