会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明专利
    • Semiconductor device, power converter using the same, power converter three-phase inverter using the same, and hybrid vehicle with the same mounted
    • 半导体器件,使用相同的功率转换器,使用相同功率转换器的三相逆变器,以及具有相同安装的混合动力车
    • JP2005259748A
    • 2005-09-22
    • JP2004065277
    • 2004-03-09
    • Hitachi Ltd株式会社日立製作所
    • TANBA AKIHIROSAITO RYUICHIISHIDA KAZUHITO
    • H01L23/473H01L25/07H01L25/18
    • H01L2224/48091H01L2224/48227H01L2224/73265H01L2924/1305H01L2924/13055H01L2924/00014H01L2924/00
    • PROBLEM TO BE SOLVED: To provide a compact semiconductor device having a cooling structure capable of efficiently cooling with a limited flow rate of cooling water and pressure loss when at least two sets of power semiconductor modules are to be packaged, a power converter using the device, a power converter three-phase inverter using the device, and a hybrid vehicle with the device mounted. SOLUTION: The semiconductor device includes power semiconductor elements 103, 104, 105 and 106 mounted and has first and second power semiconductor modules 101 and 102 with a metallic base on the bottom. The first and second power semiconductor modules 101 and 102 are mounted on both surfaces of a cooling medium flow path. Current supplied to the first power semiconductor module 101 is larger than that supplied to the second power semiconductor module 102. Heat dissipating ability of a metallic base 107 on the bottom of the first module 101 is larger than that of a metallic base 109 on the bottom of the second module 102. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:为了提供一种具有冷却结构的紧凑型半导体器件,当要封装至少两组功率半导体模块时,能够以有限的冷却水流量和压力损失来有效地冷却,功率转换器 使用该装置,使用该装置的功率转换器三相逆变器,以及安装该装置的混合动力车辆。 解决方案:半导体器件包括安装的功率半导体元件103,104,105和106,并且具有在底部具有金属基底的第一和第二功率半导体模块101和102。 第一和第二功率半导体模块101和102安装在冷却介质流路的两个表面上。 提供给第一功率半导体模块101的电流大于提供给第二功率半导体模块102的电流。第一模块101的底部上的金属基底107的散热能力大于底部的金属基底109的散热能力 第二模块102。(C)2005,JPO和NCIPI
    • 6. 发明专利
    • IDLE SPEED CONTROL METHOD AND DEVICE FOR ENGINE
    • JPH0249950A
    • 1990-02-20
    • JP19986588
    • 1988-08-12
    • HITACHI LTDHITACHI AUTOMOTIVE ENG
    • ISHIDA KAZUHITOSATO KOICHI
    • F02D41/16B60H1/32F02D9/02
    • PURPOSE:To enable a stale control to be attained by comparing the present engine speed with the preset idle speed and controlling a negative pressure actuator for driving a throttle valve to be driven by a negative pressure or atmospheric pressure introducing mode. CONSTITUTION:A negative pressure actuator 1 for controlling an idle speed opens and closes a throttle valve 7 through an idle adjusting lever 4 by an output of the negative pressure actuator 1, and its negative pressure chamber performs supply and cutoff of a negative pressure by the first negative pressure selector valve 2 provided interposing in a negative pressure hose 6. While the second negative pressure selector valve 3, serving as a three-way valve, is provided interposing between the first negative pressure selector valve 2 and the negative pressure chamber, performing the selection of introducing the negative pressure and the atmospheric pressure. Now when an engine speed reaches not more than or not less than the preset idle speed, the second negative pressure selector valve 3 is controlled selecting a mode of introducing the negative pressure or the atmospheric pressure and controlling the negative pressure actuator 1 to be driven.
    • 8. 发明专利
    • COOLING STRUCTURE FOR ELECTRONIC COMPONENT
    • JP2001068607A
    • 2001-03-16
    • JP24476099
    • 1999-08-31
    • HITACHI LTDHITACHI CAR ENG CO LTD
    • ISHIDA KAZUHITOHACHIMAN KOICHI
    • H01L23/36
    • PROBLEM TO BE SOLVED: To suppress warpage of a circuit board, to relax stress on soldered parts and to perform proper heat radiation even when a high heat conductor is interposed. SOLUTION: A circuit board 1 on which a semiconductor device 2 is mounted is fixed on bearing surfaces 5 formed on a heat radiating plate 3 by bolts 8, the distance 12 between a contact surface 3b formed on the heat radiating plate 3 and the substrate 1 is limited and a high heat conductor 4 whose thickness is limited is interposed in the gap. A concave part 3a for suppressing the loads imposed on the substrate 1 from the heat conductor 4 is provided on the contact surface 3b and an electronic component 7 is further disposed on the rear side of the circuit board 1 on the surface with which the heat conductor 4 is not in contact for suppressing the warpage of the substrate 1. Also, the state of the heat conductor 4 can be checked by a through hole 6 placed in the heat radiating plate 3 and the heat radiating plate 3 is connected to a housing to ensure a proper heat radiation.