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1. 发明专利

JP2015052774A 加飾基板上におけるレジストパターン又は導電パターンの製造方法、及び転写形感光性導電フィルム审中-公开
标题翻译：用于制造装饰基板上的电阻图案或导电图案的方法，以及透射型感光导电膜
公开(公告)号：JP2015052774A
公开(公告)日：2015-03-19
申请号：JP2014136780
申请日：2014-07-02
申请人：日立化成株式会社 , Hitachi Chemical Co Ltd
发明人： YOSHIHARA KENSUKE , TANAKA HIROYUKI , NAKAMURA KANAMI
IPC分类号： G03F7/11 , G03F7/004 , G03F7/09 , G06F3/041
摘要：【課題】段差を有する加飾基板上にレジストパターン又は導電パターンを形成する際に気泡が発生することを抑制可能な加飾基板上におけるレジストパターン又は導電パターンの製造方法、及び前記製造方法に好適に用いることが可能な転写形感光性導電フィルムを提供する。【解決手段】支持フィルムと、前記支持フィルム上に設けられた感光層と、前記感光層上に設けられた保護フィルムとを備えた感光性フィルムを、前記保護フィルムを剥離した後に、前記感光層が加飾基板上に接するようにラミネートすることを含む、加飾基板への感光性フィルムのラミネート方法であって、前記保護フィルムはエンボス加工の施されたフィルムであり、前記加飾基板は段差を有し、前記感光層は前記加飾基板の段差以上の厚みを有する、加飾基板への感光性フィルムのラミネート方法。【選択図】図4
摘要翻译：要解决的问题：提供一种在装饰性基板上制造抗蚀剂图案或导电图案的方法，通过在具有台阶部分的装饰基板上形成抗蚀剂图案或导电图案来防止气泡的产生，并且可以适用于上述方法的转印型感光性导电膜。解决方案：提供一种在装饰性基材上层叠感光性膜的方法，其中包括支持膜的感光膜，设置在支撑膜上的感光层，并且通过使感光层与基板接触，将设置在感光层上的保护膜层压在去除保护膜之后的装饰基板上。保护膜是压花膜。装饰基板具有台阶部分; 并且感光层的厚度等于或大于装饰基板的台阶高度。

2. 发明专利

JP2014139021A Multilayer resin sheet and production method of the same, production method of multilayer resin sheet cured object, and high heat conduction resin sheet laminate and production method of the same 审中-公开
标题翻译：多层树脂片及其制造方法，多层树脂板固化物的制造方法以及高温导热树脂层压板及其制造方法
公开(公告)号：JP2014139021A
公开(公告)日：2014-07-31
申请号：JP2014046538
申请日：2014-03-10
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： KATAKI HIDEYUKI , TAKEZAWA YOSHITAKA , NISHIYAMA TOMOO , HARA NAOKI , TANAKA HIROYUKI , YOSHIHARA KENSUKE , KAMITSURA MASAYOSHI , TAKAHASHI HIROYUKI
IPC分类号： B32B27/38 , B32B7/02 , B32B27/00 , B32B27/34 , C08K3/00 , C08K5/54 , C08L61/10 , C08L63/00
CPC分类号： C09J177/00 , B32B7/02 , B32B7/12 , B32B15/088 , B32B15/092 , B32B27/08 , B32B27/20 , B32B27/26 , B32B27/28 , B32B27/34 , B32B27/38 , B32B2250/40 , B32B2264/10 , B32B2264/102 , B32B2307/206 , B32B2307/302 , B32B2307/304 , B32B2307/306 , B32B2457/00 , B32B2457/04 , B32B2457/20 , C08G59/621 , C08G73/14 , C08K3/013 , C08L63/00 , C08L2203/20 , C09J7/25 , C09J179/08 , C09J2461/00 , C09J2463/00 , C09J2463/006 , C09J2477/00 , C09J2479/086 , F21K9/00 , F21Y2115/10 , H01L23/051 , H01L23/145 , H01L23/49822 , H01L23/49833 , H01L24/33 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/07802 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , Y10T156/10 , Y10T428/28 , Y10T428/2896 , Y10T428/31522 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a multilayer resin sheet that can form a multilayer resin sheet cured object in which a high heat conduction ratio is possessed, insulation properties and adhesive strength are favorable, and further thermal impulse resistance is also excellent, and that is suitable for an electrical insulation material that is used for electric and electronic apparatuses.SOLUTION: A multilayer resin sheet includes: a resin layer including an epoxy resin having a mesogenic skeleton, a curing agent, and an inorganic filler; and an insulation properties adhesive layer disposed on at least one side of the resin layer, where the insulation properties adhesive layer includes at least one selected from a polyamide resin, a polyamideimide resin, and a modified polyamideimide resin.
摘要翻译：要解决的问题：为了提供可以形成具有高导热率的多层树脂片固化物的多层树脂片，绝缘性和粘合强度是有利的，并且进一步的耐热冲击性也优异，即适用于电气电子设备所用的电绝缘材料。解决方案：多层树脂片包括：具有介晶骨架的环氧树脂，固化剂和无机填料的树脂层; 绝缘性粘合层设置在树脂层的至少一面上，绝缘性粘合剂层含有选自聚酰胺树脂，聚酰胺酰亚胺树脂和改性聚酰胺酰亚胺树脂中的至少一种。

3. 发明专利

JP2013216038A Multi-layer resin sheet, multi-layer resin sheet cured material using the same, resin sheet laminate, semiconductor device 审中-公开
标题翻译：多层树脂片，多层树脂固化材料使用它们，树脂层压板，半导体器件
公开(公告)号：JP2013216038A
公开(公告)日：2013-10-24
申请号：JP2012090062
申请日：2012-04-11
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： GOTO MASAKI , KATAKI HIDEYUKI , HARA NAOKI , YOSHIHARA KENSUKE , NISHIYAMA TOMOO , TAKEZAWA YOSHITAKA
IPC分类号： B32B27/38 , B32B27/20 , C08G59/20
摘要： PROBLEM TO BE SOLVED: To provide a multi-layer resin sheet by which a multi-layer resin sheet cured material having high heat conductivity and excellent insulation property, adhesive strength, and thermal shock resistance can be formed, and which is excellent in flexibility, and provide the multi-layer resin sheet cured material using the same, a resin sheet laminate, and a semiconductor device.SOLUTION: A multi-layer resin sheet includes: a resin layer containing epoxy resin, a curing agent, and inorganic filler; and an adhesive layer arranged on at least one surface of the resin layer and formed of a resin composition containing the inorganic filler. Content of the inorganic filler contained in the adhesive layer is 30-80 mass%, and content of the inorganic filler contained in the resin layer is 80-93 mass%.
摘要翻译：要解决的问题：提供一种多层树脂片，通过该多层树脂片可以形成具有高导热性和优异的绝缘性，粘合强度和耐热冲击性的多层树脂片固化材料，并且其柔性优异，并提供使用其的多层树脂片固化材料，树脂片层压体和半导体器件。解决方案：多层树脂片包括：含有环氧树脂的树脂层，固化剂和无机填料; 以及粘合剂层，其设置在树脂层的至少一个表面上，并由含有无机填料的树脂组合物形成。粘合剂层中含有的无机填料的含量为30〜80质量％，树脂层中所含的无机填料的含量为80〜93质量％。

4. 发明专利

JP2013071991A Resin composition, b stage sheet, metal foil with applied resin, metal substrate and led substrate 审中-公开
标题翻译：树脂组合物，B级片，应用树脂金属箔，金属基材和LED基板
公开(公告)号：JP2013071991A
公开(公告)日：2013-04-22
申请号：JP2011211643
申请日：2011-09-27
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： AMANUMA SHINJI , KOBAYASHI YUJI , TANAKA HIROYUKI , HARA NAOKI , YOSHIHARA KENSUKE
IPC分类号： C08L63/00 , B32B15/092 , C08G59/20 , C08K3/22 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition which can form a resin cured product having a high thermal conductivity and high electrical insulation properties.SOLUTION: The resin composition comprises a bifunctional epoxy resin having a biphenyl skeleton, a phenol resin, and an alumina group whose particle diameter D50 corresponding to cumulative 50% from the small particle size side of the weight cumulative particle size distribution thereof is 0.1-30 μm, including volumetric contents of 60 vol% or more, and the hardened material has a divergence rate of 5.0% or less of a true specific gravity/theoretical specific gravity.
摘要翻译：解决的问题：提供一种能够形成具有高导热性和高电绝缘性的树脂固化产物的树脂组合物。解决方案：该树脂组合物包含具有联苯骨架的双官能环氧树脂，酚醛树脂和氧化铝基团，其粒径D50对应于其重量累积粒度分布的小粒径侧的累积50％为 0.1-30μm，体积含量为60体积％以上，硬化物的发散率为真比重/理论比重的5.0％以下。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2013048257A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2013048257A
公开(公告)日：2013-03-07
申请号：JP2012219740
申请日：2012-10-01
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： NISHIYAMA TOMOO , TAKEZAWA YOSHITAKA , KATAKI HIDEYUKI , HARA NAOKI , MIYAZAKI YASUO , YOSHIHARA KENSUKE
IPC分类号： H01L23/36 , C08K3/38 , C08L63/00 , H01L23/373
CPC分类号： H01B7/42 , B32B15/08 , H01L23/145 , H01L23/3735 , H01L23/3737 , H01L23/4334 , H01L23/473 , H01L24/33 , H01L2224/32225 , H01L2224/48091 , H01L2224/73265 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/181 , Y10T156/10 , Y10T428/25 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device including a resin sheet hardened material that is excellent in all of thermal conductivity, adhesive strength, and insulation properties.SOLUTION: The semiconductor device comprises: a semiconductor element 110; a resin sheet hardened material 102 that is arranged on the semiconductor element 110 and includes an epoxide resin monomer, a hardener, and fillers; and an adherend to which the semiconductor element 110 is adhered with a shear strength of 3 Mpa-12 MPa through the resin sheet hardened material 102. In a particle diameter distribution that is measured by using a laser diffraction method, the fillers have a peak in the respective ranges: 0.01 μm or more and less than 1 μm; 1 μm or more and less than 10 μm; and 10 μm or more and 100 μm or less. One of the fillers, which has a particle size of 10 μm or more and 100 μm or less, includes a boron nitride filler.
摘要翻译：解决的问题：提供一种包括导热性，粘合强度和绝缘性全部优异的树脂片硬化材料的半导体装置。解决方案：半导体器件包括：半导体元件110; 布置在半导体元件110上并包含环氧树脂单体，硬化剂和填料的树脂片硬化材料102; 以及半导体元件110通过树脂片硬化材料102以3MPa〜12MPa的剪切强度粘合的被粘物。在通过使用激光衍射法测量的粒径分布中，填料在各自的范围为0.01μm以上且小于1μm; 1μm以上且小于10μm; 10μm以上且100μm以下。粒径为10μm以上且100μm以下的填料之一包含氮化硼填料。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2012229342A Resin composition for epoxy-based coating material 审中-公开
标题翻译：用于环氧涂料的树脂组合物
公开(公告)号：JP2012229342A
公开(公告)日：2012-11-22
申请号：JP2011098593
申请日：2011-04-26
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： HARA NAOKI , TANAKA HIROYUKI , AMANUMA SHINJI , YOSHIHARA KENSUKE
IPC分类号： C09D163/00 , C08G59/24 , C09D7/12 , C09D161/06
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for an epoxy-based coating material in which a filler does not settle out when coating, and which is ease of handling and good in heat dissipation capability when formed into a coating film, and has high hardness so that the coating film is less likely to get damaged.SOLUTION: The resin composition for an epoxy-based coating material contains a mixture of an epoxy resin having a mesogen skeleton, a hardener, an inorganic filler, and as a solvent, a cyclohexane-based solvent and a ketone-based solvent.
摘要翻译：要解决的问题：为了提供一种环氧类涂料的树脂组合物，其中当涂覆时填料不会沉淀，并且当形成涂膜时易于处理和散热能力好，并且具有高硬度，使得涂膜不太可能被损坏。解决方案：环氧系涂料用树脂组合物含有具有介晶骨架的环氧树脂，固化剂，无机填料和作为溶剂的环己烷系溶剂和酮系溶剂的混合物。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2013018991A Resin composition, resin sheet, resin sheet cured product, resin sheet laminate, resin sheet laminate cured product and method for producing the same, semiconductor device and led device 有权
标题翻译：树脂组合物，树脂片，树脂片固化产品，树脂片层压板，树脂片层压固化产品及其制造方法，半导体器件和LED器件
公开(公告)号：JP2013018991A
公开(公告)日：2013-01-31
申请号：JP2012214393
申请日：2012-09-27
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： NISHIYAMA TOMOO , KUWANO ATSUSHI , SHIRASAKA TOSHIAKI , HARA NAOKI , YOSHIHARA KENSUKE , KATAKI HIDEYUKI
IPC分类号： C08L63/00 , B32B15/092 , B32B27/38 , B32B27/42 , C08J5/18 , C08K3/22 , C08K3/38 , H01L33/64
CPC分类号： H01L33/641 , B32B15/092 , B32B27/20 , B32B27/38 , B32B27/42 , B32B2457/14 , B32B2457/20 , C08J5/18 , C08J2363/00 , C08K3/38 , C08K2003/385 , C08L61/06 , C08L63/00 , H01L23/3737 , H01L23/4334 , H01L23/473 , H01L24/29 , H01L24/33 , H01L2224/2929 , H01L2224/29386 , H01L2224/29499 , H01L2224/32245 , H01L2224/48091 , H01L2224/73265 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a multilayer resin sheet cured product and a multilayer resin sheet excellent in all of heat conductivity, adhesive strength and insulating property.SOLUTION: This resin composition includes an epoxy resin monomer, a novolac resin containing a compound having a structural unit represented by general formula (I) and a filler; where the filler has peaks in each range of ≥0.01 μm to less than 1 μm, ≥1μ to less than 10 μm and ≥10μ to ≤100 μm in the particle diameter distribution measured by a laser diffraction method, and the filler having particle diameter of ≥10 μ to ≤100 μm contains boron nitride particles. in the general formula (I), Rrepresents an alkyl group or the like; Rand Reach independently represents a hydrogen atom, an alkyl group or the like; m denotes a number of 0-2; and n denotes a number of 1-7.
摘要翻译：要解决的问题：提供导热性，粘合强度和绝缘性优异的多层树脂片固化产物和多层树脂片。该树脂组合物包含环氧树脂单体，含有具有由通式（I）表示的结构单元的化合物和填料的酚醛清漆树脂; 其中填料在通过激光衍射法测量的粒径分布中在≥0.01μm至小于1μm，≥1μ至小于10μm和≥10μ至≤100μm的每个范围内具有峰值，并且具有粒径 ≥10μ〜≤100μm的氮化硼粒子。在通式（I）中，R 1表示烷基等; R 2 和R 3 各自独立地表示氢原子，烷基等; m表示0-2的数; n表示1-7。版权所有（C）2013，JPO＆INPIT

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