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1. 发明专利

JP2012162735A Thermosetting resin composition and method for producing the same, and prepreg and laminated plate using the same 有权
标题翻译：热固性树脂组合物及其制造方法，以及使用它们的预浸和层压板
公开(公告)号：JP2012162735A
公开(公告)日：2012-08-30
申请号：JP2012099186
申请日：2012-04-24
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： MORITA KOJI , TAKANEZAWA SHIN , SAKAI KAZUNAGA , EJIRI TAKAKO , TSUCHIKAWA SHINJI , AKIYAMA MASANORI , KOTAKE TOMOHIKO
IPC分类号： C08L101/00 , C08J5/24 , C08K7/22 , C08K9/04
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which can reduce the coefficient of thermal expansion while suppressing an increase in volume fraction of an inorganic filler; a method for producing the same; and a prepreg using the thermosetting resin composition; and a laminated plate using the prepreg.SOLUTION: This thermosetting resin composition contains a thermosetting resin (A) and an inorganic porous material (B), where a part of the thermosetting resin (A) is impregnated in pores of the porous material (B); and the ratio (e/e) of the elastic modulus (e) of the porous material (B) at 25°C to the elastic modulus (e) of the cured product of the thermosetting resin (A) at 25°C is 5-100. The prepreg and the laminated plate using this are also provided.
摘要翻译：要解决的问题：提供一种能够降低热膨胀系数同时抑制无机填料的体积分数的增加的热固性树脂组合物; 其制造方法; 和使用该热固性树脂组合物的预浸料; 和使用该预浸料的层压板。解决方案：该热固性树脂组合物含有热固性树脂（A）和无机多孔材料（B），其中一部分热固性树脂（A）浸渍在多孔材料（B）的孔中; 和弹性模量（e B ）的比例（e B / e A < / SB>）与25℃下的热固性树脂（A）的固化物的弹性模量（e A ）相比，是5-100。还提供了预浸料和使用它的层压板。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2012149155A Thermosetting resin composition, and prepreg, laminate and printed wiring board using the same 有权
标题翻译：热固性树脂组合物和PREPREG，层压板和印刷线路板
公开(公告)号：JP2012149155A
公开(公告)日：2012-08-09
申请号：JP2011008313
申请日：2011-01-18
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： KOTAKE TOMOHIKO , MIYATAKE MASATO , NAGAI SHUNSUKE , HASHIMOTO SHINTARO , INOUE YASUO , TAKANEZAWA SHIN , MURAI AKIRA
IPC分类号： C08L83/04 , C08J5/24 , C08K3/00 , C08K5/17 , C08K5/18 , C08K5/3415 , C08L101/12 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition excellent in low water absorbency and low thermal expansion property, and a prepreg, a laminate and a printed wiring board using the same.SOLUTION: The thermosetting resin composition contains (a) a maleimide compound having at least two N-substituted maleimide groups in one molecule, (b) a silicone compound having an acidic substituent in the molecular structure, and (c) a thermosetting resin.
摘要翻译：要解决的问题：提供一种低吸水性和低热膨胀性优异的热固性树脂组合物，以及预浸料，层压体和使用其的印刷线路板。解决方案：热固性树脂组合物包含（a）在一个分子中具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物，（b）在分子结构中具有酸性取代基的硅氧烷化合物，和（c）热固性树脂。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2012246395A Prepreg, laminated plate, and printed wiring board using thermocurable resin composition 有权
标题翻译： PREPREG，层压板和使用可热固化树脂组合物的印刷线路板
公开(公告)号：JP2012246395A
公开(公告)日：2012-12-13
申请号：JP2011119505
申请日：2011-05-27
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： MIYATAKE MASATO , KOTAKE TOMOHIKO , NAGAI SHUNSUKE , TAKANEZAWA SHIN , MURAI AKIRA , UCHIMURA RYOICHI , TAKAHARA NAOKI
IPC分类号： C08J5/24 , C08G59/50 , C08K5/18 , C08K7/14 , C08K9/06 , C08L79/00 , C08L101/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a laminated plate and a printed wiring board which are excellent in heat resistance and insulation reliability and in which impregnating ability of a thermocurable resin and adhesion of a thermocurable resin with a glass cloth are good.SOLUTION: This prepreg for a printed wiring board is obtained by a method including: impregnating a glass cloth treated with (C) a silane coupling agent represented by General Formula (I) (where Rrepresents a 1-5C divalent hydrocarbon group, Rrepresents hydrogen or a 1-10C monovalent hydrocarbon group, X represents OCH, OCH, or OCH, m represents an integer of 0 to 5, and plural Xs and Rs when present in plurality may be the same as or different from each other) with a thermocurable resin composition containing (A) a compound containing an unsaturated maleimide group obtained by reacting (a) a maleimide compound having at least two N-substituted maleimide groups in the molecule with (b) an amine compound having at least two primary amino groups in the molecule and (B) a thermocurable resin; heating-drying the glass cloth; and converting the glass cloth into a B-stage.
摘要翻译：要解决的问题：提供耐热性和绝缘可靠性优异，并且其中耐热树脂的浸渍能力和耐热树脂与玻璃布的粘附性良好的层压板和印刷线路板。解决方案：用于印刷线路板的该预浸料通过以下方法获得：浸渍用（C）由通式（I）表示的硅烷偶联剂（其中R 1 表示1-5C的二价烃基，R表示氢或1-10C一价烃基，X表示OCH 3 ，OC 2 H 5 或OC 3 H 7 ，m表示0〜5的整数，多个X和R 2 相同或不同）与含有（A）含有不饱和马来酰亚胺基团的化合物的热固性树脂组合物通过使（a）在分子中具有至少两个N-取代马来酰亚胺基团的马来酰亚胺化合物与（b）分子中具有至少两个伯氨基的胺化合物和（B）热固性树脂; 加热干燥玻璃布; 并将玻璃布转换成B级。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2012149154A Thermosetting resin composition, and prepreg, laminate and multilayer printed wiring board using the same 有权
标题翻译：热固性树脂组合物，以及PREPREG，层压板和多层印刷线路板
公开(公告)号：JP2012149154A
公开(公告)日：2012-08-09
申请号：JP2011008308
申请日：2011-01-18
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： NAGAI SHUNSUKE , MURAI AKIRA , TAKANEZAWA SHIN , MIYATAKE MASATO , KOTAKE TOMOHIKO , INOUE YASUO , HASHIMOTO SHINTARO
IPC分类号： C08G59/20 , C08G59/56 , C08G59/62 , C08J5/24 , C08K3/00 , C08K5/3415 , C08L63/00 , C08L79/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which is excellent in heat resistance and low thermal expansion nature, and to provide a prepreg, a laminate, and a multilayer printed wiring board using the same.SOLUTION: The thermosetting resin composition includes: (a) a maleimide compound that has at least two N-substituted maleimide groups in one molecular structure; (b) a silicone compound that has an epoxy group in a molecular structure; and (c) a compound that has a phenolic hydroxyl group. The prepreg, the laminate, and the multilayer printed wiring board using the same are disclosed.
摘要翻译：要解决的问题：提供一种耐热性和低热膨胀性优异的热固性树脂组合物，并提供一种预浸料，层压体和使用其的多层印刷线路板。解决方案：热固性树脂组合物包括：（a）在一个分子结构中具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物; （b）分子结构中具有环氧基的硅氧烷化合物; 和（c）具有酚羟基的化合物。公开了预浸料，层压体和使用其的多层印刷布线板。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2012111930A Thermocurable resin composition, prepreg using the thermocurable resin composition, laminated plate, and printed wiring board 审中-公开
标题翻译：可热固性树脂组合物，使用可热固化树脂组合物，层压板和印刷线路板
公开(公告)号：JP2012111930A
公开(公告)日：2012-06-14
申请号：JP2011117322
申请日：2011-05-25
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： TAKAHARA NAOKI , OSE MASAHISA , UCHIMURA RYOICHI , KATO IKUHIKO , MIYATAKE MASATO , KOTAKE TOMOHIKO
IPC分类号： C08G59/40 , C08J5/24 , C08K3/22 , C08L63/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a thermocurable resin composition satisfying moisture resistance and adhesion and imparting heat resistance relative to a temperature condition in a lead-free soldering or a reflow soldering and an advantageous thermal coefficient of linear expansion.SOLUTION: This thermocurable resin composition is a thermocurable resin composition containing: a compound (A) obtained by reacting a maleimide compound (a) having in one molecule thereof, at least two N-substituted maleimide group with an amine compound (b) having an acidic substituent represented by General Formula (1) (where, when Rexists in a plurality, Rs represent each independently any one of a hydroxy group, a carboxy group, and a sulfonic acid group which are an acidic substituent; when Rexists in a plurality, Rs represent independently any one of a hydrogen atom, a 1C-5C aliphatic hydrocarbon group, a halogen atom, a hydroxy group, a carboxy group, and a sulfonic acid group; and x and y are each an integer of 1 to 4) and having in the molecule structure thereof, an acidic substituent and an N-substituted maleimide group; an epoxy resin (B); a metal hydrate (C) having a thermal decomposition temperature of 300°C or higher; and a modified imidazole compound (D).
摘要翻译：要解决的问题：提供一种满足耐湿性和粘合性并且在无铅焊接或回流焊接中相对于温度条件赋予耐热性和有利的线性膨胀热系数的热固性树脂组合物。解决方案：该热固性树脂组合物是含有下列化合物的热固性树脂组合物：通过使具有1分子的马来酰亚胺化合物（a），至少2个N-取代马来酰亚胺基与胺化合物（b ）具有由通式（1）表示的酸性取代基（其中当R 1 存在于多个时，R 1 独立地表示作为酸性取代基的羟基，羧基和磺酸基中的任一个;当多个R 2 时，R SB SB = “POST”> 2 独立地表示氢原子，1C-5C脂族烃基，卤素原子，羟基，羧基和磺酸基中的任何一个; x和y分别为每个为1至4的整数），并且在其分子结构中具有酸性取代基和N-取代的马来酰亚胺基团; 环氧树脂（B）; 热分解温度为300℃以上的金属水合物（C）和改性咪唑化合物（D）。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2012236920A Thermosetting resin composition, and prepreg, laminate and printed-wiring board using the composition 审中-公开
标题翻译：热固性树脂组合物和使用组合物的PREPREG，层压板和印刷线路板
公开(公告)号：JP2012236920A
公开(公告)日：2012-12-06
申请号：JP2011107142
申请日：2011-05-12
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： HASHIMOTO SHINTARO , KOTAKE TOMOHIKO , MIYATAKE MASATO , NAGAI SHUNSUKE , INOUE YASUO , TAKANEZAWA SHIN , MURAI AKIRA
IPC分类号： C08G59/50 , C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition excellent in moisture resistance and low thermal expansibility while particularly maintaining heat resistance, and to provide a prepreg, laminate and printed wiring board using the composition.SOLUTION: A thermosetting resin composition is characterized by incorporating (a) a silicone compound having unsaturated double bonds in a molecular structure, (b) an amine compound having at least two primary amino groups in a molecular structure and (c) a maleimide compound having at least two N-substituted maleimide groups in a molecular structure. The prepreg, laminate and printed wiring board using the composition are also provided.
摘要翻译：要解决的问题：提供耐湿性优异和热膨胀性低的树脂组合物，同时特别保持耐热性，并提供使用该组合物的预浸料，层压板和印刷线路板。解决方案：热固性树脂组合物的特征在于：（a）分子结构中具有不饱和双键的硅氧烷化合物，（b）分子结构中具有至少两个伯氨基的胺化合物和（c）在分子结构中具有至少两个N-取代马来酰亚胺基团的马来酰亚胺化合物。还提供了使用该组合物的预浸料，层压板和印刷线路板。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2012236909A Thermosetting resin composition, and prepreg, laminate and printed wiring board using the same 审中-公开
标题翻译：热固性树脂组合物和PREPREG，层压板和印刷线路板
公开(公告)号：JP2012236909A
公开(公告)日：2012-12-06
申请号：JP2011106671
申请日：2011-05-11
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： NAGAI SHUNSUKE , MIYATAKE MASATO , KOTAKE TOMOHIKO , TAKANEZAWA SHIN , MURAI AKIRA
IPC分类号： C08G59/40 , B32B15/08 , B32B27/04 , B32B27/38 , C08G59/68 , C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition excellent in low thermal expansion, heat resistance, and adhesion, and a prepreg and a laminate and a printed wiring board excellent in warpage characteristics and resistance to desmearing, which use the resin composition.SOLUTION: A thermosetting resin composition includes: a compound (A) having an acidic substituent and an N-substituted maleimide group in molecular structure produced by the reaction of a maleimide compound (a) having at least two N-substituted maleimide groups in one molecule with an amine compound (b) having an acidic substituent represented by general formula (I); and a bisphenol F novolak type epoxy resin (B) having an average molecular weight of 500-10,000. The prepreg, the laminate, and the printed wiring board use the thermosetting resin composition. In formula, when a plurality of Rs are present, Rs are each independently an acidic substituent selected from a hydroxyl group, a carboxy group, and a sulfonic acid group; when a plurality of Rs are present, Rs are each independently a hydrogen atom, a 1-5C aliphatic hydrocarbon group, or a halogen atom; and x is an integer of 1-5, y is an integer of 0-4, and the sum of x and y is 5.
摘要翻译：要解决的问题：提供使用该树脂组合物的低热膨胀性，耐热性和粘合性优异的树脂组合物以及具有优异的翘曲特性和耐干燥性的预浸料和层压体以及印刷线路板。解决方案：热固性树脂组合物包括：具有酸性取代基的化合物（A）和通过具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物（a）的反应制备的分子结构中的N-取代的马来酰亚胺基团在具有由通式（I）表示的酸性取代基的胺化合物（b）的一个分子中; 和平均分子量为500〜10000的双酚F酚醛清漆型环氧树脂（B）。预浸料，层压体和印刷布线板使用热固性树脂组合物。在式中，当存在多个R 1 时，R“SB POS =”POST“> 1 各自独立地为选自羟基的酸性取代基基，羧基和磺酸基; 当存在多个R 2 时，R 2 各自独立地为氢原子，1-5C脂族烃基团或卤素原子; x为1〜5的整数，y为0〜4的整数，x与y的和为5.（C）2013，JPO＆INPIT

8. 发明专利

JP2011052183A Thermosetting insulating resin composition and insulating film with substrate using the same, prepreg, laminated board, and multilayer printed circuit board 有权
标题翻译：热固性绝缘树脂组合物和绝缘膜与使用其的基板，PREPREG，层压板和多层印刷电路板
公开(公告)号：JP2011052183A
公开(公告)日：2011-03-17
申请号：JP2009204899
申请日：2009-09-04
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KOTAKE TOMOHIKO , TSUCHIKAWA SHINJI , AKIYAMA MASANORI , IZUMI HIROYUKI
IPC分类号： C08G59/40 , C08J5/24 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting insulating resin composition of a low thermal expansion property, with a high glass transition temperature and excellent heat resistance, an insulating film with a substrate using the same, a prepreg, a laminated board, and a multilayer printed circuit board. SOLUTION: The thermosetting insulating resin composition includes (A) a curing agent including an acidic substituent and an N-substituted maleimide group obtained by reacting (a) a diamine compound having a biphenyl skeleton in the principal molecular chain, (b) a maleimide compound having at least two N-substituted maleimide groups in the molecular structure and (c) a monoamine compound, (B) an epoxy resin having at least two epoxy groups in the molecule, and (C) a phosphorous compound providing flame retardancy. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决问题：为了提供具有低玻璃化转变温度和优异耐热性的低热膨胀特性的热固性绝缘树脂组合物，具有使用其的基板的绝缘膜，预浸料，层压板，和多层印刷电路板。解决方案：热固性绝缘树脂组合物包含（A）包含酸性取代基的固化剂和通过（a）主分子链中具有联苯骨架的二胺化合物得到的N-取代的马来酰亚胺基团，（b）在分子结构中具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物和（c）单胺化合物，（B）分子中具有至少两个环氧基的环氧树脂，和（C）提供阻燃性的磷化合物。版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2010043254A Thermosetting insulating resin composition, and prepreg, film with resin, laminate and multilayer printed wiring board using the same 有权
标题翻译：热固性绝缘树脂组合物，和PREPREG，带树脂的薄膜，层压板和多层印刷线路板
公开(公告)号：JP2010043254A
公开(公告)日：2010-02-25
申请号：JP2009166981
申请日：2009-07-15
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KOTAKE TOMOHIKO , TSUCHIKAWA SHINJI , IZUMI HIROYUKI , AKIYAMA MASANORI , MURAI AKIRA
IPC分类号： C08G73/10 , B32B15/08 , B32B27/34 , C08J5/24 , C08K3/00 , C08L63/00 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting insulating resin composition having low thermal expandability, a high glass transition temperature (Tg) and excellent heat resistance, and to provide a prepreg, a film with resin, a laminate and a multilayer printed wiring board using the same. SOLUTION: The thermosetting insulating resin composition includes a compound (1) having a biphenyl skeleton in its molecule, which is obtained by reacting the following components (a), (b), and (c): (a) an aromatic diamine compound having a biphenyl skeleton in its molecule; (b) a maleimide compound having at least two N-substituted maleimide groups in its molecular structure; and (c) a monoamine compound. The thermosetting insulating resin composition may further include an epoxy resin (2), an epoxy resin curing agent (3) and an inorganic filler (4). The prepreg, the film with resin, the laminate and the multilayer printed wiring board include the thermosetting insulating resin composition. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种具有低热膨胀性，高玻璃化转变温度（Tg）和优异的耐热性的热固性绝缘树脂组合物，并提供预浸料，具有树脂的膜，层压板和多层印刷接线板使用相同。解决方案：热固性绝缘树脂组合物包括其分子中具有联苯骨架的化合物（1），其通过使以下组分（a），（b）和（c）反应获得：（a）芳族二胺化合物在其分子中具有联苯骨架; （b）在其分子结构中具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物; 和（c）单胺化合物。热固性绝缘树脂组合物还可以包含环氧树脂（2），环氧树脂固化剂（3）和无机填料（4）。预浸料，具有树脂的膜，层压体和多层印刷线路板包括热固性绝缘树脂组合物。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2010235690A Thermosetting insulating resin composition, and insulating film with support, prepreg, laminated board and multilayer printed wiring board using the same 有权
标题翻译：热固性绝缘树脂组合物和带有支撑物的绝缘膜，PREPREG，层压板和使用其的多层印刷线路板
公开(公告)号：JP2010235690A
公开(公告)日：2010-10-21
申请号：JP2009082884
申请日：2009-03-30
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KOTAKE TOMOHIKO , TSUCHIKAWA SHINJI , AKIYAMA MASANORI , IZUMI HIROYUKI
IPC分类号： C08G59/40 , B32B27/38 , C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting insulating resin composition having high glass transition temperature, excellent heat resistance, and low thermal expansion properties, and an insulating film with a support, a prepreg, a laminated board and a multilayer printed wiring board using the same.
SOLUTION: The thermosetting insulating resin composition includes: (A) a setting agent containing a compound having an acidic substituent and N-substituted maleimide group which is obtained by reacting (a) a diamine compound having a sulfur atom on the main chain in its molecule, (b) a maleimide compound having at least two N-substituted maleimide groups in the molecular structure, and (c) a monoamine compound, in an organic solvent; (B) an epoxy resin having at least two epoxy groups per molecule; and (C) a phosphorus compound imparting flame retardancy.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供一种具有高玻璃化转变温度，优异的耐热性和低热膨胀性的热固性绝缘树脂组合物，以及具有载体，预浸料，层压板和多层印刷布线的绝缘膜板使用相同。解决方案：热固性绝缘树脂组合物包括：（A）含有具有酸性取代基的化合物和N-取代的马来酰亚胺基的固化剂，其通过（a）主链上具有硫原子的二胺化合物在其分子中，（b）在分子结构中具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物，和（c）在有机溶剂中的单胺化合物; （B）每分子具有至少两个环氧基的环氧树脂; 和（C）赋予阻燃性的磷化合物。版权所有（C）2011，JPO＆INPIT

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