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1. 发明专利

JPH1114846A SINGLE-MODE OPTICAL WAVEGUIDE AND ITS MANUFACTURE, AND OPTICAL MODULE USING THE SAME 失效
公开(公告)号：JPH1114846A
公开(公告)日：1999-01-22
申请号：JP16621497
申请日：1997-06-23
申请人： HITACHI CABLE , NIPPON TELEGRAPH & TELEPHONE , HITACHI LTD
发明人： MORIWAKI KAZUYUKI , HIBINO YOSHINORI , YAMADA YASUBUMI , OKAWA MASAHIRO , UETSUKA NAOTO , OKANO HIROAKI , TERAOKA TATSUO , NISHIO TOMOYUKI , IWATO TAISUKE , KANETANI TATSUNORI , KUROIWA TSUTOMU
IPC分类号： G02B6/42 , G02B6/122 , G02B6/13
摘要： PROBLEM TO BE SOLVED: To provide the single-mode optical waveguide which has high position precision as to a positioning index, a thin groove for filter insertion, etc., and small-sized constitution and can prevent a clad mode from leaking to a reflection port, and its manufacture and the optical module using it. SOLUTION: A bench 25 for mounting a light emitting element 22 and a light receiving element 19 is formed on a substrate 11, a buffer layer 27 is formed except at benches 25 and 46 on the substrate 11, and a height adjustment layer 28 for optical axis alignment with both the elements 22 and 19 is formed on the buffer layer 27; and a waveguide core 12 is formed on the height adjustment layer 28, the alignment index for both the elements 19 and 22 is formed on the bench 25, and a clad layer 13 is formed on the substrate 11 where the index is formed. Then a deep groove for exposing the benches 25, 42a, and 46 is formed on the clad layer 13, and electrodes 39 to 41 for supplying a current to the light emitting element 22 and leading a current out of the photodetecting element 19 are formed on the bench 25 to obtain the single-mode optical waveguide.

2. 发明专利

JPH1152158A WAVEGUIDE TYPE OPTICAL CIRCUIT 失效
公开(公告)号：JPH1152158A
公开(公告)日：1999-02-26
申请号：JP21340597
申请日：1997-08-07
申请人： HITACHI CABLE , NIPPON TELEGRAPH & TELEPHONE , HITACHI LTD
发明人： HIRUTA AKIHIRO , UETSUKA NAOTO , INOUE YASUYUKI , TAKATO NORIO , KANETANI TATSUNORI
IPC分类号： G02B6/126
摘要： PROBLEM TO BE SOLVED: To provide a waveguide type optical circuit capable of eliminating high-order modes efficiently even when impurity layer high in refractive index are formed at the boundary between core and clad by manufacturing deviation caused in a manufacturing process. SOLUTION: In this waveguide type optical circuit 13 in which an optical waveguide 8 consisting of core and clad is formed by laminating quarze-contg. glass on a silicon substrate, a mode filter 22 formed so that its width is narrower than that of the optical waveguide 8 is provided at one part of the waveguide 8. Thus, even though an optical axis deviation is caused when elements such as LD, PD are mounted on the waveguide type optical circuit 13 and high-order modes is caused, the mode is eliminated with the mode filter 22.

3. 发明专利

JPH1152150A FILTER MOUNTING TYPE OPTICAL WAVEGUIDE 失效
公开(公告)号：JPH1152150A
公开(公告)日：1999-02-26
申请号：JP21103697
申请日：1997-08-05
申请人： HITACHI CABLE , NIPPON TELEGRAPH & TELEPHONE , HITACHI LTD
发明人： ISHIGAMI YOSHIAKI , INOUE YASUYUKI , ISHIBASHI SHIGEKI , KANETANI TATSUNORI
IPC分类号： G02B6/12
摘要： PROBLEM TO BE SOLVED: To maintain a stable transmission characteristic even at and under a high temp. and high pressure. SOLUTION: A filter 2 is mounted in a groove part 7 formed to cross the joining/branching point 6 of waveguides 5 formed in a core layer 9 and is fixed by adhesives 11 for fixing the filter consisting of UV curing type org. adhesives. Further, the filter 2 and the adhesives 11 for fixing the filter are covered by a cover member 3a. This cover member 3a is fixed to a laminate 4 by a water resistant adhesive 12, such as UV curing type silicone adhesive. As a result, the filter 2 and the adhesives 11 for fixing the filter are sealed. Consequently, the adhesives 11 for fixing the filter are eventually protected against the effect of humidity and moisture. Then, the maintenance of the stable transmission characteristic even at and under the high temp. and high pressure is made possible.

4. 发明专利

JPH1068846A WAVEGUIDE TYPE OPTICAL TRANSMISSION MODULE AND ITS PRODUCTION 失效
公开(公告)号：JPH1068846A
公开(公告)日：1998-03-10
申请号：JP22685696
申请日：1996-08-28
申请人： HITACHI CABLE , NIPPON TELEGRAPH & TELEPHONE , HITACHI LTD
发明人： HIBINO YOSHINORI , ISHIBASHI SHIGEKI , KANETANI TATSUNORI , IWATO TAISUKE , TERAOKA TATSUO
IPC分类号： G02B6/42 , G02B6/122 , G02B6/13
摘要： PROBLEM TO BE SOLVED: To provide a waveguide type optical transmission module which has high reliability and with which the gas-tightness of a semiconductor element is obtd at a low cost. SOLUTION: A thermoplastic resin film 12 is formed on a flat flat plate consisting of a brittle material, such as glass, ceramic or silicon, and a mask material 13 for forming plural recessed parts is applied on this thermoplastic resin film 12. The surface on which the mask material 13 is applied is subjected to sand blasting and the plural recessed parts are formed on the parts on which the mask is not applied. The flat plate is thereafter cut to small pieces inclusive of the recessed parts by a diamond blade, by which gas-tight caps are formed. These gas-tight caps are adhered and fixed to the pit parts of glass waveguides.

5. 发明专利

JPH1054917A OPTICAL WAVEGUIDE MODULE 失效
公开(公告)号：JPH1054917A
公开(公告)日：1998-02-24
申请号：JP21147896
申请日：1996-08-09
申请人： HITACHI CABLE , NIPPON TELEGRAPH & TELEPHONE , HITACHI LTD
发明人： INOUE YASUYUKI , YANAGISAWA MASAHIRO , TERUI HIROSHI , OKAWA MASAHIRO , UETSUKA NAOTO , KANETANI TATSUNORI , IWATO TAISUKE
IPC分类号： G02B6/42 , G02B6/12 , G02B6/122
摘要： PROBLEM TO BE SOLVED: To prevent a clad mode generated within a laser diode (LD)-optical waveguide coupling part and an optical waveguide element from leakage into optical fibers facing this LD by forming grooves of the direction crossing the optical waveguides on both sides of the optical waveguides and applying light shieldable films on the inside walls of these grooves. SOLUTION: The light of a wavelength (λ2) of 1.3μm emitted from the LD is guided through an LD port 19, a branching part 12b and a filter 13 to a common port 14. At this time, the clad mode is generated in the coupling part of the LD and the optical waveguides 11, the branching part 12a and the branching part 12b of the yshaped waveguides. This clad mode is confined and propagated between a substrate 10 and the air layer in the upper part of the clad layer 21, is reflected and absorbed by the grooves 28 formed with the metallic films 30 and is shut off by a groove side bench 29. The leaking of the clad mode from the LD into the optical fibers 18 of the reflection port 17 is, therefore, suppressed.

6. 发明专利

JPH11346030A SEMICONDUCTOR LIGHT RECEIVING AND EMITTING DEVICE AND METHOD OF ASSEMBLING THE SAME 失效
公开(公告)号：JPH11346030A
公开(公告)日：1999-12-14
申请号：JP15413998
申请日：1998-06-03
申请人： HITACHI LTD , NIPPON TELEGRAPH & TELEPHONE
发明人： SHIMAOKA MAKOTO , NAKAMURA HITOSHI , SERIZAWA KOJI , MATSUBARA SHIGERU , KANETANI TATSUNORI , YAMADA YASUBUMI , HASHIMOTO TOSHIKAZU
IPC分类号： H01L31/02 , H01L31/12 , H01S5/00 , H01S5/042 , H01S3/18
摘要： PROBLEM TO BE SOLVED: To homogenize the stress distribution of a plurality of junctions by providing an electrode film and a junction film on the bottom surface of a pit and by providing a plurality of soldered electrode films and junction films into which the junction film is divided. SOLUTION: The bottom surface of an element and an Si substrate are joined at a total of four places, i.e., at an electrode portion 42, and junctions 43, 44 and 45. The electrical connection of a semiconductor light receiving element is made at the portion 42, and its connection to the junctions 43, 44 and 45 is only for joining it and the substrate together, not for electrical connection. However, when cooled after joining, a thermal stress is produced due to a difference in expansion coefficient between the material of the element and that of the substrate. When joined at the junctions 43 and 44, the element and the substrate are fixed at two points, and this increases the generated stress due to the difference in expansion coefficient. When the element and the substrate are jointed at the three junctions 43, 44 and 45, a shearing stress to be generated can be reduced to 0.5 or lower compared with their jointing at the two junctions 43 and 44. Thus, by increasing the number of junctions, the shearing stress can be reduced remarkably.

7. 发明专利

JPH1078536A HYBRID OPTICAL INTEGRATED CIRCUIT AND ITS PRODUCTION 失效
公开(公告)号：JPH1078536A
公开(公告)日：1998-03-24
申请号：JP23553896
申请日：1996-09-05
申请人： HITACHI CABLE , NIPPON TELEGRAPH & TELEPHONE , HITACHI LTD
发明人： SEKINE SATOSHI , YANAGISAWA MASAHIRO , YAMADA YASUBUMI , OKANO HIROAKI , HIGUCHI KEIICHI , UETSUKA NAOTO , TERAOKA TATSUO , KANETANI TATSUNORI , KUROIWA TSUTOMU
IPC分类号： G02B6/30 , G02B6/122 , G02B6/13 , G02B6/42 , H01L27/15
摘要： PROBLEM TO BE SOLVED: To provide a hybrid optical integrated circuit in which semiconductor elements and optical waveguides formed on an Si substrate are optically coupled with high accuracy and a process for producing the same. SOLUTION: The semiconductor elements 20 having plural alignment marks 21 for optical axis adjustment on the rear surfaces and the Si substrate 22 likewise formed with plural alignment marks 23 for optical axis adjustment are subjected to optical axis alignment by these alignment marks 21, 23 for optical axis adjustment using means for image processing, etc. In this case, the plural optical axis aligmnent marks formed on the substrate 22 are formed round, by which the semiconductor elements 20 and the optical waveguides formed on the Si substrate 22 are optically coupled with the high accuracy. The hybrid optical integrated circuit having the extremely high accuracy is, therefore, obtd.

8. 发明专利

JPH06232355A MOS SEMICONDUCTOR MANUFACTURING DEVICE 失效
公开(公告)号：JPH06232355A
公开(公告)日：1994-08-19
申请号：JP1522393
申请日：1993-02-02
申请人： HITACHI LTD
发明人： KANETANI TATSUNORI , YUMOTO OSAMU , MORIGUCHI AKISADA , TAJIRI KAZUYUKI
IPC分类号： H01L27/08
摘要： PURPOSE:To prevent a CMOSIC from being latched up by a method wherein an N-MOS region in the CMOSIC is formed on an N-type region separated electrically from the P region of a substrate and a P-MOS region in the CMOSIC. CONSTITUTION:A single crystal film is formed on a P-semiconductor substrate 1 and SiO2 films 2 for isolation use and channel stoppers 3 are formed. An implantation of N-type impurities, such as phophorus, is performed not only in a P-MOS region but in an N-MOS region and an N-type well region 5 and an N-type region 6 for isolation use are formed. A P-type well region for the N-MOS region is formed in the region 6 by implanting P-type impurities, such as boron, in the region 6. In a reference CMOS inverter circuit, parasitic transistors 10 and 12 constituting a positive feedback circuit are connected to each other via parasitic transistors 11 and 13, a reverse bias is applied to all terminals of the transistors 11 and 13 and the transistors 11 and 13 are never brought in an operating state. Accordingly, the positive feedback circuit is not constituted of the parasitic transistors.

9. 发明专利

JPH06112365A PLASTIC PACKAGE 失效
公开(公告)号：JPH06112365A
公开(公告)日：1994-04-22
申请号：JP25434992
申请日：1992-09-24
申请人： HITACHI LTD
发明人： TAJIRI KAZUYUKI , KANETANI TATSUNORI
IPC分类号： H01L23/28 , H01L23/29 , H01L23/50
摘要： PURPOSE:To improve the heat radiation efficiency of a plastic package by providing large area of heat radiation plates on the topside and the underside of the package. CONSTITUTION:The base pad 7 on which to put an IC chip 1 of a package 3 is made using a metal excellent in heat conductivity And the base pad 7 is made in the size equivalent to the areas of the topside and the underside of the package 3. And, the base pad 7 is a heat radiation plate which is attached before being sealed with plastic and then is bent into a topside part 4 and an underside part 4'. Hereby a package 3 fitted with a heat radiation plate large in contact area with outside. Accordingly, heat radiation efficiency improves as compared with a conventional package, and it becomes easy to let off heat generated in an IC chip 1, and the expansion or cracking by heat can be prevented.

10. 发明专利

JPH0595070A PACKAGE FOR INTEGRATED CIRCUIT 失效
公开(公告)号：JPH0595070A
公开(公告)日：1993-04-16
申请号：JP25500191
申请日：1991-10-02
申请人： HITACHI LTD
发明人： KANETANI TATSUNORI , YUMOTO OSAMU , MORIGUCHI AKISADA , KABAYAMA KOJI , TAJIRI KAZUYUKI
IPC分类号： H01L23/06 , H01L23/50
摘要： PURPOSE:To provide a lead frame length that can reduce noise input, cross talk and absorb stress during packaging to a satisfactory extent without any inductance effect by reinforcing the whole shield of an integrated circuit package and carrying out impedance matching at a led frame. CONSTITUTION:The top, the sides and the bottom to a package are partially covered with GND conductors 4 and 5. A potential connection section from an IC is prepared to be two stage structure, one for a GND service 1 and the other for a signal service 2, so that it may be connected from the IC side or either side. A GND line 1 is connected to the sides and the top of the package and, then, it is introduced to the bottom where it is connected to a GND conductor 7 of a lead frame under coaxial structure which has carried out impedance matching. On the other hand, it is connected to a signal conductor of the lead frame.

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