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1. 发明专利

JP2005255978A Epoxy resin molding material for sealing and electronic part apparatus 审中-公开
标题翻译：环氧树脂模塑材料用于密封和电子部件装置
公开(公告)号：JP2005255978A
公开(公告)日：2005-09-22
申请号：JP2004358602
申请日：2004-12-10
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE HISANORI , AKIMOTO TAKAYUKI , TAMATE HIRONORI , MIYABAYASHI KAZUHIKO
IPC分类号： C08L63/00 , C08L23/00 , C08L35/00 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing which imparts good mold releasability and good package appearances particularly to a thin electronic part package, and an electronic part apparatus equipped with an element sealed with the same.
SOLUTION: The epoxy resin molding material for sealing comprises an epoxy resin (A), a curing agent (B), a polyolefin mold release agent (C), and a compound (D1) which satisfies q>(r+s) and selected from among copolymers (D), represented by formula (I) (wherein R
1 is hydrogen atom or an aliphatic hydrocarbon group; R
2 is hydrogen atom or a hydrocarbon group; R
3 and R
4 are the same or different and are each a hydrocarbon group; R
5 -R
10 are the same or different and are each hydrogen atom or a hydrocarbon group; (p) is a positive integer; and (q), (r) and (s) are each 0 or a positive integer, provided that the case of q=r=s=0 is excepted), of an α-olefin with at least either one of maleic anhydride and a maleic anhydride derivative. The electronic part apparatus is equipped with the element sealed with the same.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种密封用环氧树脂成型材料，其具有良好的脱模性和良好的封装外观，特别是薄型电子部件封装，以及配备有密封该元件的元件的电子部件装置。解决方案：用于密封的环氧树脂模制材料包括环氧树脂（A），固化剂（B），聚烯烃脱模剂（C）和化合物（D1），其满足q>（r + s ），并且选自由式（I）表示的共聚物（D）（其中R 1 是氢原子或脂族烃基; R SB> 2 是氢原子或烃基; R 3 和R“SB 4”相同或不同，各自为烃基; R“SB” / SB>相同或不同，各自为氢原子或烃基;（p）为正整数;并且（q），（r）和（s）各自为0或正整数，条件是该情况的q = r = s = 0）除去与马来酸酐和马来酸酐衍生物中的至少一种的α-烯烃。电子部件装置装有用其密封的元件。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2005325159A Sealing epoxy resin molding material and electronic component device 审中-公开
标题翻译：密封环氧树脂模塑材料和电子元件装置
公开(公告)号：JP2005325159A
公开(公告)日：2005-11-24
申请号：JP2004142150
申请日：2004-05-12
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE HISANORI , TAMATE HIRONORI , ODA TOMOICHI , AKIMOTO TAKAYUKI
IPC分类号： C08G59/42 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide a sealing epoxy resin molding material which is a sealing molding material made from a low-molecular epoxy resin and, especially when used in a thin package, gives a good package appearance and leaves no resin in an air vent and to provide an electronic component device equipped with an element sealed therewith.
SOLUTION: The sealing epoxy resin molding material comprises (A) an epoxy resin, (B) a curing agent, (C) a premix comprising an epoxy resin (C1) of an ICI viscosity of at most 0.2 Pa s at 150°C, an oxidized polyolefin (C2), and at least one copolymer (C3) of an α-olefin with at least either of maleic anhydride and a maleic anhydride derivative, and (D) a premix comprising an epoxy resin or a curing agent and an oxidized polyolefin.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种密封环氧树脂成型材料，其是由低分子环氧树脂制成的密封成型材料，特别是在薄包装中使用时，具有良好的包装外观并且不会留下树脂一个通风口，并提供一个配有密封件的电子部件装置。密封环氧树脂成型材料包括（A）环氧树脂，（B）固化剂，（C）包含ICI粘度为0.2Pa·s以下的环氧树脂（C1）的预混物，150 ℃，氧化聚烯烃（C2）和至少一种α-烯烃与马来酸酐和马来酸酐衍生物中的至少一种的共聚物（C3），和（D）包含环氧树脂或固化剂的预混物和氧化聚烯烃。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2005232268A Epoxy resin molding material for sealing and electronic part device 审中-公开
标题翻译：环氧树脂模塑材料用于密封和电子部件装置
公开(公告)号：JP2005232268A
公开(公告)日：2005-09-02
申请号：JP2004041369
申请日：2004-02-18
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE HISANORI , AKIMOTO TAKAYUKI , TAMATE HIRONORI , ODA TOMOICHI , MIZUKAMI YOSHIHIRO
IPC分类号： C08L63/00 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing which imparts good package appearances particularly to a thin package, and an electronic part device equipped with an element sealed with the same.
SOLUTION: The epoxy resin molding material for sealing comprises, as essential ingredients, (A) an epoxy resin, (B) a curing agent, (C) at least one of an oxidized polymer or an oxidized copolymer of at least one of ethylene and propylene having a weight-average molecular weight of at least 4,000 and a penetration of larger than 2, and (D) a compound obtained by esterifying a copolymer of a 5-30C α-olefin and maleic anhydride with a 5-25C monohydric alcohol. The electronic part device is equipped with the element sealed with the epoxy resin molding material for sealing.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于密封的环氧树脂模制材料，其特别是薄的封装具有良好的封装外观，以及配有密封该元件的元件的电子部件装置。解决方案：用于密封的环氧树脂模制材料包括（A）环氧树脂，（B）固化剂，（C）至少一种氧化聚合物或至少一种氧化聚合物的氧化共聚物作为必要成分的重均分子量为4000以上，渗透率大于2的乙烯和丙烯，（D）将5-30℃的α-烯烃与马来酸酐的共聚物与5〜25℃的酯化而得到的化合物一元醇。电子部件装置装有用环氧树脂成型材料密封的元件。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2005232267A Epoxy resin molding material for sealing and electronic part device 审中-公开
标题翻译：环氧树脂模塑材料用于密封和电子部件装置
公开(公告)号：JP2005232267A
公开(公告)日：2005-09-02
申请号：JP2004041366
申请日：2004-02-18
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE HISANORI , AKIMOTO TAKAYUKI , TAMATE HIRONORI , JINBO AKIRA , MIZUKAMI YOSHIHIRO , HAYASHI TOSHIHIRO
IPC分类号： C08L63/00 , C08K5/1535 , C08K5/1545 , H01L23/29 , H01L23/31
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing which imparts good mold-releasability and good package appearances particularly to a thin package, and an electronic part device equipped with an element sealed with the same. SOLUTION: The epoxy resin molding material for sealing comprises, as essential ingredients, (A) an epoxy resin, (B) a curing agent, (C) a polyolefin release agent, and (D) a mixture of a compound represented by general formula (I) with a compound represented by general formula (II). The electronic part device is equipped with the element sealed with the same. In general formula (I), l, n and m are each 0 or a positive integer and R is a monovalent saturated or unsaturated hydrocarbon group. In general formula (II), l, n and m are each 0 or a positive integer and R is a monovalent saturated or unsaturated hydrocarbon group. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种密封用环氧树脂成型材料，其具有良好的脱模性和良好的封装外观，特别是薄封装，以及配备有密封的元件的电子部件装置。解决方案：用于密封的环氧树脂模制材料包括（A）环氧树脂，（B）固化剂，（C）聚烯烃脱模剂和（D）表示的化合物的混合物作为必要成分由通式（I）与通式（II）表示的化合物反应。电子部件装置装有用其密封的元件。在通式（I）中，l，n和m各自为0或正整数，R为单价饱和或不饱和烃基。在通式（II）中，l，n和m各自为0或正整数，R为单价饱和或不饱和烃基。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2008115381A Epoxy resin composition and electronic component device using the same 审中-公开
标题翻译：环氧树脂组合物和使用该环氧树脂组合物的电子元件装置
公开(公告)号：JP2008115381A
公开(公告)日：2008-05-22
申请号：JP2007265636
申请日：2007-10-11
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAMATE HIRONORI , NARA NAOKI
IPC分类号： C08L63/00 , C08K7/18 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in flowability and in mold-filling property even in a high filling rate of an inorganic filler, and to provide an electronic parts device using the same. SOLUTION: The epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein, the ratio of the inorganic filler (C) to the total resin composition is 75-95 wt.%, and a mean value of the sphericity of the inorganic filler (C) at a particle diameter of 10-45 μm is at least 0.93. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：即使在无机填料的高填充率下，也提供流动性和模具填充性优异的环氧树脂组合物，并提供使用该环氧树脂组合物的电子部件装置。解决方案：环氧树脂组合物包含（A）环氧树脂，（B）固化剂和（C）无机填料，其中无机填料（C）与总树脂组合物的比例为75 -95重量％，粒径为10-45μm的无机填料（C）的球形度的平均值为至少0.93。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2005232266A Epoxy resin molding material for sealing and electronic part device 审中-公开
标题翻译：环氧树脂模塑材料用于密封和电子部件装置
公开(公告)号：JP2005232266A
公开(公告)日：2005-09-02
申请号：JP2004041365
申请日：2004-02-18
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE HISANORI , AKIMOTO TAKAYUKI , TAMATE HIRONORI , JINBO AKIRA , MIZUKAMI YOSHIHIRO , HAYASHI TOSHIHIRO
IPC分类号： C08L63/00 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing which imparts good package appearances particularly to a thin package, and an electronic part device equipped with an element sealed with the same. SOLUTION: The epoxy resin molding material for sealing comprises, as essential ingredients, (A) an epoxy resin, (B) a curing agent, (C) at least one of an oxidized polymer or an oxidized copolymer of at least one of ethylene and propylene having a weight-average molecular weight of at least 1,000 but less than 4,000, and (D) a compound obtained by esterifying a copolymer of a 5-30C α-olefin and maleic anhydride with a 5-25C monohydric alcohol. The electronic part device is equipped with the element sealed with the epoxy resin molding material for sealing. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于密封的环氧树脂模制材料，其特别是薄的封装具有良好的封装外观，以及配有密封该元件的元件的电子部件装置。解决方案：用于密封的环氧树脂模制材料包括（A）环氧树脂，（B）固化剂，（C）至少一种氧化聚合物或至少一种氧化聚合物的氧化共聚物作为必要成分的重均分子量为1,000〜4,000的乙烯和丙烯，（D）将5-30℃的α-烯烃与马来酸酐的共聚物与5〜25℃的一元醇酯化而成的化合物。电子部件装置装有用环氧树脂成型材料密封的元件。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2004175842A Epoxy resin molding material for sealing and electronic part device 审中-公开
公开(公告)号：JP2004175842A
公开(公告)日：2004-06-24
申请号：JP2002340665
申请日：2002-11-25
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE HISANORI , HAGIWARA SHINSUKE , YAMAMORI MASAMI , FURUSAWA FUMIO , MIYABAYASHI KAZUHIKO , TAMATE HIRONORI
IPC分类号： C08K3/00 , C08G59/40 , C08L23/18 , C08L23/26 , C08L35/00 , C08L63/00 , H01L23/29 , H01L23/31
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing having good adhesion, excellent mold releasability and moldability and improved package staining and to provide an electronic part device having an element sealed therewith. SOLUTION: The epoxy resin molding material for sealing consists essentially of (A) an epoxy resin, (B) a curing agent, (C) an oxidation type polymer or a copolymer of at least either one of ethylene and propylene having 125-150°C dropping point and ≥5 mg KOH/g acid value, as necessary, containing (D) a compound prepared by esterifying a copolymer of a 5-30C α-olefin and maleic anhydride with a 5-25C monohydric alcohol, (E) an inorganic filler and (F) a flame retardant. The (C) preferably has 15-50 mg KOH/g acid value and 0.3-1.5 penetration. The electronic part device is equipped with the element sealed with the molding material. COPYRIGHT: (C)2004,JPO

8. 发明专利

JP2006104416A Epoxy resin molding material for sealing and electronic part device 审中-公开
标题翻译：环氧树脂模塑材料用于密封和电子部件装置
公开(公告)号：JP2006104416A
公开(公告)日：2006-04-20
申请号：JP2004296583
申请日：2004-10-08
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE HISANORI , AKIMOTO TAKAYUKI , TAMATE HIRONORI
IPC分类号： C08L63/00 , C08L23/00 , C08L101/02 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing, having excellent continuous moldability including package appearance; and to provide an electronic part device having an element sealed with the epoxy resin molding material for sealing.
SOLUTION: The epoxy resin molding material for sealing contains (A) an epoxy resin, (B) a curing agent, (C) an oxidation-type polyolefin, and (D) a substance including a compound having structures selected from two or more kinds of an α-olefin, a maleic anhydride derivative, a polyalkylene oxide derivative and a styrene derivative. The electronic part device is sealed with the molding material.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于密封的环氧树脂成型材料，具有优异的连续成形性，包括包装外观; 并且提供具有用环氧树脂模制材料密封的元件用于密封的电子部件装置。解决方案：用于密封的环氧树脂模制材料包含（A）环氧树脂，（B）固化剂，（C）氧化型聚烯烃，和（D）包含具有选自以下结构的化合物的物质或更多种α-烯烃，马来酸酐衍生物，聚环氧烷衍生物和苯乙烯衍生物。电子部件装置用模制材料密封。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2005350500A Epoxy resin molding material for sealing and electronic part apparatus 审中-公开
标题翻译：环氧树脂模塑材料用于密封和电子部件装置
公开(公告)号：JP2005350500A
公开(公告)日：2005-12-22
申请号：JP2004169809
申请日：2004-06-08
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE HISANORI , TAMATE HIRONORI
IPC分类号： C08G59/68 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing which imparts good package external appearances particularly to a thin package and prevents resin deposition on a mold, and an electronic part apparatus equipped with an element sealed with the same.
SOLUTION: The epoxy resin molding material for sealing comprises (A) an epoxy resin, (B) a curing agent, (C) a mixture obtained by preliminarily mixing an epoxy resin (C1) having an ICI (cone/plate) viscosity at 150°C of at most 0.2 Pa s, an oxidized polyolefin (C2), one or more copolymers (C3) of an α-olefin with at least one of maleic anhydride and a derivative thereof, and (D) at least one of compounds represented by general formulae (I) and (II) (wherein n is an integer of at least 0; and R
1 -R
6 are the same or different and are each one selected from among a hydrogen atom, a hydroxy group, a methoxy group, an ethoxy group and 1-6C alkyl groups).
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种密封用环氧树脂成型材料，特别是薄的封装，特别是薄的封装，并且防止树脂在模具上的沉积，以及配备有被密封的元件的电子部件装置。解决方案：用于密封的环氧树脂成型材料包括（A）环氧树脂，（B）固化剂，（C）通过预先混合具有ICI（锥/板）的环氧树脂（C1）在150℃下的粘度至多为0.2Pa·s，氧化聚烯烃（C2），α-烯烃与马来酸酐及其衍生物中的至少一种的一种或多种共聚物（C3）和（D）至少一种的由通式（I）和（II）表示的化合物（其中n是至少为0的整数;且R 1 -R SB 6相同或不同，分别选自氢原子，羟基，甲氧基，乙氧基和1-6C烷基）。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2005272811A Epoxy resin molding material for encapsulation and electronic component apparatus 审中-公开
标题翻译：环氧树脂模塑材料用于封装和电子元件装置
公开(公告)号：JP2005272811A
公开(公告)日：2005-10-06
申请号：JP2004358544
申请日：2004-12-10
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE HISANORI , TAMATE HIRONORI , AKIMOTO TAKAYUKI
IPC分类号： C08L63/00 , C08L23/02 , C08L23/30 , C08L35/00 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for encapsulation which gives a good metal die mold-release characteristic and a good package appearance to a package especially of a thin electronic component, and to provide an electronic component having a device encapsulated with the same. SOLUTION: This epoxy resin molding material for encapsulation contains, as its essential components, (A) an epoxy resin, (B) a hardener and (C) a mixture obtained by mixing preparatorily an epoxy resin (C1) whose ICI viscosity at 150°C is not more than 0.2 Pa s, an oxidation polyolefin (C2) and (C3) at least one copolymer of an α-olefin and at least one of maleic anhydride and a maleic anhydride derivative. Not less than 80 vol% of the oxidation polyolefin (C2) of the component (C) is not more than 50 μm in particle size. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于封装的环氧树脂模制材料，其特别是薄电子部件的封装具有良好的金属模具脱模特性和良好的封装外观，并且提供具有器件封装相同。解决方案：用于封装的环氧树脂成型材料包含（A）环氧树脂，（B）硬化剂和（C）通过将制备的环氧树脂（C1）与ICI粘度在150℃下不超过0.2Pa·s，氧化聚烯烃（C2）和（C3）至少一种α-烯烃与马来酸酐和马来酸酐衍生物中的至少一种的共聚物。（C）成分的氧化聚烯烃（C2）的80体积％以上的粒径为50μm以下。版权所有（C）2006，JPO＆NCIPI

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