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1. 发明专利

JP2007078975A Optical transceiver 有权
标题翻译：光学收发器
公开(公告)号：JP2007078975A
公开(公告)日：2007-03-29
申请号：JP2005265298
申请日：2005-09-13
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： RYU SHUGEN , KAWAUCHI HIDEKI , YAMAZAKI KINYA
IPC分类号： G02B6/42
CPC分类号： G02B6/4292
摘要： PROBLEM TO BE SOLVED: To provide an optical transceiver that improves positioning precision of an OSA.
SOLUTION: The optical transceiver 1 provided with an OSA presser 8 which engages a receptacle part 3 to hold the OSA4 equipped with the cylindrical receptacle part 3 having an optical element 2 inside and guiding an optical path from the optical element 2 and is also contacted and stored in a housing 7 having an entrance 6 formed for an optical fiber 5 connected to the optical path so as to store and fix the OSA 4 in the housing 7 is characterized in that an OSA presser restriction part 9 which is disposed on the opposite side from the entrance 6 about the OSA presser 8 to restrict the OSA presser 8 is formed on the housing 7.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种提高OSA定位精度的光收发器。解决方案：光收发器1设置有OSA按压器8，其与插座部分3接合，以将装备有具有光学元件2的圆柱形插座部分3的OSA4保持在内部并引导来自光学元件2的光路，并且是也接触并存储在具有连接到光路上的光纤5形成的入口6以便将OSA 4存储并固定在壳体7中的壳体7中，其特征在于，安置在OSA上的OSA压脚限制部9 在壳体7上形成有与OSA压脚8相对的入口6的与OSA压脚8相对的一侧。（C）2007，JPO＆INPIT

2. 发明专利

JP2006184708A Optical transceiver 有权
标题翻译：光学收发器
公开(公告)号：JP2006184708A
公开(公告)日：2006-07-13
申请号：JP2004379588
申请日：2004-12-28
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： RYU SHUGEN , YAMAZAKI KINYA , KAWAUCHI HIDEKI , INOUE TENPEI , KATAYAMA HIROKI
IPC分类号： G02B6/42 , H01L31/12
CPC分类号： G02B6/4246 , G02B6/4201 , G02B6/4256 , G02B6/4267 , G02B6/4268 , G02B6/4274 , G02B6/4277 , G02B6/428
摘要： PROBLEM TO BE SOLVED: To provide an optical transceiver that increases workability in assembling as well as reducing failures and that has superior heat radiation. SOLUTION: In the optical transceiver, there are stored in a housing 3 an optical subassembly 1 and a substrate 2 electrically connected to the other end of the optical subassembly 1, wherein the optical subassembly 1 is integrally formed with a built-in chip part 1a in which a chip for optical transmission/reception is incorporated and with a receptacle part 1b which constitutes an optical path extending from one end of the built-in chip part 1a. The optical transceiver is provided with a member 4 for fixing the optical subassembly 1, a member 4 integrally formed with a front rib 4b which has a groove 4a for fitting the receptacle part 1b in, a rear rib 4c on which the substrate 2 is fixed, and a side rib 4d which connects these front and rear ribs 4b, 4c. Consequently, the substrate 2 is to be stabilized on the fixing member 4 that holds the optical subassembly 1. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种提高组装中的可操作性以及减少故障并且具有优异的热辐射的光收发器。解决方案：在光收发器中，存储在壳体3中的光学子组件1和电连接到光学子组件1的另一端的衬底2，其中光学子组件1与内置的芯片部分1a包括用于光学发送/接收的芯片，并且具有构成从内置芯片部分1a的一端延伸的光路的插座部分1b。光收发器设置有用于固定光学子组件1的构件4，与前肋4b一体形成的构件4，前肋4b具有用于将插座部分1b装配的凹槽4a，固定有基板2的后肋4c 以及连接这些前后肋4b，4c的侧肋4d。因此，基板2在保持光学组件1的固定部件4上稳定化。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2004128255A Optical transmitter/receiver 审中-公开
公开(公告)号：JP2004128255A
公开(公告)日：2004-04-22
申请号：JP2002291012
申请日：2002-10-03
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： YAMAZAKI KINYA
IPC分类号： H01S5/042 , H01L31/02 , H04B10/40 , H04B10/50 , H04B10/60 , H04B10/67 , H04B10/69 , H04B10/04 , H04B10/06 , H04B10/14 , H04B10/26 , H04B10/28
摘要： PROBLEM TO BE SOLVED: To provide an optical transmitter/receiver such that a high-frequency signal can be sent between substrates without using a coaxial connector and the substrates can compactly and easily be connected to each other.
SOLUTION: When the substrates 52M and 52t of the optical transmitter receiver 1 equipped with the substrates 52M and 52t are connected to each other through anisotropic conductive members 23 and 23, signal electrodes 21 and 21 are formed on the substrate 52M, and ground electrodes 22 and 22 are formed around the signal electrodes 21 and 21; and the anisotropic conductive members 23 and 23 are put over those signal electrodes 21 and 21 and ground electrodes 22 and 22, and the other substrate 52t is pressed against and connected to the anisotropic conductive members 23 and 23 from above.
COPYRIGHT: (C)2004,JPO

4. 发明专利

JP2007180371A Substrate and electronic module 审中-公开
标题翻译：基板和电子模块
公开(公告)号：JP2007180371A
公开(公告)日：2007-07-12
申请号：JP2005378813
申请日：2005-12-28
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： MIZOBUCHI KENJI , FUKASAKU IZUMI , YAMAZAKI KINYA
IPC分类号： H05K1/02 , H01P3/08
摘要： PROBLEM TO BE SOLVED: To provide a substrate and an electronic module which suppress the stress and the tension by bending to be small. SOLUTION: In a substrate 1a, 1b in which conductive layers 3, 4 are superposed on one side or on both sides of a sheet-like flexible substrate 2a, 2b, the flexible substrate 2a, 2b includes gas layers 5a, 5b therein. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供通过弯曲抑制应力和张力的基板和电子模块。解决方案：在片状柔性基板2a，2b的一侧或两侧叠置有导电层3,4的基板1a，1b中，柔性基板2a，2b包括气体层5a，5b 在其中。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2004259977A Electronic circuit module 有权
公开(公告)号：JP2004259977A
公开(公告)日：2004-09-16
申请号：JP2003049550
申请日：2003-02-26
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： YAMAZAKI KINYA
IPC分类号： H01L23/34
摘要： PROBLEM TO BE SOLVED: To provide an electronic circuit module without causing unnecessary stress and capable of securely radiating heat.
SOLUTION: The electronic circuit module includes a metal hermetically sealed housing 4 for storing a board 3 on which an integrated circuit 2 is packaged, and a thermal conductive member 6 inserted in a gap 5 formed between the integrated circuit 2 and the housing 4. The thermal conductive member 6 is deformed to absorb the stress by forming convexities 7, 13 on either one or the both of the place of an inner wall of the housing 4 opposed to the integrated circuit 2 or the integrated circuit 2, or by forming convexities on the thermal conductive member 6.
COPYRIGHT: (C)2004,JPO&NCIPI

6. 发明专利

JP2011228437A Electrolytic plating formation method 审中-公开
标题翻译：电镀技术
公开(公告)号：JP2011228437A
公开(公告)日：2011-11-10
申请号：JP2010096151
申请日：2010-04-19
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： YASUDA HIRONORI , YAMAZAKI KINYA , NONEN HIDEKI , HIRANO MITSUKI
IPC分类号： H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide an electrolytic plating formation method in which a resist and electrically-conductive ink can be exfoliated in one step by using electrically-conductive ink having low adhesiveness to a print board in place of electrically conductive paste.SOLUTION: In an electrolytic plating formation method of forming an electrolytic plating layer 7 on the surface of an island pattern 4 on a print board 1 having a wiring pattern 3 and the island pattern 4 which is formed electrically independently of the wiring pattern 3, the wiring pattern 3 and the island pattern 4 are electrically connected to each other by electrically-conductive ink 5, a resist 6 is formed on the electrically-conductive ink 5, electrolytic plating is conducted, and then the resist 6 is removed together with the electrically-conductive ink 5.
摘要翻译：要解决的问题：提供一种电解电镀形成方法，其中通过使用与印刷板相比具有低粘合性的导电油墨代替导电浆料，可以在一个步骤中剥离抗蚀剂和导电油墨。解决方案：在具有布线图案3的印刷电路板1上的岛状图案4的表面上形成电解镀层7的电解电镀形成方法和形成为电连接于布线图案的岛状图案4 如图3所示，布线图案3和岛状图案4通过导电油墨5彼此电连接，在导电油墨5上形成抗蚀剂6，进行电解电镀，然后将抗蚀剂6一起去除导电油墨5.版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2006171398A Optical transmission module 审中-公开
标题翻译：光传输模块
公开(公告)号：JP2006171398A
公开(公告)日：2006-06-29
申请号：JP2004364201
申请日：2004-12-16
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： RYU SHUGEN , YAMAZAKI KINYA , KAWAUCHI HIDEKI , INOUE TENPEI , KATAYAMA HIROKI
IPC分类号： G02B6/42 , H01S5/022
CPC分类号： H05K1/147 , G02B6/4204 , G02B6/4292 , H04B10/501 , H05K1/141 , H05K3/3405 , H05K3/3421 , H05K3/4691 , H05K2201/09063 , H05K2201/0999 , H05K2201/10121 , H05K2201/10446 , H05K2201/10598
摘要： PROBLEM TO BE SOLVED: To provide an optical transmission module where heat exhausting efficiency is satisfactory and faults due to thermal expansion are reduced. SOLUTION: In the optical transmission module, the face S2 of an optical module 2 is brought into contact with the face S6 of a case 6, and also the optical module 2 is fixed to the case 6 at the contact face; a receptacle part 3 and a substrate 5 are set unfixed to the case 6; the position of the receptacle part 3 is regulated having the degree of freedom at least in a direction rectangular to an optical axis CO; and the position of the substrate 5 is regulated having degrees of freedom at least in the direction of the optical axis. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种光散发模块，其中排热效率令人满意，并且由于热膨胀而导致的故障降低。解决方案：在光传输模块中，光学模块2的表面S2与壳体6的面S6接触，并且光学模块2在接触面处固定到壳体6; 插座部3和基板5不固定在壳体6上; 容纳部3的位置被调整为至少在与光轴CO成矩形的方向上具有自由度; 并且基板5的位置至少在光轴的方向上被调节为具有自由度。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2006100511A Mounting structure for electronic component and optical transceiver employing it 有权
标题翻译：电子元件的安装结构和使用其的光学收发器
公开(公告)号：JP2006100511A
公开(公告)日：2006-04-13
申请号：JP2004283755
申请日：2004-09-29
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： KAWAUCHI HIDEKI , ISHIGAMI YOSHIAKI , YAMAZAKI KINYA , RYU SHUGEN , INOUE TENPEI , KATAYAMA HIROKI
IPC分类号： H05K1/18 , H05K1/02 , H05K3/46
CPC分类号： H05K1/182 , H05K1/117 , H05K1/189 , H05K3/4691 , H05K2201/09845 , H05K2201/10121 , H05K2201/10446
摘要： PROBLEM TO BE SOLVED: To provide a mounting structure for electronic component high in the reliability of a lead and a substrate by suppressing the deterioration of high-speed signal to the minimum limit. SOLUTION: In the mounting structure 1 for the electronic component consisting of the electronic component 133 mounted on a circuit substrate 2, a level difference section 3 is formed on the end of the circuit substrate 2 and the level difference section 3 is pinched by the reeds 136 of the electronic component 133 to fix the reeds 136 to the level difference section 3. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过将高速信号的劣化抑制到最小限度，为引线和基板的可靠性提供高电子部件的安装结构。解决方案：在由安装在电路基板2上的电子部件133构成的电子部件的安装结构体1中，在电路基板2的端部形成有电平差部3，并且电平差部3被夹持通过电子部件133的簧片136将簧片136固定到液位差部分3。版权所有：（C）2006，JPO＆NCIPI

9. 发明专利

JP2013130606A Optical module 有权
标题翻译：光学模块
公开(公告)号：JP2013130606A
公开(公告)日：2013-07-04
申请号：JP2011278123
申请日：2011-12-20
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： ISHIGAMI YOSHIAKI , YAMAZAKI KINYA , SUNAGA YOSHINORI
IPC分类号： G02B6/42
CPC分类号： G02B6/4268 , G02B6/4214 , G02B6/4219 , G02B6/423 , G02B6/4236 , G02B6/4269 , G02B6/428 , G02B6/4292 , G02B6/4295
摘要： PROBLEM TO BE SOLVED: To provide an optical module capable of suppressing a rise in temperature of semiconductor circuit elements electrically connected to photoelectric conversion elements.SOLUTION: An optical module 1 includes: a circuit board 2; LD elements 31 and PD elements 32 mounted on the circuit board 2; an optical connector 5 for optically coupling the LD elements 31 and the PD elements 32 to optical fibers 81 and 82; a driver IC 41 and a preamplifier IC 42 which are mounted on the circuit board 2 and electrically connected to the LD elements 31 and the PD elements 32; a lever member 7 for pressing and fixing the optical connector 5 to the side of the circuit board 2; and a heat-radiating block 6 for supporting the lever member 7. The heat-radiating block 6 has a heat-absorbing surface 60b thermally connected to the LD elements 31 and the PD elements 32, and heat-radiating surfaces 60a for radiating heat of the LD elements 31 and the PD elements 32 absorbed from the heat-absorbing surface 60b.
摘要翻译：要解决的问题：提供能够抑制与光电转换元件电连接的半导体电路元件的温度上升的光学模块。解决方案：光学模块1包括：电路板2; 安装在电路板2上的LD元件31和PD元件32; 用于将LD元件31和PD元件32光耦合到光纤81和82的光连接器5; 驱动器IC41和前置放大器IC42，其安装在电路板2上并电连接到LD元件31和PD元件32; 用于将光学连接器5按压并固定到电路板2一侧的杆构件7; 以及用于支撑杆构件7的散热块6.散热块6具有热连接到LD元件31和PD元件32的热吸收表面60b，以及用于辐射热的散热表面60a LD元件31和PD元件32从吸热表面60b吸收。

10. 发明专利

JP2009260126A Optical communication device 审中-公开
标题翻译：光通信设备
公开(公告)号：JP2009260126A
公开(公告)日：2009-11-05
申请号：JP2008108963
申请日：2008-04-18
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： YAMAZAKI KINYA , MIZOBUCHI KENJI
IPC分类号： H01S5/022 , H01L31/02 , H01L33/00
摘要： PROBLEM TO BE SOLVED: To provide an optical communication device which prevents a mismatching of an impedance by providing a spacer.
SOLUTION: In the optical communication device 1 in which a spacer 4 for adjusting a height of an optical element assembly (OSA) 2 is inserted into between a board 3 soldered to a pin of the OSA 2 and the OSA 2, the spacer 4 is provided with: a through-hole for an outside conductor 6 disposed at a plurality of portions surrounding a signal pin 5 of the OSA 2; a through-hole for a GND 8 soldered to a GND pin 7 of the OSA 2; and a GND wiring 9 for continuity between the through-hole for the GND 8 and the through-hole for the outside conductor 6.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供通过提供间隔物来防止阻抗失配的光通信装置。解决方案：在用于调整光学元件组件（OSA）2的高度的间隔件4插入到焊接到OSA 2的引脚的板3和OSA 2之间的光通信装置1中，间隔件4设置有：设置在围绕OSA 2的信号针5的多个部分的外部导体6的通孔; 用于焊接到OSA 2的GND引脚7的GND 8的通孔; 以及用于GND 8的通孔和外部导体6的通孔之间的导通性的GND布线9.（C）2010，JPO＆INPIT

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