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1. 发明专利

JP2008013618A Resin composition, prepreg using the same, metal-clad laminate, metallic foil with resin, adhesive film and printed wiring board 审中-公开
标题翻译：树脂组合物，使用其的PREPREG，金属层压板，带树脂的金属箔，粘合膜和印刷线路板
公开(公告)号：JP2008013618A
公开(公告)日：2008-01-24
申请号：JP2006184329
申请日：2006-07-04
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： SUZUKI HIRONORI , KUMAKURA YOSHITOSHI , FUKAI HIROYUKI
IPC分类号： C08L101/00 , B32B15/08 , C08J5/24 , C08K5/5435 , C09J7/00 , C09J11/06 , C09J201/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a material for a substrate with a built-in capacitor, such as a prepreg, a metal-clad laminate, a metallic foil with a resin and an adhesive film, wherein variation in dielectric characteristic due to environmental variation is suppressed by reducing water absorption of a thermosetting resin, and a printed wiring board. SOLUTION: A resin composition comprises the thermosetting resin, a filler or a plurality of fillers and an epoxy-silane coupling agent, provided that at least one of the fillers has a dielectric constant of ≥10, and the epoxy-silane coupling agent is 2-(3,4-epoxycyclohexyl)ethyltrimethylsilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane or 3-glycidoxypropyltriethoxysilane. The prepreg, the metal-clad laminate, the metallic foil with the resin, the adhesive film and the printed wiring board using the same are also provided. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有内置电容器的基板材料，例如预浸料，覆金属层压板，具有树脂的金属箔和粘合剂膜，其中介电特性的变化由于通过减少热固性树脂的吸水性和印刷线路板来抑制环境变化。解决方案：树脂组合物包含热固性树脂，填料或多种填料和环氧硅烷偶联剂，条件是至少一种填料的介电常数≥10，环氧硅烷偶联剂 3-环氧丙氧基丙基三甲氧基硅烷，3-缩水甘油氧基丙基甲基二乙氧基硅烷，3-缩水甘油氧基丙基三乙氧基硅烷等。还提供了预浸料，覆金属层压板，具有树脂的金属箔，粘合膜和使用其的印刷布线板。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2006270020A Wiring board and method for manufacturing same 有权
标题翻译：接线板及其制造方法
公开(公告)号：JP2006270020A
公开(公告)日：2006-10-05
申请号：JP2005181847
申请日：2005-06-22
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKANEZAWA SHIN , MORITA KOJI , WATANABE TAKAKO , KUMAKURA YOSHITOSHI , ASAKAWA YUSUKE
IPC分类号： H05K3/26
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board which exhibits a high adhesive strength with a wiring conductor, even if a surface of an insulating layer is almost smooth, and provide the wiring board.
SOLUTION: The method for manufacturing the wiring board includes a step of forming an insulating layer composed of an insulating resin; a step of treating the insulating layer surface with an aqueous solution of pH 11 or more, a step of treating the insulating layer surface with an aqueous solution in which a compound is solved containing at least one carboxylic acid in structure; a step of desmear treatment; and a wiring forming step of forming a wiring layer on the insulating layer surface by plating.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：即使绝缘层的表面几乎平滑，提供一种与布线导体具有高粘合强度的布线板的制造方法，并且提供布线板。解决方案：制造布线板的方法包括形成由绝缘树脂构成的绝缘层的步骤; 用pH11以上的水溶液处理绝缘层表面的步骤，用结构上含有至少一种羧酸的化合物溶解的水溶液处理绝缘层表面的步骤; 亵渎治疗的一步; 以及通过电镀在绝缘层表面上形成布线层的布线形成步骤。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JPS6185453A Production of flame-retardant 失效
标题翻译：阻燃剂的生产
公开(公告)号：JPS6185453A
公开(公告)日：1986-05-01
申请号：JP20653884
申请日：1984-10-02
申请人： Hitachi Chem Co Ltd
发明人： NANAUMI KEN , YOSHIMURA YUKIO , KUMAKURA YOSHITOSHI
IPC分类号： C09K21/12 , C07F9/14 , C08K5/00 , C08K5/52 , C08L7/00 , C08L21/00 , C08L23/00 , C08L51/00 , C08L51/02 , C08L67/00 , C08L101/00
摘要： PURPOSE: To prepare a novel flame-retardant having improved heat resistance, containing phosphorus and bromine in a molecule, by reacting a phosphoric ester with a halogen-containing aromatic alcohol.
CONSTITUTION: (A) A phosphoric ester shown by the formula I (R
1 WR
3 are alkyl, or aryl such as triphenyl phosphate containing preferably an aromatic group and (B) a halogen-containing aromatic alcohol, preferably 2,4,6- tribromophenyl-β-hydroxyethyl ether shown by the formula II or formula III (R and R' are H, or alkyl; X and X' are bromine or chlorine; m+n=5; Y is group shown by the formula IV or formula V; q and n are 1W10) in a ratio of the component A/B of 1/0.1W1/2 are subjected to ester exchange reaction in the presence of 0.1W5wt% basic catalyst (base on total amounts of the components A and B) in the absence of a solvent under heating at 130W170°C, to give the aimed flame-retardant.
COPYRIGHT: (C)1986,JPO&Japio
摘要翻译：目的：通过使磷酸酯与含卤素的芳族醇反应，制备分子中含有磷和溴的耐热性提高的新型阻燃剂。（A）由式I表示的磷酸酯（R1-R3是烷基或芳基，例如优选芳基的三苯基磷酸酯和（B）含卤素的芳族醇，优选2,4,6-三溴苯基（R和R'为H或烷基; X和X'为溴或氯; m + n = 5; Y为式IV或式V所示的基团） ; q和n为1-10），组分A / B为1 / 0.1-1 / 2的比例在0.1-5wt％碱性催化剂存在下进行酯交换反应（基于组分总量 A和B）在130-170℃加热下不溶于溶剂，得到目标阻燃剂。

4. 发明专利

JP2011142364A Printed circuit board and method of manufacturing the same 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：JP2011142364A
公开(公告)日：2011-07-21
申请号：JP2011095980
申请日：2011-04-22
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： SUZUKI HIRONORI , KUMAKURA YOSHITOSHI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a printed circuit board with built-in components that facilitates manufacture, is less likely to leave solvent and air bubbles in an insulating layer, and has superior strength, and to provide a method of efficiently manufacturing the printed circuit board with built-in components.
SOLUTION: In the printed circuit board in which components are incorporated, the insulating layer constituting the printed circuit board is partly or entirely formed of an insulating material including fiber which is not spun or woven and a resin composition. The printed circuit board and a method of manufacturing it are provided.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有便于制造的内置部件的印刷电路板，不太可能在绝缘层中留下溶剂和气泡，并且具有优异的强度，并且提供有效制造的方法印刷电路板内置组件。解决方案：在其中组装部件的印刷电路板中，构成印刷电路板的绝缘层部分或全部由绝缘材料形成，该绝缘材料包括不纺丝或机织的纤维和树脂组合物。提供印刷电路板及其制造方法。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2007207912A Metal foil, same with adhesive adjuvant, metal foil clad plate using these, and printed wiring board 审中-公开
标题翻译：金属箔，带有粘合剂的金属箔，使用这些金属箔片板和印刷线路板
公开(公告)号：JP2007207912A
公开(公告)日：2007-08-16
申请号：JP2006023233
申请日：2006-01-31
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： ONOZEKI HITOSHI , TANABE TAKAHIRO , KUMAKURA YOSHITOSHI , OGAWA NOBUYUKI
IPC分类号： H05K3/38 , B32B15/08
摘要： PROBLEM TO BE SOLVED: To provide a wiring board which solves inconvenient points in the known methods and holds a high voltage resistance characteristic, and to provide the wiring board having a high adhesion to an insulating layer.
SOLUTION: The wiring board comprises the insulating layer and a metal foil, and the metal foil is a prepreg in which an average roughness in ten points on a surface coming into contact with the insulating layer is 2.0 μm or less and a maximum surface roughness is 5 μm or less.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够解决已知方法中的不便之处并保持高电压特性的布线板，并且提供对绝缘层具有高粘附性的布线板。解决方案：布线板包括绝缘层和金属箔，金属箔是预浸料，其中与绝缘层接触的表面中的十点的平均粗糙度为2.0μm以下，最大值为表面粗糙度为5μm以下。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2006290997A Thermosetting resin composition, adhesive sheet using the composition and adhesive sheet with copper foil 审中-公开
标题翻译：热固性树脂组合物，使用组合物的胶粘剂和粘合片与铜箔
公开(公告)号：JP2006290997A
公开(公告)日：2006-10-26
申请号：JP2005112126
申请日：2005-04-08
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TANABE TAKAHIRO , OGAWA NOBUYUKI , ONOZEKI HITOSHI , KUMAKURA YOSHITOSHI
IPC分类号： C08G59/62 , B32B15/08 , C08J5/24 , C08L29/14 , C08L63/00 , C09J7/00 , C09J129/14 , C09J161/10 , C09J163/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a wiring board which hardly causes warping and twisting, and also to provide a wiring board with high reliability.
SOLUTION: A copperclad coated laminate is produced by heating and pressing a stacked copper foil and at least one sheet of prepreg and is characterized by placing a thermosetting resin composition in between the copper foil and the prepreg. The thermosetting resin composition has the storage elasticity of at most 3 GPa at 20°C and the elongation of at least 8% at 20°C. The adhesive sheet and the sheet with a copper foil are produced by forming a sheet of the composition. The printed circuit board is produced by an ordinary production method using the above sheet. The method of the above production is also provided.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供几乎不引起翘曲和扭曲的布线板，并且还提供具有高可靠性的布线板。解决方案：通过加热和压制叠层铜箔和至少一片预浸料制备铜包覆层压板，其特征在于将热固性树脂组合物放置在铜箔和预浸料之间。热固性树脂组合物在20℃下的储存弹性至多为3GPa，在20℃下的伸长率为至少8％。粘合片和具有铜箔的片材通过形成组合物的片材来制造。印刷电路板通过使用上述片材的普通生产方法制造。还提供了上述生产的方法。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2004047680A Method for manufacturing multilayer printed circuit board 有权
公开(公告)号：JP2004047680A
公开(公告)日：2004-02-12
申请号：JP2002202318
申请日：2002-07-11
申请人： Hitachi Chem Co Ltd , Nippon Denkai Kk , 日本電解株式会社 , 日立化成工業株式会社
发明人： KAWASAKI TOSHIO , YAMADA MASAHIKO , KUMAKURA YOSHITOSHI , KOBAYASHI KAZUHITO
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To obtain a multilayer printed circuit board, having superior adhesive properties with an inner layer substrate and a base material, without conducting a complicated step, such as a carbonizing treatment or the like of a glossy surface of the inner layer substrate.
SOLUTION: The multilayer printed circuit board, in which copper wirings of the inner layer substrate are adhered to the base material by a practically sufficient adhesive force by forming a linear polymer layer of a polymeric epoxy resin polymer, a polimeric polyamideimide resin polymer or the like of 0.5 to 30 μm, or particularly preferably 1 to 10 μm, and then forming the base material and a laminate on the copper wirings of the inner layer substrate.
COPYRIGHT: (C)2004,JPO

8. 发明专利

JP2003332750A Fabrication method for build-up multilayer circuit board 审中-公开
标题翻译：制造多层电路板的制造方法
公开(公告)号：JP2003332750A
公开(公告)日：2003-11-21
申请号：JP2002131835
申请日：2002-05-07
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： FUJITA HIROAKI , FUKAI HIROYUKI , KUMAKURA YOSHITOSHI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a fabrication method for a build-up multilayer circuit board excellent in its adhesion to inner circuitry by using a resin composition as an adhesion imparting layer, the resin composition that contains polyvinyl acetal which has low elasticity and high adhesion to metallic copper, without giving an oxidative blackening treatment and subsequent reduced copper treatment.
SOLUTION: The fabrication method for the multilayer circuit board is one for the circuit board that does not give an oxidative blackening treatment or reduced copper treatment to the first inner circuitry, but has an adhesion imparting layer that uses as an essential ingredient carboxylic acid denatured polyvinyl acetal resin, thermosetting resin, and a crosslinking agent of polyvinyl acetal in order to obtain high adhesion.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种通过使用树脂组合物作为粘合赋予层而具有优异的与内部电路的粘附性的积层多层电路板的制造方法，该树脂组合物含有具有低弹性的聚乙烯醇缩醛和对金属铜的高附着力，而不会发生氧化黑化处理和随后的铜处理。解决方案：多层电路板的制造方法是对于不对第一内部电路进行氧化黑化处理或减少铜处理的电路板的制造方法，但具有作为必需成分的羧酸的粘合赋予层酸改性聚乙烯醇缩醛树脂，热固性树脂和聚乙烯醇缩醛交联剂，以获得高粘合性。版权所有（C）2004，JPO

9. 发明专利

JPS6191231A Production of flame retardant 失效
标题翻译：生产阻燃剂
公开(公告)号：JPS6191231A
公开(公告)日：1986-05-09
申请号：JP21317284
申请日：1984-10-11
申请人： Hitachi Chem Co Ltd
发明人： NANAUMI KEN , YOSHIMURA YUKIO , KUMAKURA YOSHITOSHI
IPC分类号： C09K21/12 , C07F9/14 , C08K5/00 , C08K5/52 , C08L7/00 , C08L21/00 , C08L51/00 , C08L51/02
摘要： PURPOSE: To obtain a heat-resistant flame retardant excellent in an effect of imparting flame retardancy to, e.g., an oxygen-containing resin, by reacting a phosphate with a halogenated aromatic glycol and a halogenated aromatic alcohol.
CONSTITUTION: A phosphate such as tricresyl phosphate or triphenyl phosphate is reacted with a halogenated aromatic glycol having two alcoholic hydroxyl groups in the molecule [e.g., 2,2-bis(3,5-dibromo-4-β-hydroxyethoxyphenyl) propane] and a halogenated aromatic alcohol having one alcoholic hydroxyl group in the molecule (e.g., 2,4,6-tribromophenyl-β-hydroxyethyl ether or monochlorobenzyl alcohol). In this way, the purpose flame retardant containing phosphorus and halogen in the molecule is obtained.
COPYRIGHT: (C)1986,JPO&Japio
摘要翻译：目的：通过使磷酸酯与卤代芳香族二醇和卤代芳香醇反应，得到对例如含氧树脂赋予阻燃性的效果优异的耐热阻燃剂。构成：磷酸酯如磷酸三甲苯酯或磷酸三苯酯与分子中具有两个醇羟基的卤代芳族二醇反应（例如，2,2-双（3,5-二溴-4-β-羟基乙氧基苯基）丙烷]和在分子中具有一个醇羟基的卤代芳族醇（例如2,4,6-三溴苯基-β-羟乙基醚或一氯苄醇）。以这种方式获得分子中含有磷和卤素的目的阻燃剂。

10. 发明专利

JP2007126498A Method for producing insulating resin adhesive sheet and method for producing printed wiring board using insulating resin adhesive sheet 审中-公开
标题翻译：生产绝缘树脂粘合片的方法和使用绝缘树脂粘合片生产印刷线路板的方法
公开(公告)号：JP2007126498A
公开(公告)日：2007-05-24
申请号：JP2005318253
申请日：2005-11-01
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： FUJITA HIROAKI , KUMAKURA YOSHITOSHI , FUKAI HIROYUKI , TAKANEZAWA SHIN , MORITA KOJI
IPC分类号： C09J7/02 , C09J11/04 , C09J11/06 , C09J121/00 , C09J163/00 , H01L23/32 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To obtain a substrate for an organic interposer, which is produced by mixing a resin composition containing an inorganic filler with a very small amount of a silica fiber having a low coefficient of thermal expansion and excellent dimensional stability, chemical resistance, wettability, etc., is expected to have improved connection reliability while satisfying various properties as an insulating substrate compatible with a semi-additive method.
SOLUTION: The method for producing an insulating resin adhesive sheet comprises coating a carrier film with an insulating resin composition composed of an epoxy resin, a rubber component, a phosphorus-based flame retardant, a thermosetting agent, an inorganic filler and a silica fiber as essential components and drying the film to a semicured state. The method for producing a printed wiring board comprises treating an insulating layer with an oxidizing roughening liquid and forming a circuit by an electroless plating or electrolytic plating as a method for piling a fixed number of the insulating resin adhesive sheets produced by the production method and curing the resin under heating and pressure to form a circuit on the insulating resin layer.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题为了获得通过将含有无机填料的树脂组合物与极少的热膨胀系数和极小尺寸稳定性的二氧化硅纤维混合而制备的有机中介层的基板，耐化学性，润湿性等有望提高连接可靠性，同时满足作为与半添加法相容的绝缘基板的各种性能。解决方案：绝缘树脂粘合片的制造方法包括用由环氧树脂，橡胶成分，磷系阻燃剂，热固性剂，无机填料和无机填料构成的绝缘树脂组合物涂布载体膜二氧化硅纤维作为必需组分，并将薄膜干燥至半熟化状态。制造印刷电路板的方法包括用氧化性粗糙液处理绝缘层，通过无电解电镀或电解电镀形成电路，作为用于堆叠固定数量的通过制造方法制造的绝缘树脂粘合片和固化的方法树脂在加热和加压下在绝缘树脂层上形成电路。版权所有（C）2007，JPO＆INPIT

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