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    • 1. 发明专利
    • Mechanical mask etching method
    • 机械面膜蚀刻方法
    • JPS5950180A
    • 1984-03-23
    • JP16019782
    • 1982-09-14
    • Hitachi Cable Ltd
    • MATSUYAMA YOSHIHIROWATANABE MASARUSUGIYAMA MITSUHIKOKONISHI KENJIONDA MAMORUSUZUMURA TAKASHI
    • C23F1/00H01L21/306H01L21/308
    • PURPOSE: To improve the shape and dimensional accuracy of the required part of a covering metallic layer in a titled etching method for the covering metallic layer of a composite metallic rod, by gnawing a part of a mask body of a soft elastic material into the section or side face in the required part of the covering metallic layer.
      CONSTITUTION: A composite metallic rod 3 clad with an Al covering metallic layer 2 over the entire one surface of a base metallic rod made of an Fe-Ni alloy is used, and the unnecessary part of the layer 2 is etched by using the mask 9 of a mechanical mask etching device 5. The mask 9 in this case consists of a chemical resistant soft elastic material combined with silicone rubber 9' and "Teflon" and as the etching progresses, the mask is pressed so as to gnaw into the section 12 in the required part 11 of the exposed layer 2. The erosion on the section 12 by an etching soln. is thus prevented and only the required part 11 is allowed to remain with good dimensional accuracy.
      COPYRIGHT: (C)1984,JPO&Japio
    • 目的:通过将软质弹性材料的面罩主体的一部分咬入到该部分中,以复合金属棒的覆盖金属层的标题蚀刻方法来改善覆盖金属层所需部分的形状和尺寸精度 或侧面在覆盖金属层的所需部分中。 构成:使用在由Fe-Ni合金制成的基底金属棒的整个表面上覆盖有Al覆盖金属层2的复合金属棒3,并且通过使用掩模9来蚀刻不需要的部分2 机械掩模蚀刻装置5.在这种情况下,掩模9由与硅橡胶9'和“特氟纶”组合的耐化学性软弹性材料组成,并且随着蚀刻的进行,掩模被压制成咬入 部分12在暴露层2的所需部分11中。通过蚀刻溶胶在部分12上的侵蚀。 并且仅允许所需部分11保持良好的尺寸精度。
    • 3. 发明专利
    • Manufacture of lead frame for semiconductor
    • 半导体引线框架的制造
    • JPS5948946A
    • 1984-03-21
    • JP16019982
    • 1982-09-14
    • Hitachi Cable Ltd
    • MATSUYAMA YOSHIHIROWATANABE MASARUSUGIYAMA MITSUHIKOKONISHI KENJIONDA MAMORUSUZUMURA TAKASHI
    • H01L23/50H01L21/48
    • H01L21/4828
    • PURPOSE:To obtain the lead frame of high configurational and dimensional accuracy by a method wherein a metal strip, whereon a metal of bondability and conductivity is coated, is covered by a chemical-proof soft elastic mask, and after an etching has been performed in such a manner that it is pressed and encroached to the section of the required part, the above is punched out into the prescribed pattern. CONSTITUTION:A conposite strip 3, whereon an Al thin film 2 is provided on one side of an Fe-Ni (42%) alloy strip, is positioned on a plurality of strips of stage 6 using a hole 4, a pin 7 and a guide 8. A soft elastic mask 9, whereon Si rubber 9' and Teflon 9'' are combined, is pressed on the Al film requiring part 16, and it is made encroached to the side face 19. An etching solution 14 is introduced 12 and filled in a pressure chamber 10, and the unnecessary part 15 of the Al film is removed by jetting 11 said etching solution on the part 15. As a result, the functioning part 21 having Al coating remains in an excellent configurational and dimensional accuracy without having erosion on the side face 19. Lastly, the composite metal strip is punched out in the prescribed pattern and the lead frame 20 of composite strip, whereon a high accuracy partial coating is formed, is completed.
    • 目的:通过一种方法获得具有高结构和尺寸精度的引线框架,其中涂覆有粘合性和导电性的金属的金属带被防化学软弹性掩模覆盖,并且在蚀刻已经进行 这样一种方式使其被按压并被侵入到所需部分的部分,上述被冲压成规定的图案。 构成:在Fe-Ni(42%)合金带的一侧上设置有Al薄膜2的相对带3,使用孔4,销7和 引导件8.将合成硅橡胶9'和特氟隆9“的软弹性掩模9压在Al膜需要部分16上,并且被制成侵入到侧面19.将蚀刻溶液14引入12 并填充在压力室10中,并且通过在部件15上喷射11个蚀刻溶液来除去Al膜的不必要部分15.结果,具有Al涂层的功能部件21保持在优异的结构和尺寸精度,而没有 在侧面19上有侵蚀。最后,以规定的图案冲压复合金属条,并且完成了形成高精度部分涂层的复合带的引线框架20。
    • 4. 发明专利
    • Manufacture of lead frame for semiconductor
    • 半导体引线框架的制造
    • JPS5948945A
    • 1984-03-21
    • JP16019882
    • 1982-09-14
    • Hitachi Cable Ltd
    • MATSUYAMA YOSHIHIROWATANABE MASARUSUGIYAMA MITSUHIKOKONISHI KENJIONDA MAMORUSUZUMURA TAKASHI
    • H01L23/50H01L21/48
    • H01L21/4828
    • PURPOSE:To obtain the lead frame of high configurational and dimensional accuracy by a method wherein a metal strip, on which a metal having bondability and conductivity is coated, is punched out into the prescribed pattern, and an etching is performed in such a manner that a chemical-proof soft and elastic mask is pressed and encroached to the section or the side face of the punched out metal strip. CONSTITUTION:A composite metal strip, whereon an Al thin film 2 is formed on one side of an Fe-Ni (42%) alloy strip, is punched out in prescribed pattern 5. A plurality of metal strips 3 are positioned on a stage using a hole 4, a pin 9 and a guide 10. A soft elastic mask 11, whereon Si rubber 11' and Teflon 11'' are combined, is pressed on the required part of the Al film 2, and it is made encroached into the punched side face 19. An etching solution 16 is introduced 14 and filled in a pressure chamber 17, and the unnecessary part 18 of the Al film is removed by performing an etching using the solution 16 which is jetted on the unnecessary part 18. According to this constitution, the erosion of the side face 19 can be prevented, and an Al coated functioning part can be left in the state of high configurational and dimensional accuracy, thereby enabling to obtain the composit lead frame having a highly accurate partial coating.
    • 目的:通过一种方法获得具有高结构和尺寸精度的引线框架,其中将具有粘合性和导电性的金属涂覆在其上的金属带冲压成规定图案,并且以如下方式进行蚀刻: 一个耐化学品的柔软和弹性的面罩被按压并侵入冲压出来的金属条的部分或侧面。 构成:在Fe-Ni(42%)合金条的一侧上形成Al薄膜2的复合金属带以规定的图案5冲压出来。多个金属带3被定位在台上,使用 孔4,销9和引导件10.将合成有Si橡胶11'和特氟隆11“的软弹性掩模11压在Al膜2的所需部分上,并被侵入到 冲压侧面19.引入蚀刻溶液16并填充在压力室17中,并且通过使用喷射在不需要的部分18上的溶液16进行蚀刻来去除Al膜的不需要部分18.根据 这种构造可以防止侧面19的侵蚀,并且可以将Al涂覆的功能部件置于高结构尺寸精度的状态,从而能够获得具有高精度部分涂覆的复合引线框架。
    • 5. 发明专利
    • Manufacture of aluminium coated lead frame
    • 铝涂层引线框架的制造
    • JPS5946053A
    • 1984-03-15
    • JP15642882
    • 1982-09-08
    • Hitachi Cable Ltd
    • MATSUYAMA YOSHIHIROWATANABE MASARUSUGIYAMA MITSUHIKOKONISHI KENJIONDA MAMORU
    • C23C14/14C23C14/16H01L21/48H01L23/495H01L23/50
    • H01L21/4828H01L23/49582H01L2924/0002H01L2924/00
    • PURPOSE:To produce an aluminium coated lead frame easily with high precision in dimension and positioning by a method wherein a lead frame is etched with a mask tapes adhered to an aluminium coated film. CONSTITUTION:When mask tapes 3 are continuously adhered to the specified positions on Al film 2 of Al coated metallic strip 1 and the tapes 3 are peeled off after removing the exposed Al film by etching, a striped Al film 5 located with high precision are produced. In such a constitution, the multiple striped Al films 5 respectively located with high precision may be formed easily with precision and efficiency superior to those of the Al films formed by the conventional clad process. A lead frame 7 with its inner lead 8 only coated with Al may be formed by means of stamping the metallic strip 1.
    • 目的:通过一种方法,以高精度的尺寸和定位方式生产铝涂层引线框架,其中用粘附在铝涂膜上的掩模带蚀刻引线框架。 构成:当将掩模带3连续地粘附到Al涂覆的金属带1的Al膜2上的指定位置并且通过蚀刻去除暴露的Al膜之后剥离带3时,产生高精度位置的条纹Al膜5 。 在这种结构中,可以容易地形成分别以高精度定位的多个条纹Al膜5,其精度和效率优于通过常规包层工艺形成的Al膜的精度和效率。 其内引线8仅用Al涂覆的引线框架7可以通过冲压金属条1而形成。
    • 6. 发明专利
    • Recovering method of silver
    • 银的恢复方法
    • JPS61133334A
    • 1986-06-20
    • JP25486684
    • 1984-11-30
    • Hitachi Cable Ltd
    • SUGIYAMA MITSUHIKOKOIZUMI TOYOHARU
    • C22B7/00C22B11/02
    • Y02P10/214
    • PURPOSE: To recover silver easily and efficiently, requiring only inexpensive equipment, by heating the scrap of silver-plated material at high temp. for required time and by agitating the above scrap with or after heating.
      CONSTITUTION: The scrap 1 of silver-plated material such as a silver-plated wire, a silver-plated lead frame and the like is put into a barrel 2, and the barrel 2 is heated in an electric furnace 3 for about 10min at high temps. of about 300W600°C, below the melting temp. of silver. After that, the barrel 2 is taken out of the electric furnace 3, and the scrap 1 is moved into a mixer of a fixed type or the like and is agitated. In this way, the silver can be easily peeled from the matrix to be recovered.
      COPYRIGHT: (C)1986,JPO&Japio
    • 目的:通过在高温下加热镀银材料的废料,易于高效地回收银,只需要便宜的设备。 需要时间和通过在加热之后或之后搅拌上述废料。 构成:将诸如镀银线,镀银引线框架等的镀银材料1放入筒体2中,并且在电炉3中将筒2在高温下加热约10分钟 温泉 约300-600℃,低于熔融温度。 的银。 之后,将筒体2从电炉3中取出,将废料1移动到固定型等的混合器中并搅拌。 以这种方式,银可以容易地从基质中剥离以被回收。
    • 7. 发明专利
    • Method and device for plating band-like body
    • 用于放置带状体的方法和装置
    • JPS61127895A
    • 1986-06-16
    • JP24935384
    • 1984-11-26
    • Hitachi Cable Ltd
    • YOSHIDA HIROMICHISUZUMURA TAKASHIKAYANE KOICHIYAMAGISHI RYOZOYOSHIOKA OSAMUOKABE NORIOSUGIYAMA MITSUHIKONAKANO FUMIO
    • C25D7/06C25D5/02C25D5/08
    • PURPOSE: To improve the plating speed and to reduce the plating cost, by making a plating liquid flow to flow vertically downward along a section to be plated from the top of the strip plating section of each body.
      CONSTITUTION: A plating tank 4 is composed of an upper chamber 16 which pools a plating liquid 10 and a lower chamber 17 for recovering the plating liquid 10. A plating liquid flowing-out port 14 and plural fine slits 13 are provided in the side wall 18 of the upper chamber 16 to make the electric current distribution uniform with respect to a section to be plated. A band-like body 1 is held in front of the side wall 18 of the upper chamber 16 and the plating liquid 10 is made to flow out in the direction shown by the arrow from the top of a stripe plating section 12. A skirt section is fitted to the lower end of the side wall 18 along the flowing route of the plating liquid 10 and the plating liquid 10 is circulated by means of a pump, etc. When such as a method is applied, the plating liquid does not go to the backside surface when one-side plating is performed. This method and device can also be applied to both-side plating.
      COPYRIGHT: (C)1986,JPO&Japio
    • 目的:为了提高电镀速度并降低电镀成本,通过使电镀液流从每个主体的带状电镀部的顶部沿着要镀覆的部分垂直向下流动。 构成:电镀槽4由上部室16构成,上部室16汇集镀液10和用于回收镀液10的下部室17.电镀液体流出口14和多个细缝隙13设置在侧壁 18,使得电流分布相对于被镀层的部分均匀。 带状体1被保持在上部室16的侧壁18的前方,电镀液10从条形电镀部12的顶部沿着箭头所示的方向流出。裙部 沿着电镀液10的流动路径安装在侧壁18的下端,电镀液10通过泵等循环。当应用诸如方法时,电镀液不会 当进行单面电镀时的背面。 该方法和装置也可以应用于双面电镀。