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1. 发明专利

JP2009253213A Adhesive composition for flexible printed wiring board, adhesive film for flexible printed wiring board using the adhesive composition, and cover ray film for flexible printed wiring board 审中-公开
标题翻译：用于柔性印刷线路板的粘合组合物，用于柔性印刷电路板的粘合膜，以及用于柔性印刷线路板的覆盖膜
公开(公告)号：JP2009253213A
公开(公告)日：2009-10-29
申请号：JP2008102618
申请日：2008-04-10
申请人： Hitachi Kasei Polymer Co Ltd , 日立化成ポリマー株式会社
发明人： SUGANO HIDEJI , OBA HISAE
IPC分类号： H05K3/38 , C09J7/00 , C09J161/06 , C09J163/02 , C09J163/04 , C09J183/04 , C09J201/00 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition for a flexible printed wiring board, which is fire-resistant, can reduce resin flow-out during press processing and has reflow solder heat resistance capable of corresponding to lead-free soldering, and to provide an adhesive film and a cover ray film.
SOLUTION: The adhesive composition for the flexible printed wiring board contains elastomer (A), a heat curing component (B), a curing agent (C), an inorganic filler (D), and a silicon oligomer (E) uses a mixture of at least one of bisphenol A type epoxy resin and bisphenol F type epoxy resin and novolak type epoxy resin, and phenol resin as the heat curing component (B).
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供耐火的柔性印刷电路板用粘合剂组合物，可以减少压制加工期间的树脂流出，并且具有能够对应于无铅焊接的回流焊料耐热性，并提供粘合膜和覆盖光线膜。解决方案：用于柔性印刷线路板的粘合剂组合物包含弹性体（A），热固化组分（B），固化剂（C），无机填料（D）和硅低聚物（E）双酚A型环氧树脂和双酚F型环氧树脂和酚醛清漆型环氧树脂中的至少一种的混合物和酚醛树脂作为热固化组分（B）。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2009073971A Adhesive film with separator and adhesive film for flexible printed wiring board using it 审中-公开
标题翻译：带有分离器和粘合膜的粘合膜使用它的柔性印刷线路板
公开(公告)号：JP2009073971A
公开(公告)日：2009-04-09
申请号：JP2007245370
申请日：2007-09-21
申请人： Hitachi Kasei Polymer Co Ltd , 日立化成ポリマー株式会社
发明人： OBA HISAE , TAN MASAO , OIKAWA FUTOSHI
IPC分类号： C09J7/02 , C09J201/00 , H05K1/03 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide an adhesive film with a separator having appropriate mold release force, exhibiting excellent handling ease in peeling work and the like and having excellent slit property and punching workability, and to provide an adhesive film for a flexible printed wiring board using it.
SOLUTION: In the adhesive film with a separator, an adhesive film layer is provided on the side, to which a mold release agent is applied, in the separator formed by layering a film coated with alkyd resin-based mold release agent and paper. The adhesive film layer is formed of an adhesive comprising (A) an elastomer, (B) a thermosetting resin, and (C) a curing agent. The mold release force between the separator and the adhesive film layer is preferably 50-150 mN/10 mm in a peel test.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有合适的脱模力的隔膜的粘合剂膜，在剥离加工等方面表现出优异的处理容易性并且具有优异的狭缝性能和冲压加工性，并且提供了一种用于柔性的粘合剂膜印刷线路板使用它。解决方案：在具有隔膜的粘合膜中，在通过层压涂覆有醇酸树脂基脱模剂的膜而形成的隔板中，在其上施加有脱模剂的侧面上设置粘合膜层，以及纸。粘合膜层由包含（A）弹性体，（B）热固性树脂和（C）固化剂）的粘合剂形成。在剥离试验中，隔片和粘合膜层之间的脱模力优选为50-150mN / 10mm。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2012180472A Adhesive composition for flexible printed wiring board and coverlay film using the same 有权
标题翻译：用于柔性印刷线路板的胶粘组合物和使用其的覆盖膜
公开(公告)号：JP2012180472A
公开(公告)日：2012-09-20
申请号：JP2011045041
申请日：2011-03-02
申请人： Hitachi Kasei Polymer Co Ltd , 日立化成ポリマー株式会社
发明人： OBA HISAE , SUGANO HIDEJI
IPC分类号： C09J133/00 , C09J7/02 , C09J11/04 , C09J11/06 , C09J183/04 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition for a flexible printed wiring board having halogen-free flame retardancy and high heat resistance compatible with lead-free solder, and a coverlay film.SOLUTION: The adhesive composition for a flexible printed wiring board comprises an acrylic elastomer (A), a thermosetting component (B), pyrogallol (C), a metal phosphinate (D), an inorganic filler (E), and a silicone oligomer (F). The metal phosphinate (D) is one or more selected from aluminum phosphinate, calcium phosphinate and zinc phosphinate.
摘要翻译：要解决的问题：提供一种具有无卤阻燃性和与无铅焊料兼容的高耐热性的柔性印刷线路板的粘合剂组合物和覆盖膜。解决方案：用于柔性印刷线路板的粘合剂组合物包括丙烯酸类弹性体（A），热固性组分（B），连苯三酚（C），金属次膦酸盐（D），无机填料（E）和硅氧烷低聚物（F）。金属次膦酸盐（D）是选自次膦酸铝，次膦酸钙和次膦酸锌中的一种或多种。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2009007442A Adhesive composition for flexible printed wiring board and adhesive film for flexible printed wiring board obtained using the same 审中-公开
标题翻译：用于柔性印刷线路板的胶粘组合物和使用其的柔性印刷线路板的粘合膜
公开(公告)号：JP2009007442A
公开(公告)日：2009-01-15
申请号：JP2007168912
申请日：2007-06-27
申请人： Hitachi Kasei Polymer Co Ltd , 日立化成ポリマー株式会社
发明人： KUWABARA NORIKO , OBA HISAE , TAKANO MARE
IPC分类号： C09J201/08 , C09J7/00 , C09J109/02 , C09J161/06 , C09J163/00 , C09J183/00 , C09J183/02 , C09J183/04
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition for flexible printed wiring boards that hardly suffers from resin flow-out at the time of press, has reflowed-solder heat resistance coping with lead-free solder and exhibits excellent heat aging resistance, and an adhesive film.
SOLUTION: The adhesive composition for flexible printed wiring boards comprises a carboxy group-containing elastomer (A), an acrylonitrile-butadiene rubber (B) having a bound acrylonitrile content of 30-60 wt.%, a thermosetting component (C), an inorganic filler (D), a curing agent (E), and a silicone oligomer (F).
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供在压制时几乎不受树脂流出的柔性印刷线路板的粘合剂组合物，具有应对无铅焊料的回流焊料耐热性并且显示出优异的耐热老化性，和粘合膜。解决方案：柔性印刷电路板用粘合剂组合物包含含羧基的弹性体（A），结合丙烯腈含量为30-60重量％的丙烯腈 - 丁二烯橡胶（B），热固性组分（C ），无机填料（D），固化剂（E）和硅氧烷低聚物（F）。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2006328145A Adhesive composition for coverlay of flexible printed circuit board and the flexible printed circuit board given by using the same 有权
标题翻译：柔性印刷电路板用粘合剂组合物及使用该柔性印刷电路板的柔性印刷电路板
公开(公告)号：JP2006328145A
公开(公告)日：2006-12-07
申请号：JP2005150942
申请日：2005-05-24
申请人： Hitachi Kasei Polymer Co Ltd , 日立化成ポリマー株式会社
发明人： OBA HISAE , TAKAYAMA MURAKI , TAN MASAO , KOTANI JUNICHI , TAKANO MARE
IPC分类号： C09J201/00 , C09J11/04 , C09J161/10 , C09J163/00 , C09J183/04 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition for a coverlay, free from halogen, excellent in resistance to migration, flame retardancy, and peeling strength, and used in a flexible printed circuit board, and to provide the flexible printed circuit board given by using the same.
SOLUTION: This halogen-free adhesive composition is used for the coverlay of the flexible printed circuit board, wherein the adhesive composition for the coverlay contains an elastomer (A), a thermosetting component (B), a metal hydroxide, (D) a curing agent, and (E) a silicone oligomer. The elastomer (A) preferably has one or more functional groups reactive with a thermosetting resin of the thermosetting component (B). Further, a surface of the metal hydroxide (C) is preferably treated with the silicone oligomer (E).
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种无卤素，耐迁移性，阻燃性和剥离强度优异的覆盖物用粘合剂组合物，并用于柔性印刷电路板，并提供柔性印刷电路板使用相同。解决方案：该无卤素粘合剂组合物用于柔性印刷电路板的覆盖层，其中用于覆盖层的粘合剂组合物包含弹性体（A），热固性组分（B），金属氢氧化物（D ）固化剂，和（E）聚硅氧烷低聚物。弹性体（A）优选具有与热固性组分（B）的热固性树脂反应的一种或多种官能团。此外，金属氢氧化物（C）的表面优选用硅氧烷低聚物（E）处理。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2011068822A Adhesive film with separator 审中-公开
标题翻译：胶带胶带分离器
公开(公告)号：JP2011068822A
公开(公告)日：2011-04-07
申请号：JP2009222770
申请日：2009-09-28
申请人： Hitachi Kasei Polymer Co Ltd , 日立化成ポリマー株式会社
发明人： KUWABARA NORIKO , OBA HISAE
IPC分类号： C09J7/02 , B32B25/08 , B32B27/00 , B32B27/10 , B32B27/36 , C09J121/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive film with a separator that is easy to peel at a temperature of about 15-35°C and is excellent in workability of temporary attachment such that there is no gap between an adhesive layer and a separator at high temperatures. SOLUTION: The adhesive film with a separator includes: a polyester separator (A) which comprises a polyester film and is obtained by applying a non-silicone-based mold release agent to at least one surface of the polyester film; and a film-like adhesive layer (B) including synthetic rubber as an indispensable component, wherein separator release force is 0.01-3.0 N/50 mm at 23°C and 6.0-50.0 N/50 mm at 80-130°C. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种具有在约15-35℃的温度下容易剥离的隔膜的粘合剂膜，并且临时安装的可加工性优异，使得粘合剂层和粘合剂层之间不存在间隙高温分离器。＆lt; P＆gt;解决方案：具有隔膜的粘合膜包括：聚酯隔膜（A），其包含聚酯膜，并且通过将非硅氧烷类脱模剂涂布在聚酯膜的至少一个表面上而获得; 以及包含合成橡胶作为不可缺少的成分的膜状粘合剂层（B），其中在23℃下分离器释放力为0.01-3.0N / 50mm，在80-130℃下为6.0-50.0N / 50mm。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2011037971A Transparent adhesive resin composition for wiring board and transparent adhesive film for wiring board using the same 有权
标题翻译：用于接线板的透明胶粘剂组合物和使用它的导线板的透明胶粘剂
公开(公告)号：JP2011037971A
公开(公告)日：2011-02-24
申请号：JP2009185668
申请日：2009-08-10
申请人： Hitachi Kasei Polymer Co Ltd , 日立化成ポリマー株式会社
发明人： KUWABARA NORIKO , OBA HISAE
IPC分类号： C09J151/06 , C09J4/02 , C09J7/02 , C09J11/06 , C09J129/14 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a highly transparent adhesive resin composition for wiring boards wherein transparency and heat resistance are required, and a transparent adhesive film for wiring boards using the same.
SOLUTION: The transparent adhesive resin composition for wiring boards comprises 5-40 pts.mass acrylate compound (B) and 100 pts.mass polyvinyl butyral resin (A), and 0.1-10 pts.mass radical photopolymerization initiator (C) based on 100 pts.mass acrylate compound (B). Here, the acrylate compound (B) has a functional group having a functionality of 2 or higher, and contains no benzene ring and has an acid number of 3 mgKOH/g or less, and the polyvinyl butyral resin (A) has a degree of acetalization of 70-85 mass%, a vinyl acetate content of 1-15 mass% and a Tg (glass transition temperature) measured by DSC (differential scanning calorimetry: temperature rising rate of 10°C/min) of ≥65°C. The transparent adhesive film for wiring boards is a film formed from the same.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于需要透明度和耐热性的布线板的高度透明的粘合剂树脂组合物和使用该粘合剂的布线板的透明粘合剂膜。解决方案：用于布线板的透明粘合剂树脂组合物包含5-40重量份丙烯酸酯化合物（B）和100重量份聚乙烯醇缩丁醛树脂（A）和0.1-10重量份自由基光聚合引发剂（C）基于100质量份丙烯酸酯化合物（B）。这里，丙烯酸酯化合物（B）具有官能度为2以上的官能团，不含苯环，酸值为3mgKOH / g以下，聚乙烯醇缩丁醛树脂（A）的含量为乙酸乙烯酯含量为1-15质量％的缩醛化和通过DSC测定的Tg（玻璃化转变温度）（差示扫描量热法：10℃/分升温）为≥65℃。用于布线板的透明粘合膜是由其形成的膜。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2008198732A Adhesive film for circuit board, coverlay and circuit board using the same 有权
标题翻译：使用电路板，电路板和电路板的胶片
公开(公告)号：JP2008198732A
公开(公告)日：2008-08-28
申请号：JP2007030977
申请日：2007-02-09
申请人： Hitachi Kasei Polymer Co Ltd , Nippon Mektron Ltd , 日本メクトロン株式会社 , 日立化成ポリマー株式会社
发明人： OIKAWA FUTOSHI , OBA HISAE , HIRAHARA KENICHI , ISHIKAWA NAOTO , TOYAMA KEIZO
IPC分类号： H05K3/38 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide an adhesive film having an adhesive layer thinned as much as possible, having surface smoothness and capable of preventing an adhesive material from flowing to an opening of a terminal portion of a wiring pattern in a multilayer circuit board, and to provide a coverlay film.
SOLUTION: Adhesive layers (102, 103, ...) having different flowability are laminated in at least two or more layers as an adhesive layer 104 of the adhesive film 105 and the coverlay film 100, and a surface (103 side) having less flowability of the adhesive layer 104 is provided on the wiring pattern.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种具有尽可能薄化的粘合剂层的粘合剂膜，具有表面光滑度并且能够防止粘合剂材料流向多层电路中的布线图案的端子部分的开口板，并提供一个覆盖膜。解决方案：具有不同流动性的粘合剂层（102,103，...）作为粘合膜105和覆盖膜100的粘合剂层104至少层叠在两层以上，并且表面（103侧））在布线图案上设置有较少的粘合剂层104的流动性。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2006283002A Adhesive composition for flexible printed wiring board and adhesive film for flexible printed wiring board using it 有权
标题翻译：柔性印刷线路用粘合剂组合物及使用其的柔性印刷线路板胶带
公开(公告)号：JP2006283002A
公开(公告)日：2006-10-19
申请号：JP2006053922
申请日：2006-02-28
申请人： Hitachi Kasei Polymer Co Ltd , 日立化成ポリマー株式会社
发明人： KUWABARA NORIKO , OBA HISAE , YUASA TOMOHITO , TAKANO MARE
IPC分类号： C09J121/00 , C09J7/00 , C09J11/00 , C09J161/06 , C09J163/00 , C09J183/04 , H05K3/38
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition for a flexible printed wiring board with less flow-out of a resin during pressing and compatible with a lead-free solder, and an adhesive film for a flexible printed wiring board.
SOLUTION: The adhesive composition for the flexible printed wiring board contains (A) an elastomer, (B) a thermosetting component, (C) a curing agent, (D) an inorganic filler and (E) a silicone oligomer, and the adhesive film for the flexible printed wiring board uses the aforementioned adhesive composition for the flexible printed wiring board.
COPYRIGHT: (C)2007,JPO&INPIT

10. 发明专利

JP2010129751A Adhesive composite for wiring board and adhesive film for wiring board using the same, and cover ray film 审中-公开
标题翻译：用于接线板的粘合复合材料和使用其的接线板的粘合膜和覆盖膜
公开(公告)号：JP2010129751A
公开(公告)日：2010-06-10
申请号：JP2008302458
申请日：2008-11-27
申请人： Hitachi Kasei Polymer Co Ltd , 日立化成ポリマー株式会社
发明人： KUWABARA NORIKO , MORI KAZUHIKO , OBA HISAE
IPC分类号： H05K1/03 , C09J7/00 , C09J11/04 , C09J129/04 , C09J131/04 , C09J161/10 , C09J163/00 , C09J163/02 , C09J163/04 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composite for a wiring board, which is free of a fall of powder and has superior adhesive strength and high rigidity, and to provide: an adhesive film for the wiring board using the adhesive composite for the wiring board; and a cover ray film.
SOLUTION: The adhesive composite for the wiring board includes an epoxy resin (A) having two or more epoxy groups in one molecule, a phenol resin (B), a polyvinyl butyral resin (C), and a bulking agent (D) as essential components, wherein a cured body thereof has a bending modulus 10 to 35 GPa at 25°C. When the solid content of the adhesive composite is 100 parts by mass, it is preferable that (A) is 2 to 50 parts by mass, (B) 2 to 50 parts by mass, (C) 30 to 90 parts by mass, and (D) 10 to 80 parts by mass.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决问题的方案：提供一种布线板用粘合剂复合材料，其不含粉末而且具有优异的粘合强度和高刚性，并且提供：使用粘合剂复合材料的布线板用粘合膜用于接线板; 和覆盖射线胶片。解决方案：用于布线板的粘合剂复合物包括在一个分子中具有两个或更多个环氧基的环氧树脂（A），酚醛树脂（B），聚乙烯醇缩丁醛树脂（C）和填充剂（D ）作为必需成分，其固化体在25℃下的弯曲弹性模量为10〜35GPa。当粘合剂复合体的固体成分为100质量份时，优选（A）为2〜50质量份，（B）2〜50质量份，（C）30〜90质量份，以及（D）10〜80质量份。版权所有（C）2010，JPO＆INPIT

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