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1. 发明专利

JP2005150757A Polishing liquid for metal and polishing method 审中-公开
标题翻译：用于金属和抛光方法的抛光液
公开(公告)号：JP2005150757A
公开(公告)日：2005-06-09
申请号：JP2004356962
申请日：2004-12-09
申请人： Hitachi Chem Co Ltd , Hitachi Ltd , 日立化成工業株式会社 , 株式会社日立製作所
发明人： UCHIDA TAKESHI , MATSUZAWA JUN , HOSHINO TETSUYA , KAMIGATA YASUO , TERASAKI HIROKI , HONMA YOSHIO , KONDO SEIICHI
IPC分类号： B24B37/00 , H01L21/304 , H01L21/306
摘要： PROBLEM TO BE SOLVED: To form an embedded pattern with high reliability by sufficiently reducing en etching rate and maintaining a CMP rate at a high level. SOLUTION: This polishing liquid comprises (1) a metal oxidizing agent, (2) a metal oxide dissolving agent, (3) a first protective film forming agent, such as amino acids and azoles, which form a protective film on the surface of a metal film by inducing physical adsorption and/or chemical bonding, (4) a second protective film forming agent, such as polyacrylic acids, polyamide acids or their salts, which assists the formation of the protective film by the first protective film forming agent, and (5) water. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过充分降低蚀刻速率并将CMP速率保持在高水平，形成具有高可靠性的嵌入图案。解决方案：该抛光液包括（1）金属氧化剂，（2）金属氧化物溶解剂，（3）第一保护膜形成剂，例如氨基酸和唑类，其形成保护膜通过诱导物理吸附和/或化学键合而形成金属膜的表面，（4）第二保护膜形成剂，例如聚丙烯酸，聚酰胺酸或其盐，其有助于通过第一保护膜形成形成保护膜代理商，（5）水。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2008103746A Method for manufacturing metal polishing solution 有权
标题翻译：制造金属抛光溶液的方法
公开(公告)号：JP2008103746A
公开(公告)日：2008-05-01
申请号：JP2007293647
申请日：2007-11-12
申请人： Hitachi Chem Co Ltd , Hitachi Ltd , 日立化成工業株式会社 , 株式会社日立製作所
发明人： UCHIDA TAKESHI , HOSHINO TETSUYA , TERASAKI HIROKI , KAMIGATA YASUO , KOYAMA NAOYUKI , HONMA YOSHIO , KONDO SEIICHI
IPC分类号： H01L21/304 , C09K3/14
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal polishing solution capable of easily preparing a metal polishing solution by adding a diluent and the like to a high concentration-polishing solution material if an actual polishing is performed by using the high concentration-polishing solution material for transport, storage and the like. SOLUTION: The method for manufacturing a metal polishing solution constituted by containing an oxidizer, a metal oxide resolvent, a passivation forming agent, a solubilizing agent of the passivation forming agent, and water includes a mixing step that mixes a first component containing the oxidizer, a second component containing at least one component out of a component group consisting of the metal oxide resolvent, the passivation forming agent, and the solubilizing agent of the passivation forming agent, and the diluent. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造金属抛光溶液的方法，其能够通过向高浓度抛光溶液材料中添加稀释剂等容易地制备金属抛光溶液，如果通过使用用于运输，储存等的高浓度抛光溶液材料。解决方案：通过含有氧化剂，金属氧化物溶解剂，钝化剂，钝化剂的增溶剂和水构成的金属抛光液的制造方法包括混合步骤，将含有氧化剂，含有由金属氧化物溶解剂组成的组分中的至少一种组分的第二组分，钝化形成剂和钝化剂的增溶剂和稀释剂。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2007142465A Metal polishing solution and polishing method 有权
公开(公告)号：JP2007142465A
公开(公告)日：2007-06-07
申请号：JP2007038631
申请日：2007-02-19
申请人： Hitachi Chem Co Ltd , Hitachi Ltd , 日立化成工業株式会社 , 株式会社日立製作所
发明人： UCHIDA TAKESHI , MATSUZAWA JUN , HOSHINO TETSUYA , KAMIGATA YASUO , TERASAKI HIROKI , HONMA YOSHIO , KONDO SEIICHI
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To form a highly reliable embedding pattern by sufficiently decreasing an etching speed and maintaining a high CMP speed.
SOLUTION: A metal polishing solution contains (1) an oxidizing agent for a metal; (2) a dissolving agent for an oxidized metal; (3) a first protective film-forming agent such as an amino acid or azoles which adsorbs physically on the surface of the metal film and/or forms a chemical bond, thereby forming a protective film; (4) a second protective film-forming agent such as polyacrylic acid, polyamide acid or a salt thereof for assisting the first protective film-forming agent in forming the protective film; and (5) water.
COPYRIGHT: (C)2007,JPO&INPIT

4. 发明专利

JP2007142464A Metal polishing solution and polishing method 有权
标题翻译：金属抛光解决方案和抛光方法
公开(公告)号：JP2007142464A
公开(公告)日：2007-06-07
申请号：JP2007038630
申请日：2007-02-19
申请人： Hitachi Chem Co Ltd , Hitachi Ltd , 日立化成工業株式会社 , 株式会社日立製作所
发明人： UCHIDA TAKESHI , MATSUZAWA JUN , HOSHINO TETSUYA , KAMIGATA YASUO , TERASAKI HIROKI , HONMA YOSHIO , KONDO SEIICHI
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To form a highly reliable embedding pattern by sufficiently decreasing an etching speed and maintaining a high CMP speed.
SOLUTION: A metal polishing solution contains (1) an oxidizing agent for a metal; (2) a dissolving agent for an oxidized metal; (3) a first protective film-forming agent such as an amino acid or azoles which adsorbs physically on the surface of the metal film and/or forms a chemical bond, thereby forming a protective film; (4) a second protective film-forming agent such as polyacrylic acid, polyamide acid or a salt thereof assisting the first protective film-forming agent in forming the protective film; and (5) water.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：通过充分降低蚀刻速度并保持高CMP速度来形成高度可靠的嵌入图案。解决方案：金属抛光溶液含有（1）金属氧化剂; （2）氧化金属的溶解剂; （3）在金属膜的表面上物理吸附和/或形成化学键的第一保护膜形成剂，例如氨基酸或偶氮，从而形成保护膜; （4）第二保护膜形成剂如聚丙烯酸，聚酰胺酸或其盐，辅助第一保护膜形成剂形成保护膜; 和（5）水。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2005101655A Polishing liquid for metal and grinding method 有权
标题翻译：抛光液用于金属和研磨方法
公开(公告)号：JP2005101655A
公开(公告)日：2005-04-14
申请号：JP2004356961
申请日：2004-12-09
申请人： Hitachi Chem Co Ltd , Hitachi Ltd , 日立化成工業株式会社 , 株式会社日立製作所
发明人： UCHIDA TAKESHI , MATSUZAWA JUN , HOSHINO TETSUYA , KAMIGATA YASUO , TERASAKI HIROKI , HONMA YOSHIO , KONDO SEIICHI
IPC分类号： B24B57/02 , B24B37/00 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To form a buried pattern which maintains high CMP rate and is excellent in reliability by reducing an etching rate sufficiently.
SOLUTION: The polishing liquid for metal contains: an oxidizing agent of metal (1); a metal oxide dissolving agent (2); a first protective film forming agent (3) which is amino acid or azoles and with which a protective film is formed on a surface of a metal film by physical absorption and/or formation of chemical bonding; second protective film forming agent (4) which is polyacrylic acid or polyamide acid or salt of polyamide acid and assists the first protective film forming agent to form a protective film, and water (5).
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过充分降低蚀刻速率来形成保持高CMP速率并且可靠性优异的掩埋图案。解决方案：金属抛光液含有：金属（1）的氧化剂; 金属氧化物溶解剂（2）; 第一保护膜形成剂（3），其是氨基酸或唑类，通过物理吸收和/或形成化学键在金属膜的表面上形成保护膜; 第二保护膜形成剂（4），其为聚丙烯酸或聚酰胺酸或聚酰胺酸盐，并辅助第一保护膜形成剂以形成保护膜，以及水（5）。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2004146840A Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using same 审中-公开
公开(公告)号：JP2004146840A
公开(公告)日：2004-05-20
申请号：JP2003371451
申请日：2003-10-31
申请人： Hitachi Chem Co Ltd , Hitachi Ltd , 日立化成工業株式会社 , 株式会社日立製作所
发明人： UCHIDA TAKESHI , HOSHINO TETSUYA , TERASAKI HIROKI , KAMIGATA YASUO , KOYAMA NAOYUKI , HONMA YOSHIO , KONDO SEIICHI
IPC分类号： B24B37/00 , C09K3/14 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing liquid for a metal, method for preparation thereof and polishing method using the same, that is adjusted easily and form padding pattern of a reliable metal film, by diluting high-concentration materials for a polishing liquid for a metal. SOLUTION: The materials for a polishing liquid for a metal, as the materials for preparing the polishing liquid for a metal, include an etching agent for an oxidized metal, an agent capable of forming a protection film, and an agent for assisting the dissolution of the agent capable of forming a protection film. COPYRIGHT: (C)2004,JPO

7. 发明专利

JP2011009783A Metal polishing solution material and metal polishing solution 审中-公开
标题翻译：金属抛光解决方案材料和金属抛光解决方案
公开(公告)号：JP2011009783A
公开(公告)日：2011-01-13
申请号：JP2010226711
申请日：2010-10-06
申请人： Hitachi Chem Co Ltd , Hitachi Ltd , 日立化成工業株式会社 , 株式会社日立製作所
发明人： UCHIDA TAKESHI , HOSHINO TETSUYA , TERASAKI HIROKI , KAMIGATA YASUO , KOYAMA NAOYUKI , HONMA YOSHIO , KONDO SEIICHI
IPC分类号： H01L21/304 , B24B37/00 , C09G1/02 , C09K13/00 , C23F3/00 , H01L21/321
CPC分类号： C09G1/04 , C09G1/02 , C09K13/00 , C23F3/00 , C23F3/04 , C23F3/06 , H01L21/3212
摘要： PROBLEM TO BE SOLVED: To provide a metal polishing solution material in which a protective-film forming agent having low water solubility is dissolved at a high concentration without deposition, the metal polishing solution material allowing a metal polishing solution to be easily prepared by a diluent being added thereto when polishing is actually performed.SOLUTION: The metal polishing solution containing an oxidizing agent, an oxidized-metal dissolving agent, a protective-film forming agent, a dissolution promoter for the protective-film forming agent, and water; and a metal polishing solution material for preparing the metal polishing solution, the metal polishing solution material including an oxidized-metal dissolving agent, a protective-film forming agent, and a dissolution promoter for the protective-film forming agent.
摘要翻译：要解决的问题：为了提供一种金属抛光溶液材料，其中具有低水溶性的保护膜形成剂以高浓度溶解而不沉积，金属抛光溶液材料允许金属抛光溶液容易地由稀释剂制备在实际进行抛光时加入其中。溶液：含有氧化剂，氧化金属溶解剂，保护膜形成剂，保护膜形成剂的溶解促进剂和水的金属抛光溶液; 以及用于制备金属抛光溶液的金属抛光溶液材料，金属抛光液材料包括氧化金属溶解剂，保护膜形成剂和用于保护膜形成剂的溶解促进剂。

8. 发明专利

JP2007150353A Polishing liquid and polishing method for metal 有权
标题翻译：金属抛光液和抛光方法
公开(公告)号：JP2007150353A
公开(公告)日：2007-06-14
申请号：JP2007038626
申请日：2007-02-19
申请人： Hitachi Chem Co Ltd , Hitachi Ltd , 日立化成工業株式会社 , 株式会社日立製作所
发明人： UCHIDA TAKESHI , MATSUZAWA JUN , HOSHINO TETSUYA , KAMIGATA YASUO , TERASAKI HIROKI , HONMA YOSHIO , KONDO SEIICHI
IPC分类号： H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To form a highly reliable embedded pattern by sufficiently reducing the etching rate while keeping a high CMP rate. SOLUTION: A metal polishing liquid to be disclosed contains (1) an oxidizing agent for the metal, (2) a dissolving agent for the oxidized metal, (3) a first protecting-film forming agent, such as an amino acid or an azole, which physically adsorbs and/or forms chemical bonds to the surface of the metal to thereby form a protecting film, (4) a second protecting-film forming agent, such as polyacrylic acid, polyamido acid or a salt thereof, which assists the first protecting-film forming agent in forming a protecting film, and (5) water. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：通过在保持高CMP速率的同时充分降低蚀刻速率来形成高度可靠的嵌入图案。解决方案：要公开的金属抛光液含有（1）金属氧化剂，（2）氧化金属的溶解剂，（3）第一保护膜形成剂，例如氨基酸或物理吸附和/或形成与金属表面的化学键从而形成保护膜的唑，（4）第二保护膜形成剂，例如聚丙烯酸，聚酰胺或其盐，其中有助于形成保护膜的第一保护膜形成剂，和（5）水。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2007142467A Metal polishing solution and polishing method 有权
公开(公告)号：JP2007142467A
公开(公告)日：2007-06-07
申请号：JP2007038635
申请日：2007-02-19
申请人： Hitachi Chem Co Ltd , Hitachi Ltd , 日立化成工業株式会社 , 株式会社日立製作所
发明人： UCHIDA TAKESHI , MATSUZAWA JUN , HOSHINO TETSUYA , KAMIGATA YASUO , TERASAKI HIROKI , HONMA YOSHIO , KONDO SEIICHI
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To form a highly reliable embedding pattern by sufficiently decreasing an etching speed and maintaining a high CMP speed. SOLUTION: A metal polishing solution contains (1) an oxidizing agent for a metal; (2) a dissolving agent for an oxidized metal; (3) a first protective film-forming agent such as an amino acid or azoles which adsorbs physically on the surface of the metal film and/or forms a chemical bond, thereby forming a protective film; (4) a second protective film-forming agent such as polyacrylic acid, polyamide acid or a salt thereof for assisting the first protective film-forming agent in forming the protective film; and (5) water. COPYRIGHT: (C)2007,JPO&INPIT

10. 发明专利

JP2008066749A Material for metal polishing solution 有权
标题翻译：金属抛光材料
公开(公告)号：JP2008066749A
公开(公告)日：2008-03-21
申请号：JP2007293650
申请日：2007-11-12
申请人： Hitachi Chem Co Ltd , Hitachi Ltd , 日立化成工業株式会社 , 株式会社日立製作所
发明人： UCHIDA TAKESHI , HOSHINO TETSUYA , TERASAKI HIROKI , KAMIGATA YASUO , KOYAMA NAOYUKI , HONMA YOSHIO , KONDO SEIICHI
IPC分类号： H01L21/304 , B24B37/00
CPC分类号： Y02P20/52
摘要： PROBLEM TO BE SOLVED: To provide a material for a metal polishing liquid having a high concentration, wherein the cost for producing a metal polishing liquid is reduced, the number of the containers for used for storing/transporting the polishing liquid is also reduced, and the preserving area of the polishing solution and the volume of a tank for a polishing apparatus are diminished. SOLUTION: The material for a metal polishing liquid comprises: a protection film forming agent; and one ore more selected from an ester, an ether, a polysaccharide, amino acid salts, a polycarboxylic acid, polycarboxylic acid salts, vinyl polymers, sulfonic acid, sulfonic acid salts, and an amide, and the material for a metal polishing liquid is used as a mixture of constituents containing at least an oxidizer and water, with a diluent. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种高浓度金属研磨液的材料，其中制造金属研磨液的成本降低，用于储存/输送抛光液的容器数量也是减少了抛光液的保存面积和抛光装置的槽的体积。解决方案：用于金属抛光液的材料包括：保护膜形成剂; 和一个或多个选自酯，醚，多糖，氨基酸盐，多元羧酸，多元羧酸盐，乙烯基聚合物，磺酸，磺酸盐和酰胺的矿石，金属抛光液的材料是用作至少含有氧化剂和水的成分的混合物与稀释剂一起使用。版权所有（C）2008，JPO＆INPIT

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