发明专利
JP2013018991A Resin composition, resin sheet, resin sheet cured product, resin sheet laminate, resin sheet laminate cured product and method for producing the same, semiconductor device and led device
有权
基本信息:
- 专利标题： Resin composition, resin sheet, resin sheet cured product, resin sheet laminate, resin sheet laminate cured product and method for producing the same, semiconductor device and led device
- 专利标题（中）：树脂组合物，树脂片，树脂片固化产品，树脂片层压板，树脂片层压固化产品及其制造方法，半导体器件和LED器件
- 申请号：JP2012214393 申请日：2012-09-27
- 公开(公告)号：JP2013018991A 公开(公告)日：2013-01-31
- 发明人： NISHIYAMA TOMOO , KUWANO ATSUSHI , SHIRASAKA TOSHIAKI , HARA NAOKI , YOSHIHARA KENSUKE , KATAKI HIDEYUKI
- 申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
- 专利权人： Hitachi Chemical Co Ltd,日立化成工業株式会社
- 当前专利权人： Hitachi Chemical Co Ltd,日立化成工業株式会社
- 优先权： JP2011071251 2011-03-28
- 主分类号： C08L63/00
- IPC分类号： C08L63/00 ; B32B15/092 ; B32B27/38 ; B32B27/42 ; C08J5/18 ; C08K3/22 ; C08K3/38 ; H01L33/64
摘要：
PROBLEM TO BE SOLVED: To provide a multilayer resin sheet cured product and a multilayer resin sheet excellent in all of heat conductivity, adhesive strength and insulating property.SOLUTION: This resin composition includes an epoxy resin monomer, a novolac resin containing a compound having a structural unit represented by general formula (I) and a filler; where the filler has peaks in each range of ≥0.01 μm to less than 1 μm, ≥1μ to less than 10 μm and ≥10μ to ≤100 μm in the particle diameter distribution measured by a laser diffraction method, and the filler having particle diameter of ≥10 μ to ≤100 μm contains boron nitride particles. in the general formula (I), Rrepresents an alkyl group or the like; Rand Reach independently represents a hydrogen atom, an alkyl group or the like; m denotes a number of 0-2; and n denotes a number of 1-7.
摘要（中）：
要解决的问题：提供导热性，粘合强度和绝缘性优异的多层树脂片固化产物和多层树脂片。 该树脂组合物包含环氧树脂单体，含有具有由通式（I）表示的结构单元的化合物和填料的酚醛清漆树脂; 其中填料在通过激光衍射法测量的粒径分布中在≥0.01μm至小于1μm，≥1μ至小于10μm和≥10μ至≤100μm的每个范围内具有峰值，并且具有粒径 ≥10μ〜≤100μm的氮化硼粒子。 在通式（I）中，R 1表示烷基等; R 2 和R 3 各自独立地表示氢原子，烷基等; m表示0-2的数; n表示1-7。 版权所有（C）2013，JPO＆INPIT
公开/授权文献:
信息查询:
EspacenetIPC结构图谱:
| C | 化学；冶金 |
| --C08 | 有机高分子化合物；其制备或化学加工；以其为基料的组合物 |
| ----C08L | 高分子化合物的组合物 |
| ------C08L63/00 | 环氧树脂的组合物；环氧树脂衍生物的组合物 |