会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 9. 发明专利
    • SEMICONDUCTOR STRESS SENSOR
    • JPH02194343A
    • 1990-07-31
    • JP1458189
    • 1989-01-24
    • HONDA MOTOR CO LTD
    • TAKEBE KATSUHIKOHIYAMA SATOSHI
    • G01L1/00G01L9/00G01P15/08H01L29/84
    • PURPOSE:To increase the detection output by impressing a specific bias to the gate of an FET, impressing a constant voltage between the source and drain, and outputting a detection signal corresponding to stress according to variation of the drain current. CONSTITUTION:The potential difference between the inverted input terminal (-) and uninverted input terminal (+) of an amplifier 11 is considered to be 0. Then, when the potential difference between a power source VDD and the earth is denoted as V1, an invariably constant voltage V1 is impressed between the source and drain of a stress detection FET 4. Therefore, V3=-R(R1/Rv) V1=-ID.R1, where V3 is voltage level of the output signal OUT, Rv is the source-drain resistance value of the FET 4 and ID is the drain current. Thus, the constant voltage is impressed between the source and drain of the FET 4 and the variation of the current ID when stress is applied is detected by current-voltage conversion and outputted. Consequently, the large detection output which is affected by neither short-channel effect nor environmental temperature is obtained as a voltage signal.
    • 10. 发明专利
    • SEMICONDUCTOR SENSOR
    • JPH0267966A
    • 1990-03-07
    • JP21986288
    • 1988-09-02
    • HONDA MOTOR CO LTD
    • TAKEBE KATSUHIKODOI MIZUHOTAKEHARA HIROYASU
    • G01P15/12
    • PURPOSE:To detect acceleration, contact pressure, atmospheric pressure and mechanical vibration at high sensitivity with a simple structure, by providing a compound semiconductor FET which is formed at a part where a variable member is deformed. CONSTITUTION:In an acceleration detecting sensor, a crystal growing layer 2 comprising, e.g. GaAs, is epitaxially grown on a semiconductor substrate 1 comprising, e.g. Si. A part A of the substrate 1 is removed by etching. The compressing side in the Figure is a cantilever 3 as a variable member. A Schottky gate (MES) FET is formed at the layer 2 at the end part. Thus a stress detecting FET 4 is formed. A signal processing circuit 5 which performs amplification and the like for the detected signal is formed on the layer 2 at the supporting side of the cantilever 3. When acceleration is applied in the direction of an arrow G, the part A of the layer 2 is bent. Therefore the threshold value of the FET 4 is changed, and the acceleration is detected.