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1. 发明专利

JPS57154852A WIRE BONDER 失效
公开(公告)号：JPS57154852A
公开(公告)日：1982-09-24
申请号：JP3931281
申请日：1981-03-20
申请人： HITACHI LTD , NITSUKAN DENSHI KK , HITACHI MICROCUMPUTER ENG
发明人： USAMI TAMOTSU , OOTSUKA KANJI , MIWA TAKASHI , ARAKI TAKASHI , TSUKITA MUTSUO , TSUBOI TOSHIHIRO , SUGIMOTO SHIYUUICHI
IPC分类号： H01L21/607 , B23K1/00 , H01L21/48 , H01L21/60
摘要： PURPOSE:To cut a wire at the required point without fail by a method wherein the radius of curvature of the tool which comes in contact with the wire is increased, and the wire is deformed repeatedly. CONSTITUTION:A bonding wire 15 is inserted at the point of the tool 13 which will be supersonic-oscillated, and the wire 15 is pressure welded on the bonding surface 5. The rear end section 16 of the tool 13 facing to a wire inserting hole 14 is formed in such a manner that no stress concentration will be generated at the contact part of the wire 15 by increasing the radius of curvature. When the wire 15 is cut, a clamper 18 is reciprocatory moved repeatedly. The wire 15 is swingingly moved with the rear end 15a of the tool 13 as a fulcrum, the rear end section 15a is fatigued, and the wire is cut by the tensile section of the accompanying clamper 18.

2. 发明专利

JPS57138146A ATTACHING METHOD FOR PELLET 失效
公开(公告)号：JPS57138146A
公开(公告)日：1982-08-26
申请号：JP2311681
申请日：1981-02-20
申请人： HITACHI LTD , NITSUKAN DENSHI KK , HITACHI MICROCUMPUTER ENG
发明人： USAMI TAMOTSU , OOTSUKA KANJI , MIWA TAKASHI , ARAKI TAKASHI , TSUKITA MUTSUO , TSUBOI TOSHIHIRO , SUGIMOTO SHIYUUICHI
IPC分类号： H01L21/52 , H01L21/58
摘要： PURPOSE:To attach the pellet positively at low cost without generating a defective crack by positioning an Al layer between the pellet and the pellet mounting surface of a package, etc. and fast sticking the pellet through the application of ultrasonic vibration. CONSTITUTION:The back of the pellet such as a semiconductor pellet 10 is coated previously with the Al layer 12, Al foil 16 is positioned between the layer 12 and the mounting surface of the package such as a ceramic package 14, and the pellet 10 is fast stuck through the application of vibration by an ultrasonic horn 18. An Au layer 20 may be formed previously to the mounting surface of the package 14, or an Au layer may be shaped to the back of the pellet or a metallized layer in an Al layer. Accordingly, since the pellet can be attached without conducting scrubbing action, the generation of cracks and breaking in the pellet can be prevented, and the cost of a material can be reduced.

3. 发明专利

JPS57138144A ATTACHING METHOD FOR PELLET 失效
公开(公告)号：JPS57138144A
公开(公告)日：1982-08-26
申请号：JP2311381
申请日：1981-02-20
申请人： HITACHI LTD , HITACHI MICROCUMPUTER ENG , NITSUKAN DENSHI KK
发明人： USAMI TAMOTSU , OOTSUKA KANJI , MIWA TAKASHI , TSUBOI TOSHIHIRO , SUGIMOTO SHIYUUICHI , ARAKI TAKASHI , TSUKITA MUTSUO
IPC分类号： H01L21/52 , H01L21/58
摘要： PURPOSE:To attach a pellet efficiently and positively without generating a faulty crack, etc. by placing the pellet onto the mounting surface of a package, etc. and passing the pellet in an oven, temperature thereof is set to the fusible temperature or higher of a pellet mounting material. CONSTITUTION:An endless belt 14 is circulated and moved into the ambient oven 16, an end section thereof has an opening functioning as an entrance and exit, while oven temperature is set to a temperature such as Au/Si eutectic temperature (380 deg.C) or higher. An inert gas, such as N2 or N2/H2 or the like is heated at said eutectic temperature or higher and introduced into the oven 16, and the inside of the oven is held to an inert atmosphere. The pellet 10 is placed onto the mounting surface of the package 12 to which Au is evaporated under this condition (the pellet is attached temporarily by a collet, etc. as necessary), and successively fed into the oven from one end of the conveyor 14, and the package on which the pellet is attached is taken out of the other end during the passage. Accordingly, defectives, such as the crack of the pellet, the oxidation of an electrode, etc. are not generated, and the pellet can be attached at high efficiency.

4. 发明专利

JPS57137836A LEAKAGE DETECTOR 失效
公开(公告)号：JPS57137836A
公开(公告)日：1982-08-25
申请号：JP2311581
申请日：1981-02-20
申请人： HITACHI LTD , HITACHI MICROCUMPUTER ENG , NITSUKAN DENSHI KK
发明人： USAMI TAMOTSU , OOTSUKA KANJI , MIWA TAKASHI , TSUBOI TOSHIHIRO , SUGIMOTO SHIYUUICHI , ARAKI TAKASHI , TSUKITA MUTSUO
IPC分类号： G01M3/04 , G01M3/06 , G01M3/10 , G01M3/24 , H01L21/66
摘要： PURPOSE:To perform leakage detection of good accuracy automatically by detecting the acoustic emission generated by the fluid leaking from products to be examined. CONSTITUTION:A semiconductor product 10 is kept sunk in the liquid 14 in a detecting vessel 12. The liquid 14 is high temp. liquid to accelerate the generation of foam from the product 10. A heater, and a temp. controller are built in a control part 12A in the lower part. A sensor 18 for detecting the acoustic emission generated by the foam 16 produced in the liquid 14 from the cavities in the product 10 is fitted on the outside wall surface in the upper part of the vessel 12. When the foam 16 leaks from the cavities in the product 10, the acoustic emission generated by the foam 16 is surely detected by the sensor 18, and is measured and displayed by a measuring device 20.

5. 发明专利

JPS57137835A LEAKAGE DETECTOR 失效
公开(公告)号：JPS57137835A
公开(公告)日：1982-08-25
申请号：JP2311281
申请日：1981-02-20
申请人： HITACHI LTD , HITACHI MICROCUMPUTER ENG , NITSUKAN DENSHI KK
发明人： USAMI TAMOTSU , OOTSUKA KANJI , TSUBOI TOSHIHIRO , SUGIMOTO SHIYUUICHI , ARAKI TAKASHI , TSUKITA MUTSUO
IPC分类号： G01M3/04 , G01M3/20 , G01M3/22 , H01L21/66
摘要： PURPOSE:To perform leakage tests of products to be teated automatically and efficiently by containing the products to be tested which are conveyed by a carrier into a sealed test space and subjecting the same to the leakage test. CONSTITUTION:Plural pieces of semiconductor products 10 which are subjected to the force feeding operation of gaseous helium are pitch-fed by each pitch in an arrow A direction by means of pitch feed holes 30 while they are kept held in the holding holes 26 of a carrier 14. These products are conveyed successively by each piece into a test vessel 12. The products 10 conveyed into the vessel 12 are contained in the sealed test space formed of the sealing rubber ring 18 of the vessel 12 and the sealing rubber ring 20 of a sealing cover 16. If a leakage defect exists in any product 10, gaseous helium leaks into the sealed test space and therefore this leaking gas is conducted through a conduit 22 into the body part of the tester, whereby the presence or absence of the leakage is detected. Since no direct force is exerted upon the products 10, the generation of the deformation defects of the products 10 is obviated.

6. 发明专利

JPS57138145A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS57138145A
公开(公告)日：1982-08-26
申请号：JP2311481
申请日：1981-02-20
申请人： HITACHI LTD , NITSUKAN DENSHI KK , HITACHI MICROCUMPUTER ENG
发明人： USAMI TAMOTSU , OOTSUKA KANJI , ARAKI TAKASHI , TSUKITA MUTSUO , TSUBOI TOSHIHIRO , SUGIMOTO SHIYUUICHI , MIWA TAKASHI
IPC分类号： H01L21/52 , H01L21/58
摘要： PURPOSE:To improve the adhesive strength of a pellet, and to reduce cost by using polyimide resin, into which the metallic powder of Al, etc. is mixed, as paste fast sticking the pellet onto a base. CONSTITUTION:A pellet sticking section 3 is metallized and formed to the inner bottom of the base 1 of a package consisting of a substance such as ceramics, and the Si pellet 2 to which an element is shaped is fast stuck by using the paste 5. A connecting process with a lead by wires 7 and an airtight sealing process through the glass welding of a cap are conducted after the pellet is fast stuck. A material obtained by mixing the Al powder to the polyimide resin, heatproof temperature thereof is higher than glass sealing temperature, is used as the paste 1, and an Al layer is preferably formed previously onto the back of the pellet 2. Accordingly, the device resists the high temperature of a post process and the adhesive strength can be kept while cost can be reduced because the precious metals are not employed.

7. 发明专利

JPS56129354A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS56129354A
公开(公告)日：1981-10-09
申请号：JP3159080
申请日：1980-03-14
申请人： HITACHI LTD , NITSUKAN DENSHI KK , HITACHI OME ELECTRONIC CO , HITACHI IRUMA DENSHI KK
发明人： OOTSUKA KANJI , SEKIHASHI MASAO , ARAKI TAKASHI , UESAWA MASAHIRO , TSUKITA MUTSUO , IIDA SATOSHI
IPC分类号： H01L23/50 , H01L21/48 , H01L23/52
摘要： PURPOSE:To obtain a minute electrode which corresponds to its minute pitch arrangement and width by a method wherein the electrode inside the package is made to consist of an external lead formed through the printing method and an internal lead formed through evaporation and so on. CONSTITUTION:The external half of a ceramic base 1 is metalized in the same way as has been added to an internal electrode 5 and made into an external lead 6. The metalized external end 9 of the external lead 6 is made into a metalized connection 8 for an externally lead-out pin. These metalized portions 8, 9 are covered with films 10, 11 of Ni metal series. The external lead-out pin 7 is soldered to the metalized portion 8 in such a way that it stands in an upright position on the base 1. Next an internal lead 13 to be connected to the electrode 4 of a semiconductor element 2 in the electrode 5 is formed with the evaporation of a metal of Al series. In addition, a cooling fin 20 is formed on the other side of the base 1. By so doing, the package of a highly integrated semiconductor element can be realized, while it is so constructed that its bottom side is exposed. Thus, the heat generated by the element can be efficiently radiated.

8. 发明专利

JPS56126951A SEMICONDUTOR DEVICE 失效
公开(公告)号：JPS56126951A
公开(公告)日：1981-10-05
申请号：JP3037780
申请日：1980-03-12
申请人： HITACHI LTD , NITSUKAN DENSHI KK , HITACHI OME ELECTRONIC CO
发明人： OOTSUKA KANJI , USAMI TAMOTSU , SEKIHASHI MASAO , TSUBOI TOSHIHIRO , ARAKI TAKASHI , UESAWA MASAHIRO
IPC分类号： H01L23/12 , H01L23/498 , H01L23/50 , H01L23/52
摘要： PURPOSE:To enable the packaging of a high integrated circuit element by composing the internal electrodes in the package of an external lead formed by a printing method and an internal lead formed by an evaporation or the like and thus microminiaturizing the internal electrode. CONSTITUTION:A metallic layer 3 for securing a semiconductor element 2 and an internal electrode 5 of a package connected to the electrode of the element 2 are formed on a ceramic base 1. The electrode 5 is metallized with W or Mo powder 9 and composed thereon of an external lead 6 plated with Ni-base metal and an internal lead 15 formed by the evaporation of Al-base metal connected partly to the lead 6. On the other hand, the element 2 is connected to the base 1 with the metallized metal of Al-base or silver-base. Thus, the internal electrode can be microminiaturized, and the mounting strength and the heat dissipating property of the element can be improved.

9. 发明专利

JPS5678132A WIRE BONDING METHOD AND DEVICE 失效
公开(公告)号：JPS5678132A
公开(公告)日：1981-06-26
申请号：JP15433979
申请日：1979-11-30
申请人： HITACHI LTD , NITSUKAN DENSHI KK
发明人： USAMI TAMOTSU , OOTSUKA KANJI , ARAKI TAKASHI , FUDA MUTSUO
IPC分类号： H01L21/60
摘要： PURPOSE:To accurately perform the line junction for the subject wire bonding by a method wherein the positions of a pad and an inner lead of a semiconductor are detected and memorized, a part of these positions is redetected and compared with the memorized ones, and a correct positioning is performed automatically. CONSTITUTION:A semiconductor device 7 is temporarily fixed on a rest 15, the position of the inner lead 6, whereon a line junction with the positions of the pads 5a and 5b on a pellet 2 will be performed, is detected and the value of a relative position is memorized. The device 7 is shifted to and fixed on a rest 23 of an automatic bonder 22 and the positions of the pads 5a and 5b or leads 6a and 6b, which can be easily ascertained in the lead 6, are detected 20. By comparing the detected value with the memory 19, the positions of all the pads and the inner leads can be relatively found on the basis of the positions of the pads 5a, 5b and leads 6a, 6b. Based on the compared results and by controlling and shifting the rest 23 and a tool 24, the line junction 22 can be accurately performed automatically with a high working efficiency.

10. 发明专利

JPS572535A LEAD STRUCTURE 失效
公开(公告)号：JPS572535A
公开(公告)日：1982-01-07
申请号：JP7552980
申请日：1980-06-06
申请人： HITACHI LTD , NITSUKAN DENSHI KK , HITACHI OME ELECTRONIC CO
发明人： USAMI TAMOTSU , OOTSUKA KANJI , ARAKI TAKASHI , TSUKITA MUTSUO , TSUBOI TOSHIHIRO , SUGIMOTO SHIYUUICHI
IPC分类号： H01L23/50 , H01L21/60
摘要： PURPOSE:To eliminate the improper bonding of a plurality of wires to a lead due to the erroneous operation of the position detector of an automatic wire bonder by forming recess grooves corresponding to the wires at the lead to which the wires are bonded. CONSTITUTION:When a plurality (two) of wires 18, 19 to be connected to the pad 16 of a semiconductor substrate 10 are bonded to the same lead 17, a recess groove 20 for dividing the end of the lead 17 to the number corresponding to the number of the wires is formed at the end of the lead 17, and the wires are connected to the ends 21, 22 of the respective divided lead. Thus, the improper connection caused by the superposition of the connecting positions of the wires and hence the contact of the connecting part of the wires as well as the erroneous detection of the bonding position of the position detector of an automatic wire bonder can be eliminated. Since the size of the width of the lead can be reduced to the minimum necessary size, the lead structure can be highly integrated.

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