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1. 发明专利

JP2015045060A Ｃｕ系粉末の製造方法およびこれを用いたＣｕ系スパッタリングターゲット材の製造方法审中-公开
标题翻译：基于铜的粉末的制造方法和使用其的Cu基溅射靶材的制造方法
公开(公告)号：JP2015045060A
公开(公告)日：2015-03-12
申请号：JP2013176673
申请日：2013-08-28
申请人：日立金属株式会社 , Hitachi Metals Ltd
发明人： TAMADA YU , KUMAMOTO SHINGO
IPC分类号： B22F9/08 , B22F1/00 , C22B9/16 , C22B15/14 , C22C1/02 , C22C1/04 , C23C14/34 , F27B14/10
摘要：【課題】過度に高純度な溶解原料を用いることなく、例えばスパッタリングターゲット材の製造に好適な、金属不純物量が低減された高純度のCu系粉末の製造方法およびこれを用いたCu系スパッタリングターゲット材の製造方法を提供する。【解決手段】ガスアトマイズ法を用いたCu系粉末の製造方法において、Cu系粉末の溶解原料を黒鉛坩堝内で溶解してCu系溶湯を得る第一の工程と、ガスを用いて前記Cu系溶湯を噴霧してCu系粉末を得る第二の工程を有し、前記黒鉛坩堝の金属不純物量が合計で500質量ppm以下であるCu系粉末の製造方法であり、前記Cu系粉末を加圧容器に充填し、加圧焼結することによりCu系スパッタリングターゲット材を得ることができる。【選択図】なし
摘要翻译：要解决的问题：提供一种高纯度Cu基粉末的制造方法，其中金属杂质量减少而不使用过度高纯度的熔融原料，其优选用于制造溅射靶材料，例如和提供使用该制造方法的Cu系溅射靶材的制造方法。解决方案：使用气体雾化法的Cu系粉末的制造方法具有以下步骤：将Cu系粉末的原料熔化成第一工序石墨坩埚以获得Cu基熔融金属; 以及其中通过使用气体喷射Cu基熔融金属以获得其中石墨坩埚中的金属杂质的量总共为500质量ppm以下的Cu基粉末的第二工序。通过将Cu基粉末填充到加压容器中并对粉末进行加压和烧结，可以获得Cu基溅射靶材料。

2. 发明专利

JP2006003775A Display substrate 审中-公开
标题翻译：显示基板
公开(公告)号：JP2006003775A
公开(公告)日：2006-01-05
申请号：JP2004182264
申请日：2004-06-21
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： YAKABE HIDETAKA , KUMAMOTO SHINGO , AKABOSHI HARUO , OSHIMA TETSUYA , WAKAGI MASATOSHI
IPC分类号： G09F9/30 , G02F1/1333 , H01J17/16 , H01J29/86 , H01L51/50 , H05B33/02
摘要： PROBLEM TO BE SOLVED: To provide a display substrate which has low thermal expansion planarity, insulation, small thickness and light weight, flexibility and has impact resistance and wiring processability.
SOLUTION: The display substrate is made of a metallic thin plate on which a resin layer and a wiring contact layer are provided. Desirably, the surface roughness of the wiring contact layer of the display substrate is ≤Ry:1.0 μm and ≤Ra:0.1 μm. To be more desirable, the wiring contact layer is made of silicon dioxide or silicon nitride. Furthermore, the resin layer of the display substrate has glass transition temperature of ≥150°C, the coefficient of thermal expansion is ≤60×10
-6 /°C and the thickness is 2 to 500 μm. Moreover, the metallic thin plate of the display substrate is made of an iron-nickel series alloy, the coefficient of thermal expansion in 20 to 300°C temperature is ≤11×10
-6 /°C and the thickness is 20 to 500 μm.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有低热膨胀平面性，绝缘性，小厚度和重量轻，柔韧性和耐冲击性和接线加工性能的显示基板。解决方案：显示基板由设置有树脂层和布线接触层的金属薄板制成。理想的是，显示基板的布线接触层的表面粗糙度为≤Ry：1.0μm，≤Ra：0.1μm。更理想的是，布线接触层由二氧化硅或氮化硅制成。此外，显示基板的树脂层的玻璃化转变温度为≥150℃，热膨胀系数为≤60×10 -6 /℃，厚度为2〜500μm。此外，显示基板的金属薄板由铁镍系合金制成，在20〜300℃的温度下的热膨胀系数为≤11×10 -6 /℃，厚度为20〜500μm。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2004191463A Substrate for display and method for manufacturing the same 审中-公开
公开(公告)号：JP2004191463A
公开(公告)日：2004-07-08
申请号：JP2002356471
申请日：2002-12-09
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： INOUE RYOJI , KUMAMOTO SHINGO
IPC分类号： G02F1/1333 , B32B15/08 , G09F9/00 , G09F9/30 , H01L51/50 , H05B33/02 , H05B33/14
摘要： PROBLEM TO BE SOLVED: To provide a substrate to be used for a thin display having thickness reduction/weight reduction/impact resistivity/flexibility/low thermal expanding property/insulating property/heat resistivity/smoothness, and also to provide a method for manufacturing the substrate for display.
SOLUTION: This substrate for display is configured by forming a resin layer whose surface roughness Ra is 0.2μm or less, and Rz is 2μm or less, and whose glass transfer temperature is 150°C or more on the surface of a metallic thin plate whose thermal expansion coefficient ranging from 20°C to 300°C is 11×10
-6 /°C or less. It is desired that an iron/nickel system alloy thin plate is used for the metallic thin plate.
COPYRIGHT: (C)2004,JPO&NCIPI

4. 发明专利

JP2004174983A Metal-foil clad laminate, and wiring board using the same 有权
公开(公告)号：JP2004174983A
公开(公告)日：2004-06-24
申请号：JP2002345387
申请日：2002-11-28
申请人： Hitachi Ltd , Hitachi Metals Ltd , 日立金属株式会社 , 株式会社日立製作所
发明人： KUMAMOTO SHINGO , AKABOSHI HARUO
IPC分类号： H05K1/09 , B32B15/08 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a metal-foil clad laminate which can improve the transmission property of a wiring board while lowering its thermal expansion by using it as the core of the board, and also to provide the lightweight thin wiring board using the laminate. SOLUTION: This metal-foil clad laminate is produced by laminating, on at least one surface of an insulating resin, a copper-cladded alloy foil prepared by cladding a copper layer on at least one surface of an iron-nickel alloy foil having a thickness of ≤100 μm. In this case, the thickness of copper cladded on the surface of the iron-nickel alloy foil is ≥0.3 μm per single side, and the ratio of total thickness of the copper to that of the iron-nickel alloy foil is ≤0.5. Further, an average thermal expansion coefficient of the insulating resin at temperatures of 30-200°C in a plane direction is made to be 0-10 ppm/°C. COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2005197386A Method for manufacturing wiring circuit board 审中-公开
标题翻译：制造电路板的方法
公开(公告)号：JP2005197386A
公开(公告)日：2005-07-21
申请号：JP2004000842
申请日：2004-01-06
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： TAKASHIMA HIROSHI , TANAKA SHIGENORI , KUMAMOTO SHINGO , FUJIWARA YOSHIYUKI
IPC分类号： H05K3/40 , H01L23/12 , H05K3/06
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring circuit board that is superior in configuration accuracy and productivity.
SOLUTION: The method is used to manufacture a wiring circuit board that uses a laminated foil coil that is provided with a metallic layer and a bump connected with the metallic layer and embedded in a resin and has a structure wherein an another connection surface of the bump connected with the metallic layer is exposed over the surface of the resin, and a laminated foil for a wiring circuit board that the laminated foil coil and a metallic foil coil are joined and formed as one body. While a dry-type film formation metallic layer is respectively formed on a surface where the connection surface of the bump of the laminated foil coil is exposed on the surface as well as on one surface of the metallic foil, a load is applied at a draft of 10% or less by a press-fitting roll to make a laminated foil for wiring circuit board through integration, and the metallic layer and the metallic foil of the laminated foil for wiring circuit board are etched to form a wiring circuit pattern on both surfaces.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种在配置精度和生产率方面优异的布线电路板的制造方法。解决方案：该方法用于制造使用具有金属层的叠层箔线圈和与该金属层连接并嵌入树脂中的凸块的布线电路板，并且具有其中另一连接表面与该金属层连接的突起露出在树脂的表面上，叠层箔线圈和金属箔线圈的接合和形成为一体的布线电路基板用叠层箔。在层叠箔线圈的凸块的连接面在金属箔的表面以及金属箔的一个表面上露出的表面上分别形成干式成膜金属层的情况下，通过压配合辊10％以下，通过一体化形成布线电路板用层叠箔，并且对金属层和布线电路基板用层叠箔的金属箔进行蚀刻，在两面形成布线电路图案。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2005195771A Substrate for sheet display 审中-公开
标题翻译：基板显示
公开(公告)号：JP2005195771A
公开(公告)日：2005-07-21
申请号：JP2004000837
申请日：2004-01-06
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： KUMAMOTO SHINGO , YAKABE HIDETAKA
IPC分类号： G02F1/1333 , B32B15/08 , G09F9/30 , H01L51/50 , H05B33/02 , H05B33/14
摘要： PROBLEM TO BE SOLVED: To provide a substrate for a sheet display featuring thickness reduction, weight reduction, impact resistance, flexibility, low thermal expansion characteristics, insulation property, and smoothness in combination.
SOLUTION: The substrate for the sheet display formed with a resin layer on the surface of a sheet metal is preferably ≤0.15 μm in the surface roughness Ra of the sheet metal, is ≤5.0 μm in Ry, ≤0.2% in the area rate of the non-metallic inclusions existing on the surface of the sheet metal, and is ≤10 μm in the maximum length of the non-metallic inclusions. Further preferably, the coefficient of thermal expansion from 30°C up to 300°C of the sheet metal is 1 to 11×10
-6 /°C.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于片材显示的基板，其特征在于具有减薄，减轻重量，抗冲击性，柔韧性，低热膨胀特性，绝缘性能和平滑度的组合。＆lt; P＆gt;解决方案：在金属板的表面上形成有树脂层的片状显示用基板，优选在金属板的表面粗糙度Ra为≤0.15μm以下，Ry为≤5.0μm，存在于金属板表面上的非金属夹杂物的面积率，并且在非金属夹杂物的最大长度中≤10μm。进一步优选的是，片状金属的30℃至300℃的热膨胀系数为1至11×10 -6 / SP /℃。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2002110859A MANUFACTURING METHOD OF WIRING MATERIAL FOR SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD FOR SEMICONDUCTOR PACKAGE, AND WIRING MATERIAL FOR SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JP2002110859A
公开(公告)日：2002-04-12
申请号：JP2000302495
申请日：2000-10-02
申请人： HITACHI METALS LTD
发明人： KUMAMOTO SHINGO , OKIKAWA SUSUMU
IPC分类号： H01L23/14 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring material for semiconductor packages that can be conveyed in the same way as a conventional lead frame while the method can improve productivity even if a thin wiring material that cannot be easily handled by thinning a resin layer is used in the manufacture of a thin-type semiconductor package, the manufacturing method of the semiconductor package, and the wiring material for semiconductor packages. SOLUTION: This manufacturing method of the wiring material for semiconductor packages includes two steps. In one step, while or after a resin plate used as an insulating layer, a metal plate for wiring used as a wiring layer, and a carrier metal plate used as a carrier layer are laminated so that the resin plate is held between the metal plate for wiring and carrier metal plate with the resin plate as a middle layer, thermocompression bonding is made at temperature for softening the resin plate or more, the metal plate for wiring is bonded to the resin and carrier metal plates, a lamination material comprising the wiring, resin, and carrier layers is formed, and wiring is formed on the metal plate for wiring of the lamination material by etching. In the other step, a lattice-like opening is formed on the carrier metal plate by the etching.

8. 发明专利

JP2000174175A THIN HEAT SPREADER 失效
公开(公告)号：JP2000174175A
公开(公告)日：2000-06-23
申请号：JP34631698
申请日：1998-12-07
申请人： HITACHI METALS LTD
发明人： OKIKAWA SUSUMU , KUMAMOTO SHINGO
IPC分类号： H01L23/12 , H01L23/32
摘要： PROBLEM TO BE SOLVED: To provide a thin heat spreader having a thermal expansion characteristics similar to the thermal expansion coefficient of a silicon chip and an excellent heat-dissipation characteristics for improved connection reliability. SOLUTION: A high heat-conductive layer wherein, with a low heat-expansion layer 1 of Fe-Ni alloy with thickness 100 μm or less as an intermediate layer, a high heat-conductive layer 2 of Cu metal with thickness 50 μm or less is laminated on each surface and backside of the low heat-expansion layer so that the low heat-expansion layer is sandwiched, is a continuous heat spreader through a plurality of through holes 3 formed at the low heat-expansion layer, with an average heat-expansion coefficient between an ambient temperature and 300 deg.C after lamination being 10 ppm/ deg.C or less and thickness being 120 μm or less.

9. 发明专利

JP2003019750A Method for manufacturing laminated metal strip with resin and manufacturing apparatus therefor 审中-公开
标题翻译：用树脂制造层压金属条的方法及其制造方法
公开(公告)号：JP2003019750A
公开(公告)日：2003-01-21
申请号：JP2001209190
申请日：2001-07-10
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： KUMAMOTO SHINGO , YOSHIMURA YUKIRO
IPC分类号： B29C65/02 , B29K101/10 , B29L9/00
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminated metal strip with a resin capable of continuously performing pressurization and thermosetting treatment and the winding feed of the laminated metal strip with the resin and drastically enhancing the adhesion reliability of an adhesion interface, and a manufacturing apparatus suitable therefor.
SOLUTION: In the method for manufacturing the laminated metal strip with the resin by bonding a second metal strip to the surface on the resin layer side of a metal strip with the resin having a first metal layer and a thermosetting resin layer, the metal strip with the resin and the second metal strip are superposed one upon another to be mated with the outer periphery of a heating curved surface and bonded under pressure while continuously heated on the outer periphery of a heating curved surface.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种具有能够连续进行加压和热固化处理的树脂的层压金属带的制造方法以及层压金属带与树脂的卷绕进料，并且显着提高粘合界面的粘附可靠性，以及适合的制造装置。解决方案：在具有树脂的层压金属带的制造方法中，通过将具有第一金属层和热固性树脂层的树脂与第二金属带接合到金属带的树脂层侧的表面上，树脂和第二金属带彼此重合以与加热曲面的外周配合，并且在加热曲面的外周边连续加热的同时被接合。

10. 发明专利

JP2002332544A METAL SHEET FOR METAL CORE BASE MATERIAL AND ITS MANUFACTURING METHOD, METAL CORE BASE MATERIAL USING THE SAME, AND BUILD-UP PRINTED WIRING BOARD 失效
公开(公告)号：JP2002332544A
公开(公告)日：2002-11-22
申请号：JP2001137058
申请日：2001-05-08
申请人： HITACHI METALS LTD , HITACHI LTD
发明人： DATE MASAYOSHI , KUMAMOTO SHINGO , SATO KOJI , USHIFUSA NOBUYUKI , HASEBE TAKEHIKO
IPC分类号： C21D9/46 , C22C38/00 , C22C38/08 , C22C38/18 , C22C38/40 , H05K1/05 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a metal sheet for a metal core base material and its manufacturing method by which the problem of a phenomenon of dimensional variation occurring at the application of piercing treatment to a cold rolled metal sheet and a phenomenon of dimensional variation occurring at the manufacture of a metal core base material using the metal sheet as a core can be solved, to provide a metal core base material using the metal sheet, and also to provide a build-up printed wiring board using the metal core base material. SOLUTION: In the metal sheet for the metal core base material, the dimensional variation ratio of the metal sheet when piercing treatment of 15-60% hole area ratio is applied to the cold rolled metal sheet is made to

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