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    • 3. 发明专利
    • Copper alloy for lead frame
    • 铜合金钢框架
    • JPS59157247A
    • 1984-09-06
    • JP3126783
    • 1983-02-25
    • Hitachi Cable Ltd
    • MIYAKE YASUHIKOSANKI SADAHIKOTAMURA KOUICHIWATANABE KIKUOKONISHI KENJI
    • C22C9/00C22C9/04H01L23/48
    • PURPOSE: To obtain a Cu alloy for a lead frame for IC with superior workability in manufacture as well as strength, electric conductivity, heat resistance and assembling workability which are comparable to those of phosphor bronze by adding specified amounts of Zn and Zr to Cu.
      CONSTITUTION: This Cu alloy for a lead frame for IC consists of, by weight, 5.0W20.0% Zn, 0.05W0.5% Zr and the balance Cu. The alloy may further contain about 0.05W0.5% rare earth element and/or about 0.03W0.20% P. The alloy is melted by high-frequency heating in the air, and it is hot-rolled to a plate of about 7mm thickness at about 800W850°C. After cleaning the surface by pickling, the plate is repeatedly subjected to cold rolling and annealing to obtain a thin plate of about 0.25mm thickness. About 85% high draft can be attained in the cold rolling stages except the final finish rolling stage.
      COPYRIGHT: (C)1984,JPO&Japio
    • 目的:通过向Cu中添加规定量的Zn和Zr,获得制造中具有优异的制造加工性以及强度,导电性,耐热性和组装加工性的IC的Cu合金,其与磷青铜相当。 构成:用于IC的引线框架的该Cu合金以重量计包含5.0-20.0%的Zn,0.05-0.5%的Zr和余量的Cu。 该合金还可含有约0.05-0.5%的稀土元素和/或约0.03-0.20%的P。该合金通过高频加热在空气中熔化,并被热轧成约7mm的板。 厚度约800-850摄氏度 通过酸洗清洁表面后,将板反复进行冷轧和退火,得到约0.25mm的薄板。 厚度。 在最终精轧阶段除外,在冷轧阶段可达到85%以上的高压。
    • 8. 发明专利
    • Preparation of composite electrode wire for discharge machining
    • 用于放电加工的复合电极线的制备
    • JPS5941462A
    • 1984-03-07
    • JP15104182
    • 1982-08-31
    • Hitachi Cable Ltd
    • SANKI SADAHIKOOONUKI MITSUAKITAMURA KOUICHINAGAI MASAHIRONAKAMURA OSAMUSEKIDA KATSUO
    • B23H7/08C23C10/28
    • B23H7/08
    • PURPOSE:To obtain an extremely fine composite electrode wire used in discharge machining in good efficiency, by drawing an alloy matrix material prepared by forming a diffusion layer to the interface between the copper alloy of a core material and the coating zinc layer thereon into a wire in a high machining degree to prevent wire breakage. CONSTITUTION:A diffusion layer of zinc and copper with a thickness of 0.3mum is formed to the interface between a core material comprising a copper alloy such as brass or the like and a coated zinc or a zinc alloy layer. This zinc coated copper alloy matrix wire is drawn into a wire in a high machining degree of 90% or more to obtain a fine composite electrode wire with a diameter of 0.3mm. or less used in discharge machining. By this method, the danger of wire breakage is reduced and wire drawing workability and wire drawing yield are enhanced as well as production cost is reduced.
    • 目的:为了以高效率获得用于放电加工的极细的复合电极丝,通过将芯材的铜合金与其上的镀锌层之间的界面形成扩散层制备的合金基体材料拉到线中 在高加工度下防止断线。 构成:在包含铜合金如黄铜等的芯材和涂覆的锌或锌合金层之间的界面上形成厚度为0.3μm的锌和铜的扩散层。 将该镀锌铜合金基体线材以90%以上的高加工度拉伸成线,得到直径为0.3mm的细小复合电极线。 或更少用于放电加工。 通过这种方法,减少了断线的危险,提高了拉丝加工性和拉丝率,降低了生产成本。
    • 10. 发明专利
    • Copper alloy for lead frame
    • 铜合金钢框架
    • JPS59157246A
    • 1984-09-06
    • JP3126683
    • 1983-02-25
    • Hitachi Cable Ltd
    • MIYAKE YASUHIKOSANKI SADAHIKOTAMURA KOUICHIWATANABE KIKUOKONISHI KENJI
    • C22C9/00C22C9/02H01L23/48
    • PURPOSE: To obtain a Cu alloy for a lead frame for IC with superior workability in manufacture as well as strength, electric conductivity, heat resisntance and assembling workability which are comparable to those of phosphor bronze by adding specified amounts of Sn and Zr to Cu.
      CONSTITUTION: This Cu alloy for a lead frame for IC consists of, by weight, 1.5W5.0% Sn, 0.05W0.5% Zr and the balance Cu. The alloy may further contain about 0.05W0.5% rare earth element and/or about 0.03W0.20% P. The alloy is melted by high-frequency heating in the air, and it is hot-rolled to a plate of about 7mm thickness at about 800W850°C. After cleaning the surfaces by pickling, the plate is repeatedly subjected to cold rolling and annealing to obtain a thin plate of about 0.25mm thickness. About 85% high draft can be attained in the cold rolling stages except the final finish rolling stage.
      COPYRIGHT: (C)1984,JPO&Japio
    • 目的:通过向Cu中添加规定量的Sn和Zr,获得制造中具有优异的制造加工性以及与磷青铜相当的强度,导电性,耐热性和组装加工性的IC的Cu合金。 构成:用于IC的引线框架的Cu合金由重量计为1.5-5.0%的Sn,0.05-0.5%的Zr和余量的Cu组成。 该合金还可含有约0.05-0.5%的稀土元素和/或约0.03-0.20%的P。该合金通过高频加热在空气中熔化,并被热轧成约7mm的板。 厚度约800-850摄氏度 通过酸洗清洁表面后,将板反复进行冷轧和退火,得到约0.25mm的薄板。 厚度。 在最终精轧阶段除外,在冷轧阶段可达到85%以上的高压。