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1. 发明专利

JP2011052183A Thermosetting insulating resin composition and insulating film with substrate using the same, prepreg, laminated board, and multilayer printed circuit board 有权
标题翻译：热固性绝缘树脂组合物和绝缘膜与使用其的基板，PREPREG，层压板和多层印刷电路板
公开(公告)号：JP2011052183A
公开(公告)日：2011-03-17
申请号：JP2009204899
申请日：2009-09-04
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KOTAKE TOMOHIKO , TSUCHIKAWA SHINJI , AKIYAMA MASANORI , IZUMI HIROYUKI
IPC分类号： C08G59/40 , C08J5/24 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting insulating resin composition of a low thermal expansion property, with a high glass transition temperature and excellent heat resistance, an insulating film with a substrate using the same, a prepreg, a laminated board, and a multilayer printed circuit board. SOLUTION: The thermosetting insulating resin composition includes (A) a curing agent including an acidic substituent and an N-substituted maleimide group obtained by reacting (a) a diamine compound having a biphenyl skeleton in the principal molecular chain, (b) a maleimide compound having at least two N-substituted maleimide groups in the molecular structure and (c) a monoamine compound, (B) an epoxy resin having at least two epoxy groups in the molecule, and (C) a phosphorous compound providing flame retardancy. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决问题：为了提供具有低玻璃化转变温度和优异耐热性的低热膨胀特性的热固性绝缘树脂组合物，具有使用其的基板的绝缘膜，预浸料，层压板，和多层印刷电路板。解决方案：热固性绝缘树脂组合物包含（A）包含酸性取代基的固化剂和通过（a）主分子链中具有联苯骨架的二胺化合物得到的N-取代的马来酰亚胺基团，（b）在分子结构中具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物和（c）单胺化合物，（B）分子中具有至少两个环氧基的环氧树脂，和（C）提供阻燃性的磷化合物。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2010043254A Thermosetting insulating resin composition, and prepreg, film with resin, laminate and multilayer printed wiring board using the same 有权
标题翻译：热固性绝缘树脂组合物，和PREPREG，带树脂的薄膜，层压板和多层印刷线路板
公开(公告)号：JP2010043254A
公开(公告)日：2010-02-25
申请号：JP2009166981
申请日：2009-07-15
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KOTAKE TOMOHIKO , TSUCHIKAWA SHINJI , IZUMI HIROYUKI , AKIYAMA MASANORI , MURAI AKIRA
IPC分类号： C08G73/10 , B32B15/08 , B32B27/34 , C08J5/24 , C08K3/00 , C08L63/00 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting insulating resin composition having low thermal expandability, a high glass transition temperature (Tg) and excellent heat resistance, and to provide a prepreg, a film with resin, a laminate and a multilayer printed wiring board using the same. SOLUTION: The thermosetting insulating resin composition includes a compound (1) having a biphenyl skeleton in its molecule, which is obtained by reacting the following components (a), (b), and (c): (a) an aromatic diamine compound having a biphenyl skeleton in its molecule; (b) a maleimide compound having at least two N-substituted maleimide groups in its molecular structure; and (c) a monoamine compound. The thermosetting insulating resin composition may further include an epoxy resin (2), an epoxy resin curing agent (3) and an inorganic filler (4). The prepreg, the film with resin, the laminate and the multilayer printed wiring board include the thermosetting insulating resin composition. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种具有低热膨胀性，高玻璃化转变温度（Tg）和优异的耐热性的热固性绝缘树脂组合物，并提供预浸料，具有树脂的膜，层压板和多层印刷接线板使用相同。解决方案：热固性绝缘树脂组合物包括其分子中具有联苯骨架的化合物（1），其通过使以下组分（a），（b）和（c）反应获得：（a）芳族二胺化合物在其分子中具有联苯骨架; （b）在其分子结构中具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物; 和（c）单胺化合物。热固性绝缘树脂组合物还可以包含环氧树脂（2），环氧树脂固化剂（3）和无机填料（4）。预浸料，具有树脂的膜，层压体和多层印刷线路板包括热固性绝缘树脂组合物。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2010235690A Thermosetting insulating resin composition, and insulating film with support, prepreg, laminated board and multilayer printed wiring board using the same 有权
标题翻译：热固性绝缘树脂组合物和带有支撑物的绝缘膜，PREPREG，层压板和使用其的多层印刷线路板
公开(公告)号：JP2010235690A
公开(公告)日：2010-10-21
申请号：JP2009082884
申请日：2009-03-30
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KOTAKE TOMOHIKO , TSUCHIKAWA SHINJI , AKIYAMA MASANORI , IZUMI HIROYUKI
IPC分类号： C08G59/40 , B32B27/38 , C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting insulating resin composition having high glass transition temperature, excellent heat resistance, and low thermal expansion properties, and an insulating film with a support, a prepreg, a laminated board and a multilayer printed wiring board using the same.
SOLUTION: The thermosetting insulating resin composition includes: (A) a setting agent containing a compound having an acidic substituent and N-substituted maleimide group which is obtained by reacting (a) a diamine compound having a sulfur atom on the main chain in its molecule, (b) a maleimide compound having at least two N-substituted maleimide groups in the molecular structure, and (c) a monoamine compound, in an organic solvent; (B) an epoxy resin having at least two epoxy groups per molecule; and (C) a phosphorus compound imparting flame retardancy.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供一种具有高玻璃化转变温度，优异的耐热性和低热膨胀性的热固性绝缘树脂组合物，以及具有载体，预浸料，层压板和多层印刷布线的绝缘膜板使用相同。解决方案：热固性绝缘树脂组合物包括：（A）含有具有酸性取代基的化合物和N-取代的马来酰亚胺基的固化剂，其通过（a）主链上具有硫原子的二胺化合物在其分子中，（b）在分子结构中具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物，和（c）在有机溶剂中的单胺化合物; （B）每分子具有至少两个环氧基的环氧树脂; 和（C）赋予阻燃性的磷化合物。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2010229356A Thermosetting insulating resin composition and insulating film with substrate, prepreg, laminated board, and multilayer printed wiring board using the same 有权
标题翻译：使用基板，PREPREG，层压板和多层印刷线路板的热固化绝缘树脂组合物和绝缘膜
公开(公告)号：JP2010229356A
公开(公告)日：2010-10-14
申请号：JP2009080409
申请日：2009-03-27
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KOTAKE TOMOHIKO , TSUCHIKAWA SHINJI , IZUMI HIROYUKI , AKIYAMA MASANORI
IPC分类号： C08G59/40 , B32B27/38 , C08J5/24 , C08L63/00 , C08L101/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting insulating resin composition having high heat-resistance and low thermal expansion and exhibiting excellent plating adhesion strength; and an insulating film with a substrate, a prepreg, a laminated board, and a multilayer printed wiring board using the same. SOLUTION: Thermosetting insulating resin composition contains: a curing agent (A) having a N-substituted maleimide group and an acidic substituent produced by reacting a maleimide compound (a) having at least two N-substituted maleimide groups in one molecule with an amine compound (b) having an acidic substituent in an organic solvent; an epoxy resin (B) having at least two epoxy groups in one molecule; and a compound (C) capable of chemical roughening. The insulating film with a substrate, the prepreg, the laminated board, and the multilayer printed wiring board uses the thermosetting insulating resin composition. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供具有高耐热性和低热膨胀性并且具有优异的电镀粘合强度的热固性绝缘树脂组合物; 以及具有基板，预浸料，层压板和使用该绝缘膜的多层印刷布线板的绝缘膜。解决方案：热固性绝缘树脂组合物包含：具有N-取代的马来酰亚胺基团的固化剂（A）和通过使在一个分子中具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物（a）与一在有机溶剂中具有酸性取代基的胺化合物（b）; 在一个分子中具有至少两个环氧基的环氧树脂（B）; 和能够进行化学粗化的化合物（C）。具有基板，预浸料，层压板和多层印刷线路板的绝缘膜使用热固性绝缘树脂组合物。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2009105283A Copper foil with resin for multilayer printed wiring board, and multilayer printed wiring board manufactured by using the same 有权
标题翻译：用于多层印刷线路板的酚醛树脂和使用其制造的多层印刷线路板
公开(公告)号：JP2009105283A
公开(公告)日：2009-05-14
申请号：JP2007276764
申请日：2007-10-24
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KOTAKE TOMOHIKO , TSUCHIKAWA SHINJI , AKIYAMA MASANORI
IPC分类号： H05K3/46 , B32B15/08 , B32B15/092 , B32B27/18 , C08G59/56
摘要： PROBLEM TO BE SOLVED: To provide a copper foil with a resin for a multilayer printed wiring board easily moldable and well-balanced in all properties including metal foil adhesion, heat resistance, humidity resistance, flame retardance, metal-adhering heat resistance, specific inductive capacity, and dielectric loss tangent; and to provide a high performance and high density multilayer printed wiring board prepared using the same.
SOLUTION: The copper foil with the resin for a multilayer printed wiring board is provided by applying to one surface of a copper foil, being followed with a stage B conversion process: a thermosetting resin composition in the form of a homogeneous solution containing a 6-substituted guanamine compound (a), a phenolic compound (b), an epoxy resin (c) having at least two epoxy groups in one molecule and an organic solvent (d); or a thermosetting resin composition in the form of a homogeneous solution obtained by adding a maleimide compound (e) having at least two N-substituted maleimide groups in one molecule to the above thermosetting resin and making the maleimide compound (e) react with the 6-substituted guanamine compound (a). A multilayer printed wiring board manufactured using the same is also provided.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有用于多层印刷线路板的树脂的铜箔，其易于成型并且在包括金属箔粘合性，耐热性，耐湿性，阻燃性，金属粘附耐热性等所有性能方面均衡良好介电损耗角正切; 并提供使用其制备的高性能和高密度多层印刷线路板。＆lt; P＆gt;解决方案：具有用于多层印刷线路板的树脂的铜箔通过涂覆在铜箔的一个表面上，随后进行阶段B转化工艺来提供：含有均匀溶液形式的热固性树脂组合物，其含有一种分子中具有至少两个环氧基的6-取代胍胺化合物（a），酚类化合物（b），环氧树脂（c）和有机溶剂（d）; 或通过在一个分子中将具有至少两个N-取代马来酰亚胺基团的马来酰亚胺化合物（e）加入到上述热固性树脂中并使马来酰亚胺化合物（e）与6摩尔比反应得到的均匀溶液形式的热固性树脂组合物 - 取代的胍胺化合物（a）。还提供了使用其制造的多层印刷线路板。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2008111096A Thermosetting resin composition and prepreg and laminate obtained with the same 有权
标题翻译：热固性树脂组合物和与其相同的PREPREG和层压板
公开(公告)号：JP2008111096A
公开(公告)日：2008-05-15
申请号：JP2007199097
申请日：2007-07-31
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： AKIYAMA MASANORI , TSUCHIKAWA SHINJI , KOTAKE TOMOHIKO
IPC分类号： C08G59/58 , B32B15/088 , C08J5/24
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition having a good balance among all of adhesion to metal foils, heat resistance, moisture resistance, flame retardancy, heat resistance in the state of being adherent to metals, relative permittivity, and dielectric dissipation factor; and to provide a prepreg and laminate obtained with the composition.
SOLUTION: The thermosetting resin composition comprises (A) a hardener having an acid substituent and an unsaturated maleimide group and produced by a specific process, (B) a dicyandiamide, (C) a copolymer resin having a specific monomer unit, and (D) an epoxy resin; and the prepreg and laminate are obtained with the composition.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种在与金属箔的所有粘附性之间具有良好平衡的热固性树脂组合物，耐热性，耐湿性，阻燃性，与金属附着的状态下的耐热性，相对介电常数和介电损耗因子; 并提供用该组合物获得的预浸料和层压材料。解决方案：热固性树脂组合物包含（A）具有酸取代基和不饱和马来酰亚胺基团并通过特定方法制备的固化剂，（B）双氰胺，（C）具有特定单体单元的共聚物树脂，和（D）环氧树脂; 并用组合物获得预浸料和层压材料。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2011052184A Thermosetting insulating resin composition and insulating film with substrate using the same, prepreg, laminated board, and multilayer printed circuit board 有权
标题翻译：热固性绝缘树脂组合物和绝缘膜与使用其的基板，PREPREG，层压板和多层印刷电路板
公开(公告)号：JP2011052184A
公开(公告)日：2011-03-17
申请号：JP2009204904
申请日：2009-09-04
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KOTAKE TOMOHIKO , TSUCHIKAWA SHINJI , IZUMI HIROYUKI , MURAI AKIRA
IPC分类号： C08G59/40 , B32B27/38 , C08G73/12 , C08J5/24 , C08L21/00 , C08L29/14 , C08L63/00 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting insulating resin composition of a low thermal expansion property, with a high glass transition temperature and excellent heat resistance, an insulating film with a substrate using the same, a prepreg, a laminated board, and a multilayer printed circuit board. SOLUTION: The thermosetting insulating resin composition includes (A) a curing agent having a sulfur atom in the principal molecular chain, and an acidic substituent and an N-substituted maleimide group obtained by reacting (a) a diamine compound having a sulfur atom in the principal molecular chain, (b) a maleimide compound having at least two N-substituted maleimide groups in the molecular structure and (c) a monoamine compound, (B) an epoxy resin having at least two epoxy groups in the molecule, and (C) a compound enabling chemical roughing. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决问题：为了提供具有低玻璃化转变温度和优异耐热性的低热膨胀特性的热固性绝缘树脂组合物，具有使用其的基板的绝缘膜，预浸料，层压板，和多层印刷电路板。解决方案：热固性绝缘树脂组合物包括（A）在主分子链中具有硫原子的固化剂和酸性取代基和N-取代的马来酰亚胺基团，其通过使（a）具有硫的二胺化合物（b）在分子结构中具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物和（c）单胺化合物，（B）分子中具有至少两个环氧基的环氧树脂，和（C）化学粗化化合物。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2010043253A Thermosetting insulating resin composition, and prepreg, film with resin, laminate and multilayer printed wiring board using the same 有权
标题翻译：热固性绝缘树脂组合物，和PREPREG，带树脂的薄膜，层压板和多层印刷线路板
公开(公告)号：JP2010043253A
公开(公告)日：2010-02-25
申请号：JP2009166977
申请日：2009-07-15
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KOTAKE TOMOHIKO , TSUCHIKAWA SHINJI , IZUMI HIROYUKI , AKIYAMA MASANORI , MURAI AKIRA
IPC分类号： C08G73/10 , B32B15/08 , B32B27/34 , C08J5/24 , C08K3/00 , C08L63/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting insulating resin composition having a high glass transition temperature (Tg), excellent heat resistance and low thermal expandability, and to provide a prepreg, a film with resin, a laminate and a multilayer printed wiring board using the same.
SOLUTION: The thermosetting insulating resin composition includes (1) a compound having an S atom in its molecular skeleton, which is obtained by reacting the following components (a), (b), and (c): (a) an aromatic diamine compound having an S atom in its molecular skeleton; (b) a maleimide compound having at least two N-substituted maleimide groups in its molecular structure; and (c) a monoamine compound. The thermosetting insulating resin composition may further contain (2) an epoxy resin containing at least two epoxy groups per molecule, (3) an epoxy resin curing agent and (4) an inorganic filler. The prepreg, the film with resin, the laminate and the multilayer printed wiring board contain the thermosetting insulating resin composition.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有高玻璃化转变温度（Tg），优异的耐热性和低热膨胀性的热固性绝缘树脂组合物，并提供预浸料，具有树脂的膜，层压板和多层印刷接线板使用相同。解决方案：热固性绝缘树脂组合物包括（1）通过使以下组分（a），（b）和（c）反应获得的分子骨架中具有S原子的化合物：（a）芳族二胺化合物在其分子骨架中具有S原子; （b）在其分子结构中具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物; 和（c）单胺化合物。热固性绝缘树脂组合物还可以含有（2）每分子含有至少两个环氧基的环氧树脂，（3）环氧树脂固化剂和（4）无机填料。预浸料，具有树脂的膜，层压体和多层印刷布线板包含热固性绝缘树脂组合物。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2009024146A Thermosetting resin composition and prepreg and laminate using the same 有权
标题翻译：使用相同的热固性树脂组合物和PREPREG和层压板
公开(公告)号：JP2009024146A
公开(公告)日：2009-02-05
申请号：JP2007204363
申请日：2007-08-06
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUCHIKAWA SHINJI , AKIYAMA MASANORI , KOTAKE TOMOHIKO
IPC分类号： C08G59/40 , B32B15/092 , C08J5/24
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition that is well-balanced among all of adhesion to a metal foil, heat resistance, moisture resistance, flame retardancy, heat resistance at the interface between the composition and a metal adherent to the composition, relative dielectric constant and dielectric dissipation factor and to provide a prepreg and a laminate using the thermosetting resin composition.
SOLUTION: The thermosetting resin composition comprises (A) a curing agent having an acid substituent and an unsaturated maleimide group, which is produced by a specific process, (B) a 6-substituted guanamine compound, (C) a copolymer resin containing a specific monomer unit and (D) an epoxy resin. The prepreg and the laminate using the thermosetting resin composition are provided.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种热固性树脂组合物，其在与金属箔的所有粘附性之间均衡平衡，耐热性，耐湿性，阻燃性，组合物与附着于金属箔的金属之间的界面处的耐热性组成，相对介电常数和介电损耗因数，并提供预浸料和使用该热固性树脂组合物的层压材料。解决方案：热固性树脂组合物包含（A）具有酸取代基的固化剂和通过特定方法制备的不饱和马来酰亚胺基团，（B）6-取代胍胺化合物，（C）共聚物树脂含有特定的单体单元和（D）环氧树脂。提供了预浸料和使用热固性树脂组合物的层压材料。版权所有（C）2009，JPO＆INPIT

10. 发明专利

JP2012021098A Thermosetting resin composition, prepreg using the same, and laminate using the prepreg 有权
标题翻译：热固性树脂组合物，使用相同的PREPREG和使用PREPREG的层压板
公开(公告)号：JP2012021098A
公开(公告)日：2012-02-02
申请号：JP2010160982
申请日：2010-07-15
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MIYATAKE MASATO , KOTAKE TOMOHIKO , NAGAI SHUNSUKE , TAKANEZAWA SHIN , MURAI AKIRA
IPC分类号： C08G59/50 , C08J5/24 , C08K3/00 , C08L63/04 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition excellent in adhesiveness, heat resistance, moisture resistance, flame retardancy, dielectric property and the like, and particularly having a characteristic such that the warpage amount of the substrate thereof when heated is extremely small; and to provide a prepreg using the composition and also a laminate using the prepreg.SOLUTION: The thermosetting resin composition contains a setting agent (A) having the N-substituted maleimide groups and acidic substituent, produced by reacting a maleimide compound (a) having at least two N-substituted maleimide groups in one molecule with an amino compound (b) having the acidic substituent represented by general formula (I), and a bisphenol F type phenol novolac epoxy resin (B) (wherein Rs are each independently hydroxyl being an acidic substituent, carboxyl or sulfonic acid; Rs are each independently 1-5C aliphatic hydrocarbon or halogen; and x is an integer of 1 to 5, y is an integer of 0 to 4 and x+y=5). The invention further provides a prepreg using the composition and a laminate using the prepreg.
摘要翻译：要解决的问题：提供粘合性，耐热性，耐湿性，阻燃性，介电性等优异的树脂组合物，特别是具有使其加热时的基材的翘曲量极其特性的特性小; 并提供使用该组合物的预浸料，以及使用该预浸料的层压体。解决方案：热固性树脂组合物含有具有N-取代的马来酰亚胺基和酸性取代基的固化剂（A），其通过使一分子中具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物（a）与一具有由通式（I）表示的酸性取代基的氨基化合物（b）和双酚F型酚醛清漆环氧树脂（B）（其中R 1 作为酸性取代基，羧基或磺酸; R 2各自独立地为1-5C脂族烃或卤素; x为1〜5的整数，y为整数 0〜4，x + y = 5）。本发明还提供使用该组合物的预浸料坯和使用该预浸料的层压材料。版权所有（C）2012，JPO＆INPIT

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