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1. 发明专利

JP2014132044A Composition for forming silica-based film for inkjet, method for forming silica-based film, semiconductor device and solar cell system 审中-公开
标题翻译：用于形成用于墨水的二氧化硅基膜的组合物，形成二氧化硅膜的方法，半导体器件和太阳能电池系统
公开(公告)号：JP2014132044A
公开(公告)日：2014-07-17
申请号：JP2011183951
申请日：2011-08-25
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： YOSHIKAWA TAKAHIRO , OKADA YUHEI , NOBE SHIGERU
IPC分类号： C09D183/06 , C01B33/12 , C09D1/00 , C09D7/12 , C09D11/00 , C09D183/04 , H01L31/046 , H01L31/05
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a composition for forming a silica-based film for inkjet, the composition which can be discharged without clogging an inkjet nozzle even when operations of non-discharging and discharging are repeated, and which can form a drawing pattern having a nearly rectangular cross-sectional shape.SOLUTION: The composition for forming a silica-based film for inkjet comprises a silicon compound obtained by hydrolysis and polycondensation of a compound expressed by general formula RSiX, a solvent, and a surface controlling agent. The solvent comprises γ-butyrolactone, a second solvent having a boiling point of 80 to 100°C, and a third solvent having a boiling point of 180 to 230°C, in which a mass ratio of the γ-butyrolactone with respect to the whole mass of the solvent is 0.2 or more, and a mass ratio of the second solvent with respect to the whole mass of the solvent is 0.2 to 0.5. In the above formula, Rrepresents an organic group having 1 to 20 carbon atoms; X represents a hydrolyzable group; and n represents an integer of 0 to 2.
摘要翻译：要解决的问题：为了提供一种用于形成用于喷墨的二氧化硅基膜的组合物，即使重复进行非排放和排出的操作，也可以排出而不堵塞喷墨嘴的组合物，并且可以形成具有近似矩形的横截面形状。解决方案：用于形成用于喷墨的二氧化硅基膜的组合物包括通过由通式RSiX表示的化合物，溶剂和表面控制剂的水解和缩聚获得的硅化合物。溶剂包括γ-丁内酯，沸点为80〜100℃的第二溶剂和沸点为180〜230℃的第三溶剂，其中γ-丁内酯的质量比相对于溶剂的整体质量为0.2以上，第二溶剂相对于溶剂整体的质量比为0.2〜0.5。在上式中，R表示碳原子数1〜20的有机基团。 X表示水解性基团; n表示0〜2的整数。

2. 发明专利

JP2014074175A Cmp polishing liquid for palladium polishing and polishing method 有权
标题翻译： CMP抛光液用于抛光和抛光方法
公开(公告)号：JP2014074175A
公开(公告)日：2014-04-24
申请号：JP2013247423
申请日：2013-11-29
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： MINAMI HISATAKA , ZEISHO RYOTA , AMANOKURA HITOSHI , OKADA YUHEI , ONO YUTAKA
IPC分类号： C09K3/14 , B24B37/00 , C09G1/02 , H01L21/304
CPC分类号： H01L21/3212 , C09G1/02
摘要： PROBLEM TO BE SOLVED: To provide a CMP polishing liquid for palladium polishing which improves polishing speed of a palladium layer and can polish at a stable polishing speed even if plural palladium layers are polished successively.SOLUTION: A CMP polishing liquid for palladium polishing contains organic solvent, amino acid, 1,2,4-triazole, phosphoric acids, oxidizer, and abrasive grains. The CMP polishing liquid contains at least one kind chosen among glycol, glycol derivative, and alcohol as the organic solvent. Solid precipitation amounts generating in a solution that 5 mg of palladium acetate is dissolved in a mixture of 2.5 g of the organic solvent, 0.05 g of the amino acid, and 2 g of water, and left on one day, is not more than 0.1 mg.
摘要翻译：要解决的问题：为了提供一种用于钯抛光的CMP抛光液，其可以提高钯层的抛光速度，并且即使连续抛光多个钯层，也能以稳定的抛光速度抛光。溶液：用于钯抛光的CMP抛光液含有机溶剂，氨基酸，1,2,4-三唑，磷酸，氧化剂和磨料颗粒。 CMP抛光液含有选自乙二醇，二醇衍生物和醇中的至少一种作为有机溶剂。在5mg乙酸钯溶解在2.5g有机溶剂，0.05g氨基酸和2g水中并在一天内残留的溶液中产生的固体沉淀量不大于0.1 毫克。

3. 发明专利

JP2014103253A Primer, manufacturing method for pattern hardened film, pattern hardened film, and semiconductor element 审中-公开
标题翻译：图案硬化膜，图案硬化膜和半导体元件的制造方法
公开(公告)号：JP2014103253A
公开(公告)日：2014-06-05
申请号：JP2012254332
申请日：2012-11-20
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： OKADA YUHEI , TANIMOTO AKITOSHI , MATSUTANI HIROSHI , KASUYA KEI , NOBE SHIGERU
IPC分类号： H01L21/312 , C09D5/00 , C09D183/08 , G03F7/023 , G03F7/09 , H01L21/027
CPC分类号： H01L2224/11
摘要： PROBLEM TO BE SOLVED: To provide a primer capable of forming a pattern hardened film with high adhesion even to a wiring material such as copper and gold as well as a base material such as silicon.SOLUTION: The primer, used to form a photosensitive layer comprised of a photosensitive resin composition containing alkali soluble resin including a phenolic hydroxyl group on a substrate, comprises a mercapto silane compound and solvent.
摘要翻译：要解决的问题：提供能够形成图案硬化膜的底漆，即使对于诸如铜和金的布线材料以及诸如硅的基材也具有高粘附性的底漆。溶液：用于形成感光层的底漆由在基材上含有酚羟基的碱溶性树脂的感光性树脂组合物构成，含有巯基硅烷化合物和溶剂。

4. 发明专利

JP2014102285A Primer, production method of patterned cured film, patterned cured film and semiconductor element 审中-公开
标题翻译：原型，图案固化膜的生产方法，图案固化膜和半导体元件
公开(公告)号：JP2014102285A
公开(公告)日：2014-06-05
申请号：JP2012252434
申请日：2012-11-16
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： MATSUTANI HIROSHI , NOBE SHIGERU , KASUYA KEI , OKADA YUHEI , AOKI MASARU , KATOGI SHIGEKI , ABE KOICHI , TANIMOTO AKITOSHI , YAMAMOTO MASAHARU , TAHARA SHINGO
IPC分类号： G03F7/11 , G03F7/004 , G03F7/023
摘要： PROBLEM TO BE SOLVED: To provide a primer with which a patterned cured film can be formed with good adhesiveness not only to a silicon substrate but to a wiring material such as copper and gold.SOLUTION: The primer is used for forming a photosensitive layer comprising a photosensitive resin composition which comprises an alkali-soluble resin including a phenolic hydroxyl group on a substrate; and the primer comprises a triazine compound having a mercapto group, and a solvent.
摘要翻译：要解决的问题：提供一种可以形成图案化固化膜的底漆，其不仅对硅基材具有良好的粘附性，而且与铜和金等布线材料形成粘合。溶液：底漆用于形成感光层，其包含一种感光性树脂组合物，其在基材上含有酚羟基的碱溶性树脂; 并且底漆包含具有巯基的三嗪化合物和溶剂。

5. 发明专利

JP2014080541A Resin composition and method of manufacturing organic layer using the same, organic layer, and semiconductor element having organic layer 审中-公开
标题翻译：树脂组合物和使用其的有机层的制造方法，有机层和具有有机层的半导体元件
公开(公告)号：JP2014080541A
公开(公告)日：2014-05-08
申请号：JP2012230731
申请日：2012-10-18
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： OKADA YUHEI , AOKI MASARU , MATSUTANI HIROSHI , KASUYA KEI , NOBE SHIGERU
IPC分类号： C08L61/06 , C08F220/18 , C08L33/04 , G03F7/023 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a resin composition capable of forming a pattern resin film having no residual in concavity in a process of forming the pattern resin film, a method of manufacturing an organic layer using the resin composition, the organic layer obtained by the method of manufacturing, and a semiconductor element having the organic layer.SOLUTION: A resin composition contains (a) an alkali soluble resin having a phenolic hydroxyl group and (b) an acrylic resin, and the (b) acrylic resin has absorbance at 660 nm measured by a spectrophotometer after agitating and mixing with tetramethylammonium hydroxide (TMAH) at the concentration of 0.3 mass% for 30 seconds and standing for 10 minutes of 0.06 or less. It is preferable to contain further (c) a photosensitizer and (d) a crosslinking agent. A method of manufacturing an organic layer includes a process of coating the resin composition on a base plate and drying it to form a resin film, a process of exposing and developing the resin film to form a pattern resin film, and a process of heating the pattern resin film to form an organic layer.
摘要翻译：要解决的问题：提供一种能够在形成图案树脂膜的工艺中形成不具有残留残留的图案树脂膜的树脂组合物，使用该树脂组合物制造有机层的方法，通过制造方法和具有有机层的半导体元件。溶液：树脂组合物含有（a）具有酚羟基的碱溶性树脂和（b）丙烯酸树脂，（b）丙烯酸树脂在660 在用0.3质量％的浓度的四甲基氢氧化铵（TMAH）搅拌混合30秒后，用分光光度计测定，静置10分钟为0.06以下。优选还含有（c）光敏剂和（d）交联剂。制造有机层的方法包括在基板上涂布树脂组合物并干燥以形成树脂膜的方法，使树脂膜曝光和显影以形成图案树脂膜的方法，以及加热形成树脂膜以形成有机层。

6. 发明专利

JP2013219372A Barrier layer forming composition, barrier layer, method for manufacturing solar cell substrate, and method for manufacturing solar cell element 审中-公开
标题翻译：阻挡层形成组合物，阻挡层，制造太阳能电池基板的方法和制造太阳能电池元件的方法
公开(公告)号：JP2013219372A
公开(公告)日：2013-10-24
申请号：JP2013110301
申请日：2013-05-24
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： ODA AKIHIRO , YOSHIDA MASATO , NOJIRI TAKESHI , KURATA YASUSHI , IWAMURO MITSUNORI , NOBE SHIGERU , OKADA YUHEI
IPC分类号： H01L21/22 , H01L31/04
CPC分类号： H01L31/022425 , H01L21/2255 , Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a barrier layer forming composition which is capable of suppressing surface roughness of a semiconductor substrate by sufficiently preventing diffusion of a donor element or an acceptor element into the semiconductor substrate, and to provide a barrier layer formed using the same, a method for manufacturing a solar cell substrate using the same, and a method for manufacturing a solar cell element.SOLUTION: The barrier layer forming composition contains: a metal compound containing an alkaline earth metal or an alkali metal; a dispersion medium; and one or more specific compounds selected from the group consisting of a metal alkoxide, a silicon alkoxide, a silicate oligomer, and a silicone oil.
摘要翻译：要解决的问题：提供一种能够通过充分防止施主元件或受体元件扩散到半导体衬底中而能够抑制半导体衬底的表面粗糙度的阻挡层形成组合物，并提供使用其形成的阻挡层使用该太阳能电池元件的太阳能电池基板的制造方法以及太阳能电池元件的制造方法。阻挡层形成用组合物含有含有碱土金属或碱金属的金属化合物，分散介质; 和一种或多种选自金属醇盐，硅醇盐，硅酸盐低聚物和硅油的特定化合物。

7. 发明专利

JP2013168677A Mask-forming composition, method for manufacturing solar cell substrate, and method for manufacturing solar cell element 审中-公开
标题翻译：掩模成型组合物，制造太阳能电池基板的方法和制造太阳能电池元件的方法
公开(公告)号：JP2013168677A
公开(公告)日：2013-08-29
申请号：JP2013110302
申请日：2013-05-24
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： ODA AKIHIRO , YOSHIDA MASATO , NOJIRI TAKESHI , KURATA YASUSHI , IWAMURO MITSUNORI , NOBE SHIGERU , OKADA YUHEI
IPC分类号： H01L21/22 , H01L31/04
CPC分类号： H01L31/022425 , H01L21/2255 , Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a mask-forming composition capable of sufficiently preventing diffusion of a donor element and an acceptor element, a method for manufacturing a solar cell substrate using the same and a method for manufacturing a solar cell element.SOLUTION: The mask-forming composition contains a silicon compound, a metal compound containing an alkaline earth metal or an alkali metal, and a dispersion medium.
摘要翻译：要解决的问题：提供能够充分防止施主元件和受主元件的扩散的掩模形成用组合物，使用其的太阳能电池基板的制造方法以及太阳能电池元件的制造方法。掩模形成组合物含有硅化合物，含有碱土金属或碱金属的金属化合物和分散介质。

8. 发明专利

JP2013041856A Cmp polishing liquid for polishing palladium and polishing method 审中-公开
标题翻译： CMP抛光液用于抛光和抛光方法
公开(公告)号：JP2013041856A
公开(公告)日：2013-02-28
申请号：JP2009288874
申请日：2009-12-21
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： MINAMI HISATAKA , OKADA YUHEI
IPC分类号： H01L21/304 , B24B37/00 , C09K3/14
CPC分类号： C09K3/1463 , C09G1/02 , H01L21/3212
摘要： PROBLEM TO BE SOLVED: To provide a CMP polishing liquid capable of improving at least polishing speed of a palladium layer as compared with a case where conventional CMP polishing liquids are used, and a polishing method using the CMP polishing liquid.SOLUTION: There is provided a CMP polishing liquid for polishing palladium, which contains 1,2,4-triazole, phosphoric acids, an oxidant, and abrasive grains having a degree of association of 1.5 or more and less than 2.5. There is also provided a method for polishing a substrate, in which a substrate is polished with a polishing cloth while a CMP polishing liquid is supplied between the substrate and the polishing cloth. In the method, the substrate has a palladium layer, and the CMP polishing liquid contains 1,2,4-triazole, phosphoric acids, an oxidant, and abrasive grains having a degree of association of 1.5 or more and less than 2.5.
摘要翻译：要解决的问题：与使用常规CMP抛光液的情况相比，提供一种能够至少提高钯层的抛光速度的CMP抛光液和使用CMP抛光液的抛光方法。解决方案：提供了用于抛光钯的CMP抛光液，其包含1,2,4-三唑，磷酸，氧化剂和具有1.5以上且小于2.5的缔合度的磨料颗粒。还提供了一种用于抛光基材的方法，其中在抛光布之间将CMP抛光液体供给到抛光布中抛光基板。在该方法中，基板具有钯层，CMP研磨液含有1,2,4-三唑，磷酸，氧化剂和结合度为1.5以上且小于2.5的磨粒。版权所有（C）2013，JPO＆INPIT

9. 发明专利

JP2015025952A 感光性接着剤組成物、それを用いた半導体装置の製造方法、及び、半導体装置审中-公开
标题翻译：光敏性粘合剂组合物，使用其制造半导体器件的方法和半导体器件
公开(公告)号：JP2015025952A
公开(公告)日：2015-02-05
申请号：JP2013155521
申请日：2013-07-26
申请人：日立化成株式会社 , Hitachi Chemical Co Ltd
发明人： ABE KOICHI , TANIMOTO AKITOSHI , TAHARA SHINGO , NOBE SHIGERU , MATSUTANI HIROSHI , KASUYA KEI , AOKI MASARU , OKADA YUHEI
IPC分类号： G03F7/023 , C09J11/06 , C09J125/18 , C09J133/04 , G03F7/004 , G03F7/40
摘要：【課題】半導体装置を作製する際に連続圧着が可能であり、チップ積層時に優れた濡れ広がり性を持つ感光性接着剤組成物、それを用いた半導体装置の製造方法及び、前記製造方法により得られる感光性接着剤組成物膜のパターン樹脂膜を有する半導体装置の提供。【解決手段】(A)下記一般式(1)で表される構造単位を有するアルカリ可溶性樹脂と、(B)少なくとも1種の非プロトン性溶媒を含む有機溶媒と、(C)光により酸を生成する化合物と、(D)熱架橋材と、(E)アクリル樹脂と、を含有する感光性接着剤組成物。【選択図】なし
摘要翻译：要解决的问题：提供一种在制造半导体器件时可以连续压接的感光性粘合剂组合物，并且当芯片层压时具有优异的润湿铺展性，使用该感光性粘合剂组合物的半导体器件的制造方法以及具有通过制造方法获得的感光性粘合剂组合物膜的图案树脂膜。解决方案：一种感光性粘合剂组合物，其含有（A）具有由通式（1）表示的结构单元的碱溶性树脂，（B）有机溶剂含有至少一种非质子溶剂，（C）产生酸的化合物，（D）热交联剂，和（E）丙烯酸树脂。

10. 发明专利

JP2014033238A Polishing agent 有权
标题翻译：抛光剂
公开(公告)号：JP2014033238A
公开(公告)日：2014-02-20
申请号：JP2013240077
申请日：2013-11-20
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： ONO YUTAKA , SHINODA TAKASHI , OKADA YUHEI
IPC分类号： H01L21/304 , B24B37/00 , B24B37/04
CPC分类号： H01L21/3212 , C09G1/02 , C09K3/1463 , H01L21/7684 , H01L21/76898
摘要： PROBLEM TO BE SOLVED: To provide a polishing agent that allows smooth polishing of a copper film at high polishing speed, and allows polishing treatment in a short time, thereby capable of securing sufficient productivity, even for use in applications that require polishing of thick metal films on high performance circuit boards, TSVs or the like.SOLUTION: A polishing agent is obtained by adjusting a composition to have a pH of 1.5-4, the composition containing an inorganic acid, an amino acid, a protective film-forming agent, an abrasive, an oxidizing agent, an organic acid and water. The amount of potassium hydroxide required to raise the pH of the composition without the organic acid to 4 is 0.10 mol or more with respect to 1 kg of the composition without the organic acid, the organic acid contains two or more carboxyl groups, and the logarithm of the inverse of the first acid dissociation constant (pKa1) is 3 or less.
摘要翻译：要解决的问题：提供一种抛光剂，其能够以高抛光速度平滑地抛光铜膜，并且允许在短时间内进行抛光处理，从而能够确保足够的生产率，甚至用于需要研磨厚金属的应用中高性能电路板，TSV等的薄膜。解决方案：通过调节pH为1.5-4的组合物获得抛光剂，该组合物含有无机酸，氨基酸，保护膜形成剂，研磨剂，氧化剂，有机酸和水。相对于1kg不含有机酸的组合物，有机酸含有2个以上的羧基，对数为10以上，将没有有机酸的组合物的pH升高至4所需的氢氧化钾的量为0.10以上的第一酸解离常数（pKa1）的倒数为3以下。

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