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1. 发明专利

JP2011009783A Metal polishing solution material and metal polishing solution 审中-公开
标题翻译：金属抛光解决方案材料和金属抛光解决方案
公开(公告)号：JP2011009783A
公开(公告)日：2011-01-13
申请号：JP2010226711
申请日：2010-10-06
申请人： Hitachi Chem Co Ltd , Hitachi Ltd , 日立化成工業株式会社 , 株式会社日立製作所
发明人： UCHIDA TAKESHI , HOSHINO TETSUYA , TERASAKI HIROKI , KAMIGATA YASUO , KOYAMA NAOYUKI , HONMA YOSHIO , KONDO SEIICHI
IPC分类号： H01L21/304 , B24B37/00 , C09G1/02 , C09K13/00 , C23F3/00 , H01L21/321
CPC分类号： C09G1/04 , C09G1/02 , C09K13/00 , C23F3/00 , C23F3/04 , C23F3/06 , H01L21/3212
摘要： PROBLEM TO BE SOLVED: To provide a metal polishing solution material in which a protective-film forming agent having low water solubility is dissolved at a high concentration without deposition, the metal polishing solution material allowing a metal polishing solution to be easily prepared by a diluent being added thereto when polishing is actually performed.SOLUTION: The metal polishing solution containing an oxidizing agent, an oxidized-metal dissolving agent, a protective-film forming agent, a dissolution promoter for the protective-film forming agent, and water; and a metal polishing solution material for preparing the metal polishing solution, the metal polishing solution material including an oxidized-metal dissolving agent, a protective-film forming agent, and a dissolution promoter for the protective-film forming agent.
摘要翻译：要解决的问题：为了提供一种金属抛光溶液材料，其中具有低水溶性的保护膜形成剂以高浓度溶解而不沉积，金属抛光溶液材料允许金属抛光溶液容易地由稀释剂制备在实际进行抛光时加入其中。溶液：含有氧化剂，氧化金属溶解剂，保护膜形成剂，保护膜形成剂的溶解促进剂和水的金属抛光溶液; 以及用于制备金属抛光溶液的金属抛光溶液材料，金属抛光液材料包括氧化金属溶解剂，保护膜形成剂和用于保护膜形成剂的溶解促进剂。

2. 发明专利

JP2007150353A Polishing liquid and polishing method for metal 有权
标题翻译：金属抛光液和抛光方法
公开(公告)号：JP2007150353A
公开(公告)日：2007-06-14
申请号：JP2007038626
申请日：2007-02-19
申请人： Hitachi Chem Co Ltd , Hitachi Ltd , 日立化成工業株式会社 , 株式会社日立製作所
发明人： UCHIDA TAKESHI , MATSUZAWA JUN , HOSHINO TETSUYA , KAMIGATA YASUO , TERASAKI HIROKI , HONMA YOSHIO , KONDO SEIICHI
IPC分类号： H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To form a highly reliable embedded pattern by sufficiently reducing the etching rate while keeping a high CMP rate. SOLUTION: A metal polishing liquid to be disclosed contains (1) an oxidizing agent for the metal, (2) a dissolving agent for the oxidized metal, (3) a first protecting-film forming agent, such as an amino acid or an azole, which physically adsorbs and/or forms chemical bonds to the surface of the metal to thereby form a protecting film, (4) a second protecting-film forming agent, such as polyacrylic acid, polyamido acid or a salt thereof, which assists the first protecting-film forming agent in forming a protecting film, and (5) water. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：通过在保持高CMP速率的同时充分降低蚀刻速率来形成高度可靠的嵌入图案。解决方案：要公开的金属抛光液含有（1）金属氧化剂，（2）氧化金属的溶解剂，（3）第一保护膜形成剂，例如氨基酸或物理吸附和/或形成与金属表面的化学键从而形成保护膜的唑，（4）第二保护膜形成剂，例如聚丙烯酸，聚酰胺或其盐，其中有助于形成保护膜的第一保护膜形成剂，和（5）水。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2007142467A Metal polishing solution and polishing method 有权
公开(公告)号：JP2007142467A
公开(公告)日：2007-06-07
申请号：JP2007038635
申请日：2007-02-19
申请人： Hitachi Chem Co Ltd , Hitachi Ltd , 日立化成工業株式会社 , 株式会社日立製作所
发明人： UCHIDA TAKESHI , MATSUZAWA JUN , HOSHINO TETSUYA , KAMIGATA YASUO , TERASAKI HIROKI , HONMA YOSHIO , KONDO SEIICHI
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To form a highly reliable embedding pattern by sufficiently decreasing an etching speed and maintaining a high CMP speed. SOLUTION: A metal polishing solution contains (1) an oxidizing agent for a metal; (2) a dissolving agent for an oxidized metal; (3) a first protective film-forming agent such as an amino acid or azoles which adsorbs physically on the surface of the metal film and/or forms a chemical bond, thereby forming a protective film; (4) a second protective film-forming agent such as polyacrylic acid, polyamide acid or a salt thereof for assisting the first protective film-forming agent in forming the protective film; and (5) water. COPYRIGHT: (C)2007,JPO&INPIT

4. 发明专利

JP2007105331A Measuring instrument of metabolic amount 有权
标题翻译：测量代谢量仪器
公开(公告)号：JP2007105331A
公开(公告)日：2007-04-26
申请号：JP2005300996
申请日：2005-10-14
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： ICHIGE YUKIKO , MIMAKI HIROSHI , NAGATA KOJI , UCHIDA TAKESHI , KIGUCHI MASAFUMI
IPC分类号： A61B5/22 , A61B5/01 , A61B5/028 , A61B5/117 , A61B5/145 , A61B5/1455 , G01N21/35 , G01N21/3577 , G01N21/359
摘要： PROBLEM TO BE SOLVED: To provide a method and an instrument capable of measuring a metabolic amount by a noninvasive technique based on physiological parameter measurement by a simple instrument constitution and a signal processing technique. SOLUTION: A simple metabolic amount is calculated by using metabolic amount calculation formula (6) considering the thermal balance of the body from parameters of the surface temperature of fingers, the temperature, environmental temperature, a blood flow, oxygen saturation, etc. (a metabolic amount [thermogenic amount] of the whole body)=α(T a -T c )+β(T FS -T R ) (6). In this formula, arterial blood temperature T a , the temperature T C , a heat capacity effective value α, the skin temperature T FS of the fingers, a room temperature T R and a convective heat conductivity effective value β are used. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够通过简单的仪器结构和信号处理技术基于生理参数测量的非侵入性技术测量代谢量的方法和仪器。
解决方案：考虑到手指表面温度，温度，环境温度，血流量，氧饱和度等参数对身体的热平衡，使用代谢量计算公式（6）计算出简单的代谢量。（全身的代谢量[生热量]）=α（T a -T c ）+β（T SB）（6）。在该公式中，动脉血温T a ，温度T C ，热容有效值α，皮肤温度T FS 手指，室温T R 和对流热导率有效值β。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2005237867A Blood sugar level measurement system and blood sugar level measuring instrument 有权
标题翻译：血液糖水平测量系统和血糖测量仪器
公开(公告)号：JP2005237867A
公开(公告)日：2005-09-08
申请号：JP2004055391
申请日：2004-02-27
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： UCHIDA TAKESHI , MIMAKI HIROSHI , CHO OK-KYUNG , KIM YOON-OK
IPC分类号： G01N33/66 , A61B5/00 , A61B5/01 , A61B5/145 , G01K13/00 , G01K17/08 , G01N21/35 , G01N21/3577 , G01N21/359 , G01N33/72 , G06F17/00
CPC分类号： A61B5/01 , A61B5/14532 , A61B5/1455 , A61B5/1495 , A61B2560/0223 , G01K13/002
摘要： PROBLEM TO BE SOLVED: To perform noninvasive measure of a blood sugar level based on temperature measurement. SOLUTION: A noninvasive blood sugar level measured by a temperature measurement method is corrected with oxygen saturation in blood and a blood flow volume to stabilize measured data. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：基于温度测量进行无创测量血糖水平。解决方案：通过温度测量方法测量的无创血糖水平用血液中的氧饱和度和血流量校正，以稳定测量数据。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2008066749A Material for metal polishing solution 有权
标题翻译：金属抛光材料
公开(公告)号：JP2008066749A
公开(公告)日：2008-03-21
申请号：JP2007293650
申请日：2007-11-12
申请人： Hitachi Chem Co Ltd , Hitachi Ltd , 日立化成工業株式会社 , 株式会社日立製作所
发明人： UCHIDA TAKESHI , HOSHINO TETSUYA , TERASAKI HIROKI , KAMIGATA YASUO , KOYAMA NAOYUKI , HONMA YOSHIO , KONDO SEIICHI
IPC分类号： H01L21/304 , B24B37/00
CPC分类号： Y02P20/52
摘要： PROBLEM TO BE SOLVED: To provide a material for a metal polishing liquid having a high concentration, wherein the cost for producing a metal polishing liquid is reduced, the number of the containers for used for storing/transporting the polishing liquid is also reduced, and the preserving area of the polishing solution and the volume of a tank for a polishing apparatus are diminished. SOLUTION: The material for a metal polishing liquid comprises: a protection film forming agent; and one ore more selected from an ester, an ether, a polysaccharide, amino acid salts, a polycarboxylic acid, polycarboxylic acid salts, vinyl polymers, sulfonic acid, sulfonic acid salts, and an amide, and the material for a metal polishing liquid is used as a mixture of constituents containing at least an oxidizer and water, with a diluent. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种高浓度金属研磨液的材料，其中制造金属研磨液的成本降低，用于储存/输送抛光液的容器数量也是减少了抛光液的保存面积和抛光装置的槽的体积。解决方案：用于金属抛光液的材料包括：保护膜形成剂; 和一个或多个选自酯，醚，多糖，氨基酸盐，多元羧酸，多元羧酸盐，乙烯基聚合物，磺酸，磺酸盐和酰胺的矿石，金属抛光液的材料是用作至少含有氧化剂和水的成分的混合物与稀释剂一起使用。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2007142466A Metal polishing solution and polishing method 审中-公开
标题翻译：金属抛光解决方案和抛光方法
公开(公告)号：JP2007142466A
公开(公告)日：2007-06-07
申请号：JP2007038634
申请日：2007-02-19
申请人： Hitachi Chem Co Ltd , Hitachi Ltd , 日立化成工業株式会社 , 株式会社日立製作所
发明人： UCHIDA TAKESHI , MATSUZAWA JUN , HOSHINO TETSUYA , KAMIGATA YASUO , TERASAKI HIROKI , HONMA YOSHIO , KONDO SEIICHI
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To form a highly reliable embedding pattern by sufficiently decreasing an etching speed and maintaining a high CMP speed.
SOLUTION: A metal polishing solution contains (1) an oxidizing agent for a metal; (2) a dissolving agent for an oxidized metal; (3) a first protective film-forming agent such as an amino acid or azoles which adsorbs physically on the surface of the metal film and/or forms a chemical bond, thereby forming a protective film; (4) a second protective film-forming agent such as polyacrylic acid, polyamide acid or a salt thereof for assisting the first protective film-forming agent in forming the protective film; and (5) water.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：通过充分降低蚀刻速度并保持高CMP速度来形成高度可靠的嵌入图案。解决方案：金属抛光溶液含有（1）金属氧化剂; （2）氧化金属的溶解剂; （3）在金属膜的表面上物理吸附和/或形成化学键的第一保护膜形成剂，例如氨基酸或唑类，从而形成保护膜; （4）第二保护膜形成剂如聚丙烯酸，聚酰胺酸或其盐，用于辅助第一保护膜形成剂形成保护膜; 和（5）水。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2008103746A Method for manufacturing metal polishing solution 有权
标题翻译：制造金属抛光溶液的方法
公开(公告)号：JP2008103746A
公开(公告)日：2008-05-01
申请号：JP2007293647
申请日：2007-11-12
申请人： Hitachi Chem Co Ltd , Hitachi Ltd , 日立化成工業株式会社 , 株式会社日立製作所
发明人： UCHIDA TAKESHI , HOSHINO TETSUYA , TERASAKI HIROKI , KAMIGATA YASUO , KOYAMA NAOYUKI , HONMA YOSHIO , KONDO SEIICHI
IPC分类号： H01L21/304 , C09K3/14
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal polishing solution capable of easily preparing a metal polishing solution by adding a diluent and the like to a high concentration-polishing solution material if an actual polishing is performed by using the high concentration-polishing solution material for transport, storage and the like. SOLUTION: The method for manufacturing a metal polishing solution constituted by containing an oxidizer, a metal oxide resolvent, a passivation forming agent, a solubilizing agent of the passivation forming agent, and water includes a mixing step that mixes a first component containing the oxidizer, a second component containing at least one component out of a component group consisting of the metal oxide resolvent, the passivation forming agent, and the solubilizing agent of the passivation forming agent, and the diluent. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造金属抛光溶液的方法，其能够通过向高浓度抛光溶液材料中添加稀释剂等容易地制备金属抛光溶液，如果通过使用用于运输，储存等的高浓度抛光溶液材料。解决方案：通过含有氧化剂，金属氧化物溶解剂，钝化剂，钝化剂的增溶剂和水构成的金属抛光液的制造方法包括混合步骤，将含有氧化剂，含有由金属氧化物溶解剂组成的组分中的至少一种组分的第二组分，钝化形成剂和钝化剂的增溶剂和稀释剂。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2007142465A Metal polishing solution and polishing method 有权
公开(公告)号：JP2007142465A
公开(公告)日：2007-06-07
申请号：JP2007038631
申请日：2007-02-19
申请人： Hitachi Chem Co Ltd , Hitachi Ltd , 日立化成工業株式会社 , 株式会社日立製作所
发明人： UCHIDA TAKESHI , MATSUZAWA JUN , HOSHINO TETSUYA , KAMIGATA YASUO , TERASAKI HIROKI , HONMA YOSHIO , KONDO SEIICHI
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To form a highly reliable embedding pattern by sufficiently decreasing an etching speed and maintaining a high CMP speed.
SOLUTION: A metal polishing solution contains (1) an oxidizing agent for a metal; (2) a dissolving agent for an oxidized metal; (3) a first protective film-forming agent such as an amino acid or azoles which adsorbs physically on the surface of the metal film and/or forms a chemical bond, thereby forming a protective film; (4) a second protective film-forming agent such as polyacrylic acid, polyamide acid or a salt thereof for assisting the first protective film-forming agent in forming the protective film; and (5) water.
COPYRIGHT: (C)2007,JPO&INPIT

10. 发明专利

JP2007142464A Metal polishing solution and polishing method 有权
标题翻译：金属抛光解决方案和抛光方法
公开(公告)号：JP2007142464A
公开(公告)日：2007-06-07
申请号：JP2007038630
申请日：2007-02-19
申请人： Hitachi Chem Co Ltd , Hitachi Ltd , 日立化成工業株式会社 , 株式会社日立製作所
发明人： UCHIDA TAKESHI , MATSUZAWA JUN , HOSHINO TETSUYA , KAMIGATA YASUO , TERASAKI HIROKI , HONMA YOSHIO , KONDO SEIICHI
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To form a highly reliable embedding pattern by sufficiently decreasing an etching speed and maintaining a high CMP speed.
SOLUTION: A metal polishing solution contains (1) an oxidizing agent for a metal; (2) a dissolving agent for an oxidized metal; (3) a first protective film-forming agent such as an amino acid or azoles which adsorbs physically on the surface of the metal film and/or forms a chemical bond, thereby forming a protective film; (4) a second protective film-forming agent such as polyacrylic acid, polyamide acid or a salt thereof assisting the first protective film-forming agent in forming the protective film; and (5) water.
COPYRIGHT: (C)2007,JPO&INPIT

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