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1. 发明专利

JP2012229301A Resin composition, method for producing coated layer using the same, and electronic component 有权
标题翻译：树脂组合物，使用其的涂覆层的制造方法和电子部件
公开(公告)号：JP2012229301A
公开(公告)日：2012-11-22
申请号：JP2011097072
申请日：2011-04-25
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： AOKI MASARU , MATSUTANI HIROSHI , KASUYA KEI
IPC分类号： C08L61/06 , C08K5/00 , C08L33/00 , C09D11/00 , C09D11/38
摘要： PROBLEM TO BE SOLVED: To provide a resin composition capable of forming a pattern by inkjet or the like, and capable of being thermally cured at a low temperature; and to provide a method for producing a coated layer using the same and an electronic component having the coated layer.SOLUTION: The resin composition includes (A) a phenol resin, (B) a thermal crosslinking agent, (C) an acrylic resin having a repeating unit represented by formulae (1) and (2), and (D) ethyl lactate (D1) and an organic solvent (D2) having a boiling point at an atmospheric pressure of 190 to 250°C. In the formulae (1) and (2), R is a hydrogen atom or a methyl group; and Ris a 4-20C alkyl group.
摘要翻译：待解决的问题：提供能够通过喷墨等形成图案并能够在低温下热固化的树脂组合物; 并提供使用该涂层的涂层的制造方法和具有涂层的电子部件。解决方案：树脂组合物包括（A）酚醛树脂，（B）热交联剂，（C）具有由式（1）和（2）表示的重复单元的丙烯酸树脂和（D）乙基乳酸盐（D1）和沸点在大气压190〜250℃的有机溶剂（D2）。在式（1）和（2）中，R是氢原子或甲基; 并且R 1 是4-20C烷基。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2009237125A Positive photosensitive resin composition, resist pattern manufacturing method, and electronic component 有权
标题翻译：正性感光树脂组合物，电阻图案制造方法和电子元件
公开(公告)号：JP2009237125A
公开(公告)日：2009-10-15
申请号：JP2008081515
申请日：2008-03-26
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MATSUTANI HIROSHI , UENO TAKUMI , ALEXANDRE NICOLAS
IPC分类号： G03F7/023 , G03F7/004 , G03F7/40 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To improve the adhesion, thermal resistance, and mechanical characteristics after development of a positive photosensitive resin composition developable in an alkali aqueous solution. SOLUTION: This positive photosensitive resin composition contains (A) an alkali-soluble resin having a phenolic hydroxyl group, (B) a compound generating acid when exposed to light, (C) a core shell polymer, and (D) a solvent. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提高在碱性水溶液中显影的正性感光性树脂组合物的开发后的粘合性，耐热性和机械特性。该正型感光性树脂组合物含有（A）具有酚羟基的碱溶性树脂，（B）曝光时产生酸的化合物，（C）核壳聚合物，（D）溶剂。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2009074093A Preparation method of block copolymer, block copolymer prepared thereby and application thereof 审中-公开
标题翻译：嵌段共聚物的制备方法，其制备的嵌段共聚物及其应用
公开(公告)号：JP2009074093A
公开(公告)日：2009-04-09
申请号：JP2008281655
申请日：2008-10-31
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MATSUTANI HIROSHI , KAWAI HIROMASA , TO HARUAKI , TACHIKI HIDEYASU , TAKASAKI TOSHIHIKO , KUMAKI TAKASHI , MARUYAMA KOJI , KATOGI SHIGEKI
IPC分类号： C09J153/00 , C08G61/08 , C09J7/00 , C09J165/00
CPC分类号： C08G61/08 , C09J165/00
摘要： PROBLEM TO BE SOLVED: To provide a preparation method capable of readily synthesizing a homogeneous block copolymer even by using two metathesis-polymerizable monomers that greatly differ in their structures and/or polarities, and to use the block copolymer obtained thereby as an adhesive etc. for circuit connection in electric or electronic components of semiconductor packages etc.
SOLUTION: The method for preparing the block copolymer comprises the step of carrying out a metathesis polymerization of a metathesis-polymerizable unsaturated monocyclic compound (A) with a metathesis-polymerizable unsaturated polycyclic compound (B) by the use of a metal-carbene complex catalyst (C), wherein the metathesis polymerization is conducted by first mixing and reacting the whole amount of the unsaturated monocyclic compound (A) with the whole amount of the necessary metal-carbene complex catalyst (C) and subsequently adding the unsaturated polycyclic compound (B) to the resulting mixture to carry out a reaction. The block copolymer obtained by the preparation method and the use of the block copolymer are also provided.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供即使通过使用它们的结构和/或极性大不相同的两种易位化可聚合单体也可以容易地合成均匀的嵌段共聚物的制备方法，并且使用由此获得的嵌段共聚物作为粘合剂等用于半导体封装等的电气或电子部件中的电路连接。解决方案：制备嵌段共聚物的方法包括以下步骤：将易位聚合的不饱和单环化合物（A）的易位聚合与易位聚合性不饱和多环化合物（B），其中通过首先将全部量的不饱和单环化合物（A）与全部量的不饱和单环化合物必要的金属 - 碳烯配合物催化剂（C），然后将不饱和多环化合物（B）加入到所得混合物t中 o进行反应。还提供了通过制备方法获得的嵌段共聚物和嵌段共聚物的用途。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2004140342A Composite insulating film 有权
标题翻译：复合绝缘膜
公开(公告)号：JP2004140342A
公开(公告)日：2004-05-13
申请号：JP2003317572
申请日：2003-09-09
申请人： Hitachi Chem Co Ltd , National Institute Of Advanced Industrial & Technology , 日立化成工業株式会社 , 独立行政法人産業技術総合研究所
发明人： MATSUTANI HIROSHI , ABE KOICHI , UCHIMARU YUKO
IPC分类号： B05D7/24 , B32B27/00 , C08G77/56 , C08G77/60 , C08G79/08 , H01L21/312 , H01L21/768 , H01L23/522
摘要： PROBLEM TO BE SOLVED: To provide a composite insulating film, etc., which can sufficiently lower a dielectric constant, can enhance a mechanical strength and can improve adhesive properties to an upper layer film. SOLUTION: The composite insulating film includes an insulating film 103 (second insulating film) containing an organic silicon borazine resin on an insulating film 102 (first insulating film) containing a siloxane resin formed on a silicon wafer 100 having a silicon base layer provided with a metal wiring layer 101. Such a composite insulating film is simply formed by a spin coating method, etc. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供可以充分降低介电常数的复合绝缘膜等，可以提高机械强度并且可以改善对上层膜的粘合性能。解决方案：复合绝缘膜包括在绝缘膜102（第一绝缘膜）上含有有机硅环硼氮烷的绝缘膜103（第二绝缘膜），第一绝缘膜含有硅基树脂，硅基树脂100具有硅基层设置有金属布线层101.这种复合绝缘膜简单地通过旋涂法等形成。版权所有（C）2004，JPO

5. 发明专利

JP2003327669A Epoxy resin composition and adhesive 审中-公开
标题翻译：环氧树脂组合物和粘合剂
公开(公告)号：JP2003327669A
公开(公告)日：2003-11-19
申请号：JP2002137594
申请日：2002-05-13
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： FUKUCHI IWAO , TO HARUAKI , KUMAKI TAKASHI , TACHIKI HIDEYASU , MATSUTANI HIROSHI
IPC分类号： C08G59/62 , C07C323/16 , C07C323/20 , C07C323/29 , C07C323/56 , C07C323/66 , C08G59/06 , C09J163/00
CPC分类号： C07C323/29 , C07C323/16 , C07C323/20 , C07C323/56 , C07C323/66 , C08G59/06
摘要： PROBLEM TO BE SOLVED: To obtain an adhesive which exhibits excellent adhesivity to a surface layer coated with a metallic material such as copper, silver, gold, and gold/ palladium.
SOLUTION: An epoxy resin composition has (A) a curing agent and (B) an epoxy resin as the essential components, the curing agent (A) containing a disulfide-containing phenolic resin represented by formula (I) (wherein R
1 is a 2C or 3C methylene chain; R
2 is a 1-10C methylene chain; G is hydrogen atom, a 1-10C alkyl group, a 1-10C alkoxy group, a 1-10C thioalkoxy group, hydroxyl group, thiol group, carboxyl group, sulfonyl group, nitro group, an amino group, cyano group, a phenyl group, a benzyl group or a halogen atom). The adhesive contains the epoxy resin composition.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：获得对涂覆有诸如铜，银，金和金/钯的金属材料的表面层具有优异粘附性的粘合剂。解决方案：环氧树脂组合物具有（A）固化剂和（B）环氧树脂作为必需组分，固化剂（A）含有由式（I）表示的含二硫化物的酚醛树脂（其中R 1是2C或3C亚甲基链; R SB 2是1-10C亚甲基链; G是氢原子，1-10C烷基，1-10C烷氧基基团，1-10C硫烷氧基，羟基，硫醇基，羧基，磺酰基，硝基，氨基，氰基，苯基，苄基或卤素原子）。粘合剂含有环氧树脂组合物。版权所有（C）2004，JPO

6. 发明专利

JP2003002632A Ultrafine silica particle having uniform diameter, and method for manufacturing the same 审中-公开
标题翻译：具有均匀直径的超细二氧化硅颗粒及其制造方法
公开(公告)号：JP2003002632A
公开(公告)日：2003-01-08
申请号：JP2001178013
申请日：2001-06-13
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MATSUTANI HIROSHI , HONDA YUTAKA , SUSA KENZO
IPC分类号： C01B33/18 , C08G85/00
摘要： PROBLEM TO BE SOLVED: To provide ultrafine silica particles having 1-100 nm average particle diameter distribution of which is simple dispersing type.
SOLUTION: The ultrafine silica particles are manufactured by the following processes (a), (b), and (c); the process (a): a dendorimer having a reactive functional group, which reacts with isocyanates, at a branch terminal and an alkoxysilane as a reaction reagent having isocyanate group are reacted together to obtain a dendorimer having an alkoxysilyl group at the branch terminal (silyl dendorimer), a process (b): an alkoxysilane at the branch terminal (surface layer) of the dendorimer having the alkoxysilyl group at the branch terminal (silyl dendorimer) is hydrolyzed and dehydrated and condensated to obtain a precursor of the ultrafine silica particles, a process (c): the precursor is added with an alkoxysilane and reacted to laminate a silica layer on the surface layer.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供其具有1-100nm平均粒径分布的超细二氧化硅颗粒，其分散是简单的分散型。解决方案：超细二氧化硅颗粒通过以下方法（a），（b）和（c）制备; 方法（a）：在具有异氰酸酯基的反应试剂的分支末端和作为具有异氰酸酯基团的反应试剂的烷氧基硅烷上具有与异氰酸酯反应的反应性官能团的具有反应性官能团的树枝状醇与反应物反应，得到在分支末端具有烷氧基甲硅烷基的树枝状醇（甲硅烷基树枝状聚合物），方法（b）：将在分支末端具有烷氧基甲硅烷基的树枝状体的分支末端（表面层）上的烷氧基硅烷（甲硅烷基树枝状体）进行水解脱水缩合，得到超细二氧化硅粒子的前体，方法（c）：将前体加入烷氧基硅烷并反应以在表面层上层压二氧化硅层。

7. 发明专利

JP2013015856A Positive photosensitive resin composition, method of producing resist pattern, semiconductor device and electronic device 有权
标题翻译：正性感光性树脂组合物，耐电极图案的制造方法，半导体器件和电子器件
公开(公告)号：JP2013015856A
公开(公告)日：2013-01-24
申请号：JP2012197664
申请日：2012-09-07
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MATSUTANI HIROSHI , UENO TAKUMI , NICOLAS ALEXANDRE , YAMASHITA YUKIHIKO , NANAUMI KEN , TANIMOTO AKITOSHI
IPC分类号： G03F7/023 , C08F220/06 , C08F220/18 , C08F220/34 , C08G8/30 , G03F7/004 , G03F7/40
CPC分类号： H01L21/312 , G03F7/0233 , G03F7/0236 , G03F7/40 , H01L21/02118 , H01L21/02282 , H01L21/563 , H01L21/76801 , H01L21/76802 , H01L23/293 , H01L23/525 , H01L23/5329 , H01L24/13 , H01L2224/10126 , H01L2224/73104 , H01L2224/73203 , H01L2924/01004 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01079 , H01L2924/10253 , H01L2924/30105 , H01L2924/3011 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition that can be cured at low temperature, can be developed with an aqueous alkali solution, has sufficiently high sensitivity and resolution and can form resist patterns with excellent adhesiveness and thermal shock resistance, as well as a method of producing a resist pattern using the positive photosensitive resin composition, a semiconductor device having a resist pattern formed by the method, and an electronic device comprising the semiconductor device.SOLUTION: The positive photosensitive resin composition contains an alkali-soluble resin having a phenolic hydroxyl group, a compound which generates an acid due to light, a heat-crosslinking agent, and an acrylic resin including a C4-C20 alkyl (meth)acrylate unit, a (meth)acrylic acid unit and a (meth)acrylate unit having a primary, secondary or tertiary amino group in a side chain.
摘要翻译：要解决的问题：为了提供可以在低温下固化的正型感光性树脂组合物，可以用碱性水溶液显影，具有足够高的灵敏度和分辨率，并且可以形成具有优异的粘附性和耐热冲击性的抗蚀剂图案以及使用正型感光性树脂组合物制造抗蚀剂图案的方法，具有通过该方法形成的抗蚀剂图案的半导体器件和包括该半导体器件的电子器件。解决方案：正型感光性树脂组合物含有具有酚羟基的碱溶性树脂，由于光而产生酸的化合物，热交联剂和包含C 4 -C 20烷基（甲基）丙烯酸酯的丙烯酸树脂）丙烯酸酯单元，（甲基）丙烯酸单元和在侧链具有伯，仲或叔氨基的（甲基）丙烯酸酯单元。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2012150508A Positive photosensitive resin composition, manufacturing method of resist pattern, and electronic device 有权
标题翻译：阳性光敏树脂组合物，电阻图案的制造方法和电子设备
公开(公告)号：JP2012150508A
公开(公告)日：2012-08-09
申请号：JP2012086785
申请日：2012-04-05
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MATSUTANI HIROSHI , UENO TAKUMI , NICOLAS ALEXANDRE
IPC分类号： G03F7/004 , G03F7/023 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition developable with an aqueous alkaline solution, which has further improved sensitivity and resolution.SOLUTION: A positive photosensitive resin composition contains (A) an alkali-soluble resin having a phenolic hydroxyl group, (B) a compound generating an acid with light, (C) an elastomer, (D) a low molecular weight compound having a phenolic hydroxyl group and (E) a solvent, where the (D) component is 2,2-bis{3,5-bis(hydroxymethyl)-4-hydroxyphenyl}-1,1,1,3,3,3-hexafluoropropane or 1,1-bis{3,5-bis(methoxymethyl)-4-hydroxyphenyl}methane.
摘要翻译：要解决的问题：提供一种用碱性水溶液显影的正型感光性树脂组合物，其进一步提高了灵敏度和分辨率。解决方案：正性感光性树脂组合物含有（A）具有酚羟基的碱溶性树脂，（B）产生酸的化合物，（C）弹性体，（D）低分子量化合物具有酚羟基和（E）溶剂，其中（D）成分为2,2-双-3,3,5-双（羟甲基）-4-羟基苯基} -1,1,1,3,3,3-六氟丙烷或1,1-双-3,5,5-双（甲氧基甲基）-4-羟基苯基}甲烷。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2011102402A Borazine-based resin composition and method for producing the same, insulation coating and method for forming the same, and electronic part 有权
标题翻译：基于硼氢化物的树脂组合物及其制造方法，绝缘涂料及其形成方法和电子部件
公开(公告)号：JP2011102402A
公开(公告)日：2011-05-26
申请号：JP2011020137
申请日：2011-02-01
申请人： Hitachi Chem Co Ltd , National Institute Of Advanced Industrial Science & Technology , 日立化成工業株式会社 , 独立行政法人産業技術総合研究所
发明人： MATSUTANI HIROSHI , UCHIMARU YUKO
IPC分类号： C08G77/56 , C08K5/00 , C08L83/14 , C09D5/25 , C09D183/08 , C09D185/04 , H01L21/312
摘要： PROBLEM TO BE SOLVED: To provide an insulation coating which contains little metallic impurities and can sufficiently suppress occurrence of leak current, to provide a method for producing the insulation coating, to provide a borazine-based resin composition efficiently formable of the insulation coating, and to provide a method for producing the borazine-based resin composition.
SOLUTION: The borazine-based resin composition includes a polymer having a borazine skeleton on a main chain or a side chain and a solvent dissolvable of the polymer, wherein the polymer is an organosilicon borazine-based polymer, the solid concentration is 0.5 mass% or more and the content of the metallic impurities is 30 ppm or less.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种绝缘涂层，其包含少量金属杂质并且可以充分抑制泄漏电流的发生，从而提供一种制造绝缘涂层的方法，以提供可有效形成绝缘的环硼氮烷基树脂组合物并且提供一种制备环硼氮烷基树脂组合物的方法。解决方案：环硼氮烷基树脂组合物包括在主链或侧链上具有环硼烷骨架的聚合物和可溶于聚合物的溶剂，其中聚合物是有机硅环硼氮烷基聚合物，固体浓度为0.5 质量％以上，金属杂质含量为30ppm以下。版权所有（C）2011，JPO＆INPIT

10. 发明专利

JP2010015101A Positive photosensitive resin composition, method for producing pattern and electronic component 有权
标题翻译：正型感光树脂组合物，生产图案和电子元件的方法
公开(公告)号：JP2010015101A
公开(公告)日：2010-01-21
申请号：JP2008177115
申请日：2008-07-07
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MATSUTANI HIROSHI , UENO TAKUMI , ALEXANDRE NICOLAS , NANAUMI KEN
IPC分类号： G03F7/023 , G03F7/004 , G03F7/40 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which has excellent photosensitive characteristics, can be developed with an aqueous alkali solution, shrinks hardly in curing, and ensures excellent adhesion and thermal shock resistance of a formed resist pattern.
SOLUTION: The positive photosensitive resin composition includes (A) a phenolic resin modified with a rubbery polymer, (B) a compound which generates an acid under light, (C) a heat crosslinking agent and (D) a solvent.
COPYRIGHT: (C)2010,JPO&INPIT

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