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1. 发明专利

JPH07132259A PASTE APPLYING MACHINE 失效
公开(公告)号：JPH07132259A
公开(公告)日：1995-05-23
申请号：JP28123293
申请日：1993-11-10
申请人： HITACHI TECHNO ENG
发明人： ISHIDA SHIGERU , SANKAI HARUO , YONEDA FUKUO , HACHIMAN SATOSHI , IMAIZUMI KIYOSHI , KAWASUMI YUKIHIRO
IPC分类号： B05C5/00 , H05K3/10
摘要： PURPOSE:To improve the accuracy of applying and plotting by measuring the position of the paste discharge port of a nozzle by a first means, detecting the positional deviation from before exchange of the nozzle by a second means and adjusting the position of a camera for positioning a substrate by a third means. CONSTITUTION:The tentative substrate 7 is attracted and held on an attraction base 13 and the substrate 1 existing at the visual field center of the image recognizing camera 11a is moved by a prescribed distance to move the applying point to right below the nozzle 1 when the nozzle exchange is executed. The nozzle 1 is then lowered and the paste is discharged onto the tentative substrate 7, by which a dotty paste film is formed. Next, the tentative substrate is moved backward by a prescribed distance and the dotty paste film is photographed by the image recognizing camera 11a. The image thus obtd. is sent to a controller 14 which in turn determines the centroid of the paste film by executing image processing. The positional deviation from the exchange of the nozzle 1 is then detected. Tables 18, 19 for moving the camera are moved by servo motors 15a to 15f in accordance with such positional deviation, by which the position of the image recognizing camera 11a is adjusted.

2. 发明专利

JP2001305563A SUBSTRATE STICKING DEVICE 失效
公开(公告)号：JP2001305563A
公开(公告)日：2001-10-31
申请号：JP2000123714
申请日：2000-04-19
申请人： HITACHI TECHNO ENG
发明人： HIRAI AKIRA , HACHIMAN SATOSHI , IMAIZUMI KIYOSHI , SAITO MASAYUKI , ENDO MASATOMO
IPC分类号： G02F1/1339 , G09F9/00 , H05K1/14
摘要： PROBLEM TO BE SOLVED: To provide a substrate sticking device which can perform sticking of substrates in a vacuum with high accuracy. SOLUTION: In the substrate sticking device which sticks both substrates in a vacuum with an adhesive provided in at least either of substrates by disposing to face the substrates to be stuck while holding vertical, respectively, and narrowing an interval while performing positioning, a first table which makes one of both substrates fix on an upper face or on an undersurface freely detachably, and a second table which makes the other substrate fix on the undersurface of on the upper face freely detachably are provided in a vacuum chamber so that the upper face and the undersurface which make each substrate fix may face each other. One of both tables is movably joined airtightly with the vacuum chamber through an elastic body and the one table is provided with a driving means which moves to an atmospheric side of the vacuum chamber divided by the elastic body at least in a horizontal direction to the vacuum chamber. The other table is provided with the driving means which at least narrows the interval between the substrates.

3. 发明专利

JP2001133745A METHOD OF ASSEMBLING SUBSTRATE AND DEVICE THEREFOR 失效
公开(公告)号：JP2001133745A
公开(公告)日：2001-05-18
申请号：JP31689699
申请日：1999-11-08
申请人： HITACHI TECHNO ENG
发明人： HACHIMAN SATOSHI , IMAIZUMI KIYOSHI , SAITO MASAYUKI , HIRAI AKIRA
IPC分类号： G09F9/00 , G02F1/13 , G02F1/1339
摘要： PROBLEM TO BE SOLVED: To provide a method of assembling substrates capable of bonding the substrates to each other with high accuracy in a vacuum even in the case the substrates are made greater in size and smaller in thickness. SOLUTION: The one substrate to be bonded is held on another substrate to be bonded so as to face each other and both substrates are bonded to each other in a vacuum with an adhesive disposed at either of the substrates. The one substrate is held onto the other substrate by tacky adhesive means and the substrates are bonded to each other by narrowing the spacing in the vacuum.

4. 发明专利

JP2001005405A METHOD FOR ASSEMBLING SUBSTRATE AND APPARATUS THEREFOR 失效
公开(公告)号：JP2001005405A
公开(公告)日：2001-01-12
申请号：JP17290399
申请日：1999-06-18
申请人： HITACHI TECHNO ENG
发明人： HACHIMAN SATOSHI , IMAIZUMI KIYOSHI , SAITO MASAYUKI , KAWASUMI YUKIHIRO , HIRAI AKIRA
IPC分类号： G09F9/00 , G02F1/13 , G02F1/1333 , G02F1/1339 , G02F1/1341
摘要： PROBLEM TO BE SOLVED: To match marks to each other with high accuracy and to bond substrates to each other by moving one vacuum chamber unit with respect to the other to position the substrates to each other and narrowing the opposite spacing thereof, thereby bonding the substrates to each other. SOLUTION: A substrate bonding section S2 is composed of the structure that an upper chamber unit 21 and a pressurizing plate 27 therein can respectively independently move vertically. Namely, the upper chamber unit 21 has a housing 30 containing a linear bushing and a vacuum seal and is moved in a vertical Z-axis direction by the shaft of a cylinder 22 fixed to a frame 3. When the upper chamber unit 21 descends, a flange of the upper chamber unit 21 comes into contact with an O-ring 44 arranged around a lower chamber 10 and mates therewith, thereby attaining the state that the units function as a vacuum chamber. As a result, the alignment marks disposed at the respective substrates may be aligned to each other with the high accuracy and the substrates are rapidly bonded to each other.

5. 发明专利

JP2001042341A METHOD FOR ASSEMBLING LIQUID CRYSTAL SUBSTRATE 失效
公开(公告)号：JP2001042341A
公开(公告)日：2001-02-16
申请号：JP22016099
申请日：1999-08-03
申请人： HITACHI TECHNO ENG
发明人： SAITO MASAYUKI , HACHIMAN SATOSHI , IMAIZUMI KIYOSHI , KAWASUMI YUKIHIRO , HIRAI AKIRA
IPC分类号： G02F1/13 , G02F1/1339 , G02F1/1341
摘要： PROBLEM TO BE SOLVED: To enhance sticking productivity by bringing a liquid crystal agent supplied onto one substrate into contact with the other substrate held on a rear surface of a pressing plate, moving either substrate, spreading the liquid crystal agent on the main surface of the substrate and sticking the substrates to each other. SOLUTION: A liquid crystal agent P is applied on plural locations on a lower substrate 1a and the liquid crystal agent on one location at this point of time is defined as P1. Then, after an upper substrate 1b descends and its rear surface just comes in contact with the liquid crystal agent P, the liquid crystal agent P2 is squashed and spread when the rear surface further descends. The lower substrate is moved form the original location at which the upper substrate just comes into contact with the liquid crystal agent P1 in an X axis + direction, in the X axis - direction and returned to the original location and moved in the Y axis + direction and then in the Y axis - direction in a state that the upper substrate 1b is in contact with the liquid crystal agent P1. The liquid crystal agent is spread so as to form a generally rectangular shape having a diameter having a length equal to a required movement distance as shown by P4-P6 by the movement of the lower substrate 1a in each X and Y axis direction to the upper substrate 1b. In such a way, the liquid crystal agent reaches every part inside of a patter of a sealing agent thoroughly and then sticking of the lower substrate 1a and the upper substrate 1b is executed.

6. 发明专利

JPH0942854A HEATING FURNACE 失效
公开(公告)号：JPH0942854A
公开(公告)日：1997-02-14
申请号：JP19049795
申请日：1995-07-26
申请人： HITACHI TECHNO ENG
发明人： SANKAI HARUO , IMAIZUMI KIYOSHI , YAMAMA SHINYA
IPC分类号： F27D3/12 , F27B5/06 , F27B5/18 , F27D7/06 , H01L21/68 , H01L21/683 , H05K3/12
摘要： PROBLEM TO BE SOLVED: To provide a heating furnace which can heat and harden uniformly the paste applied on the surface of a base and can produce the base of high quality and of which the area of installation is small. SOLUTION: A plurality of elevating pins 15 which pierce a hot plate 16 equipped with a heater 22 and are movable in the vertical direction are provided inside a furnace body 2 and a base 12 brought in from an opening part 9 of a partition 8 is loaded on the elevating pins 15 having risen. The elevating pins 15 lower the base 12 to the vicinity of the hot plate 16 and the base is preheated by the heated hot plate 16. Then, the elevating pins 15 lower further and the base 12 is vacuum-sucked on the hot plate 16 and heated thereby principally. Thereafter the elevating pins 15 rise and elevate the base 12 to the original position and a nitrogen gas is blown against the surface of the base 12 from a nozzle of a gas supply pipe 23 so as to facilitate cooling of the base 12. After the base 12 is cooled, it is brought out from the opening part 9.

7. 发明专利

JP2001282126A SUBSTRATE ASSEMBLING DEVICE 失效
公开(公告)号：JP2001282126A
公开(公告)日：2001-10-12
申请号：JP2000097873
申请日：2000-03-30
申请人： HITACHI TECHNO ENG
发明人： SAITO MASAYUKI , HACHIMAN SATOSHI , IMAIZUMI KIYOSHI , HIRAI AKIRA
IPC分类号： G02F1/13 , G02F1/1333 , G09F9/00
摘要： PROBLEM TO BE SOLVED: To provide a substrate assembling device which can align substrates with high accuracy within a vacuum chamber without damaging the substrates and can rapidly bond the substrates to each other. SOLUTION: A single table 8 or freely attachably and detachably fastening either one of the substrates 1A and 1B is arranged in the vacuum chamber 100 and there are arms extending in the respective directions of X and Y at the flank sections of the table from each of the actuators 9 and 10 arranged outside the vacuum chamber. The table is adapted to be moved horizontally in the respective directions of X and Y and θ via the arms by the actuation of the respective actuators and further a pressurizing plate 27 for freely attachably and detachably fastening the other of the substrates is arranged within the vacuum chamber. The substrate assembling device bonds both substrates by horizontally moving the table by means of the respective actuators to align the substrates to each other and moving the pressurizing plate toward the table.

8. 发明专利

JP2001166272A METHOD AND DEVICE FOR ASSEMBLING SUBSTRATE 失效
公开(公告)号：JP2001166272A
公开(公告)日：2001-06-22
申请号：JP35050299
申请日：1999-12-09
申请人： HITACHI TECHNO ENG
发明人： IMAIZUMI KIYOSHI , HACHIMAN SATOSHI , SAITO MASAYUKI , HIRAI AKIRA
IPC分类号： G02F1/13 , G02F1/1339 , G02F1/1341
摘要： PROBLEM TO BE SOLVED: To provide a method and a device for substrate assembling by which upper and lower substrates can be stuck together in a vacuum even when they are in the same shape. SOLUTION: The two substrates to be stuck together are set opposite to each other and stuck with adhesive provided on one of the substrates; and both substrates are stuck together by holding the substrates in a vacuum vertically and opposite to each other and dropping the upper substrate on the lower substrate by releasing the upper substrate from a held state.

9. 发明专利

JP2001005401A METHOD FOR ASSEMBLING SUBSTRATES AND DEVICE THEREFOR 失效
公开(公告)号：JP2001005401A
公开(公告)日：2001-01-12
申请号：JP17434399
申请日：1999-06-21
申请人： HITACHI TECHNO ENG
发明人： IMAIZUMI KIYOSHI , HACHIMAN SATOSHI , SAITO MASAYUKI , KAWASUMI YUKIHIRO , HIRAI AKIRA
IPC分类号： G09F9/00 , G02F1/13 , G02F1/1339
摘要： PROBLEM TO BE SOLVED: To provide a method for assembling substrates capable of bonding the substrates to each other in a vacuum with high accuracy and good productivity and a device therefor. SOLUTION: The one substrate to be bonded is held on the rear surface of a pressurizing plate 27 and another substrate to be bonded is held on a table 9 so as to face the one substrate. The spacing between the substrates is narrowed and the substrates are bonded in the vacuum by an adhesive disposed at either of the substrates. While pressing force is acted in part of the respective peripheral edges of the substrates between the substrates and the pressurizing plate 27 or the table, pressure reduction is progressed.

10. 发明专利

JP2000284295A METHOD AND APPARATUS FOR ASSEMBLING SUBSTRATE 失效
公开(公告)号：JP2000284295A
公开(公告)日：2000-10-13
申请号：JP8961299
申请日：1999-03-30
申请人： HITACHI TECHNO ENG
发明人： HACHIMAN SATOSHI , IMAIZUMI KIYOSHI , SAITO MASAYUKI , KAWASUMI YUKIHIRO , SANKAI HARUO , HIRAI AKIRA
IPC分类号： G09F9/30 , C03B23/203 , G02F1/13 , G02F1/1333 , G02F1/1339
摘要： PROBLEM TO BE SOLVED: To bond substrates which are approximately the same to each other with high accuracy in a vacuum even if the substrate size increases and the thickness thereof is reduced. SOLUTION: Electrostatic attraction force is acted on an upper substrate 1b from a pressurizing plate 27 and the upper substrate 1b is held on the pressurizing plate 27 and is bonded thereto in the vacuum. Further, the upper substrate 1b is held on the pressurizing plate 27 by suction attraction force and the electrostatic attraction force is acted on the upper substrate 1b accepted in the position of the extent slight apart from the pressurizing plate 27 dropped when the suction attraction force disappears in the process of progressing the pressure reduction, by which the upper substrate 1b is again held on the pressurizing plate 27 and the bonding in the vacuum is executed.

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