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    • 6. 发明专利
    • MANUFACTURE OF FLAT CABLE
    • JP2000164051A
    • 2000-06-16
    • JP33412898
    • 1998-11-25
    • HITACHI CABLE
    • YAMANOBE HIROSHIMASUKO NORIMICHIOKAZAKI YUICHIENDO KATSUOKOMORI TSUTOMU
    • H01B13/00H01B13/06
    • PROBLEM TO BE SOLVED: To allow integral fusion without giving an effect to a soldering property at the terminal forming portion of a conductor and without generating a void between parallel conductors by making a hot-melt adhesive sufficiently thick for the fusion between insulating films, and making it thin at adhesive end portions facing the terminal forming portions of the conductors. SOLUTION: One face of an insulating film 2 made of polyester or polyimide is coated with a hot-melt adhesive 3 to the layer thickness sufficient for fusion, and adhesive end portions facing the terminal forming portions of conductors 1 are made thin by the length of 0.5 mm to form a laminated film. The insulating films 2 are arranged to pinch the flat surfaces of the conductors 1 so that the formed layers of the hot-melt adhesives 3 are faced to each other, and the insulating films 2 are heat-pressed by a press or a roll to integrally fusing them. The adhesive layer having no void between the parallel portions of the conductors 1 is formed, and the adhesive 3 overflown by heat-pressing enters the thin portions and is not overflowed to the outside.
    • 7. 发明专利
    • TERMINAL AND CONDUCTOR CONNECTING METHOD
    • JPH11176552A
    • 1999-07-02
    • JP36206297
    • 1997-12-11
    • HITACHI CABLE
    • AOYAMA MASAYOSHIICHIKAWA TAKAONAKAHIGASHI FUMIKATAHAYAKAWA YOSHIKAZUENDO KATSUO
    • B23K20/00B23K20/02B23K20/06B23K20/10H01R43/02
    • PROBLEM TO BE SOLVED: To make a liquid phase plating member invade into a gap between a conduc tor and a terminal so as to accelerate diffusion and decrease the gap, and increase reliability in junction strength, by connecting the terminal, on which a low melting point metal similar to the plated element wire or its stranded wire is plated, to the plated element wire or its stranded wire, which is provided by plating a copper or copper alloy or their compound wire with a metal having a lower melting point than such composite material, by heating the plated element wire or its stranded wire and the terminal under a pressurized condition. SOLUTION: As a plating material, tin, silver or a metal of its lower melting point than these is used, heating due to electric conductive heating or use of a heating metal jig, light beam, or a heat source of a semiconductor laser or connection due to a load of ultrasound as its substitute is preferable. Tin is fused by heating diffusion when bonded to a copper-based material, connection strength is further increased, and corrosion proof of a welding part is further improved by electrochemical action as an anode. A method for electrically conducting and heating under pressurization at a current of 2 to 4 KA after welding a tin-plated stranded wire and a tin-plated metal terminal to the tin-plated copper element wire or its stranded wire is preferable. Water or air not enter the junction part.
    • 10. 发明专利
    • CABLE FOR ELECTRONIC DEVICE
    • JPH04104407A
    • 1992-04-06
    • JP21940290
    • 1990-08-21
    • YOSHIDA KOGYO KKHITACHI CABLE
    • YOSHIDA TOKUJIASANO KIYOMITSUMIZUKAMI TOKUGOROENDO KATSUO
    • H01B11/06
    • PURPOSE:To achieve an equivalent shield effect to that of a braided shield by forming a double structure shield layer of an aluminum/plastic laminate tape and a metal woven combined with each other. CONSTITUTION:A plurality of cable core wires 1 are assembled or twisted with each other, an aluminum/plastic laminate tape 2 and a metal woven tape 3 woven of metal are spirally wound or vertically applied with either of them on the inner side to form a double structure shield layer, and a protective sheath 5 is provided on the outer circumference. In this case, a drain wire for grounding is inserted to get in contact with either or both of the metal woven tape 3 and the aluminum/plastic laminate tape 2. Fiber yarn may be used in part of either or both of warps and wefts of the tape 3 in such a degree as to give no bad effects to a shielding for improving the flexibility further. The double shield layer of the tape 3 and the tape 2 achieves a sufficient electromagnet shielding action. The shield layer formed by spiral winding or vertical application increases the flexibility of an obtained cable by relative movement of its lap parts.