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JPS61127895A Method and device for plating band-like body 失效
标题翻译：用于放置带状体的方法和装置
公开(公告)号：JPS61127895A
公开(公告)日：1986-06-16
申请号：JP24935384
申请日：1984-11-26
申请人： Hitachi Cable Ltd
发明人： YOSHIDA HIROMICHI , SUZUMURA TAKASHI , KAYANE KOICHI , YAMAGISHI RYOZO , YOSHIOKA OSAMU , OKABE NORIO , SUGIYAMA MITSUHIKO , NAKANO FUMIO
IPC分类号： C25D7/06 , C25D5/02 , C25D5/08
摘要： PURPOSE: To improve the plating speed and to reduce the plating cost, by making a plating liquid flow to flow vertically downward along a section to be plated from the top of the strip plating section of each body.
CONSTITUTION: A plating tank 4 is composed of an upper chamber 16 which pools a plating liquid 10 and a lower chamber 17 for recovering the plating liquid 10. A plating liquid flowing-out port 14 and plural fine slits 13 are provided in the side wall 18 of the upper chamber 16 to make the electric current distribution uniform with respect to a section to be plated. A band-like body 1 is held in front of the side wall 18 of the upper chamber 16 and the plating liquid 10 is made to flow out in the direction shown by the arrow from the top of a stripe plating section 12. A skirt section is fitted to the lower end of the side wall 18 along the flowing route of the plating liquid 10 and the plating liquid 10 is circulated by means of a pump, etc. When such as a method is applied, the plating liquid does not go to the backside surface when one-side plating is performed. This method and device can also be applied to both-side plating.
COPYRIGHT: (C)1986,JPO&Japio
摘要翻译：目的：为了提高电镀速度并降低电镀成本，通过使电镀液流从每个主体的带状电镀部的顶部沿着要镀覆的部分垂直向下流动。构成：电镀槽4由上部室16构成，上部室16汇集镀液10和用于回收镀液10的下部室17.电镀液体流出口14和多个细缝隙13设置在侧壁 18，使得电流分布相对于被镀层的部分均匀。带状体1被保持在上部室16的侧壁18的前方，电镀液10从条形电镀部12的顶部沿着箭头所示的方向流出。裙部沿着电镀液10的流动路径安装在侧壁18的下端，电镀液10通过泵等循环。当应用诸如方法时，电镀液不会当进行单面电镀时的背面。该方法和装置也可以应用于双面电镀。

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