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1. 发明专利

JPH10223840A THIN FILM HIGH-DIELECTRIC CAPACITOR 失效
公开(公告)号：JPH10223840A
公开(公告)日：1998-08-21
申请号：JP2347297
申请日：1997-02-06
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： ODA HIROTO , TSUJI KAZUTAKA , SAMEJIMA KENJI , IMAMURA YOSHINORI
IPC分类号： H01L27/04 , H01L21/316 , H01L21/822 , H01L21/8242 , H01L27/108
摘要： PROBLEM TO BE SOLVED: To reduce the backward leak current without increasing the forward leak current, by providing a second high-dielectric intermediate layer between a first specified high-dielectric film and lower electrode film. SOLUTION: On an Si substrate 13 a silicon oxide insulation film is formed. On this oxide film a Pt/Ti film of 200/50 nm is formed as a lower electrode film 23 by the vapor deposition, etc. Between a first Bax Sr1-x TiO2 (0.6

2. 发明专利

JP2008097644A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2008097644A
公开(公告)日：2008-04-24
申请号：JP2007324992
申请日：2007-12-17
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： USAMI MITSUO , TSUJI KAZUTAKA , SAITO TAKESHI , SATO AKIRA , SAMEJIMA KENJI , TAKARAGI KAZUO , YASUNOBU CHIZUKO
IPC分类号： G06K19/10 , G06K17/00 , G06K19/07 , G06K19/077
CPC分类号： H01L2924/3512 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To package a semiconductor chip in a medium of thin paper shape. SOLUTION: The semiconductor chip (232) has a dimension of 0.5 mm or less in the length side in plan view, and is buried into the medium of Japanese paper in a state attached with an antenna (233) for transmitting information of a plurality of bits. The semiconductor chip is treated as a part of fiber (231) in the paper when the paper is strained and mounted inside or the surface of the Japanese paper. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：将半导体芯片封装在薄纸形状的介质中。解决方案：半导体芯片（232）在平面图中的长度方向上的尺寸为0.5mm以下，并且以与天线（233）相关的状态埋在日本纸的介质中，用于发送多个位。当纸应变并安装在日本纸的内部或表面时，将半导体芯片作为纸张中的纤维（231）的一部分进行处理。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2000276567A NON-CONTACT IC CARD 失效
公开(公告)号：JP2000276567A
公开(公告)日：2000-10-06
申请号：JP8302999
申请日：1999-03-26
申请人： HITACHI LTD
发明人： TSUJI KAZUTAKA , SAMEJIMA KENJI
IPC分类号： G06K19/07 , B42D15/10 , G06K19/077
摘要： PROBLEM TO BE SOLVED: To provide a thin non-contact IC card which requires no strict machining accuracy for attaining high mechanical strength against the local bending and the load applied concentrically to a chip mounting part by strengthening a 2nd reinforcing plate that is laminated on an IC chip by means of a 1st reinforcing plate that is placed around the IC chip. SOLUTION: A 2nd reinforcing plate that is laminated on an IC chip is strengthened by a 1st reinforcing plate that is placed around the IC chip. In regard to this IC card, for example, a 1st reinforcing plate 106 is adhered to a wiring 103 and a printed circuit board 104 via an insulating adhesive layer 107 and placed with one of its both sides set at almost the same level of the back of an IC chip 101. Meanwhile, a 2nd reinforcing plate 108 is made of the stainless steel and covers the entire surface of the chip 101 and a part of inside of the plate 106. Thus, the IC card is constituted by holding the chip 101 mounted on the board 104 having the plate 106 around it and the plate 108 on its back between the card surface layers 109 and 110.

4. 发明专利

JPH1054878A FLUORESCENT DEVICE AND IMAGE PICKUP DEVICE AND INSPECTION DEVICE USING THE FLUORESCENT DEVICE 失效
公开(公告)号：JPH1054878A
公开(公告)日：1998-02-24
申请号：JP11908497
申请日：1997-05-09
申请人： HITACHI LTD
发明人： TAKAGUCHI MASANARI , KAKIBAYASHI HIROSHI , OSHIMA TETSUYA , SAMEJIMA KENJI , MAKISHIMA TATSUO , KANEBORI KEIICHI , SHINADA HIROYUKI
IPC分类号： G01T1/20 , H01J37/22 , H01J40/18
摘要： PROBLEM TO BE SOLVED: To maintain a fluorescent device under a large light emitting quantity condition, a high-resolution condition, and a high-S/N condition by providing electrodes on the electron incident surface and fluorescence radiating surface of a phosphor and applying a voltage across the electrodes, and then, controlling the scattering direction of a charged particle ray to the fluorescence radiating surface. SOLUTION: A transparent electrode 17 is provided and a DC power source 16 is connected between the electrode 17 and a reflecting film 15 which is also used as an electrode so as to apply a voltage across the electrode 17 and film 15. The electrode 17 side is set to a high voltage and the diffusion of an electron beam is prevented by pulling the beam to the incident axis side. The suitable material for forming the electrode 17 includes a tin oxide, indium oxide, titanium oxide., etc. Since the track 13 of the low-energy electron beam which largely affects the deterioration of the resolution and S/N of a fluorescent device is maintained so that the track 13 cannot deviate from the incident axis in a phosphor, the out-of-focus of an image which occurs in the phosphor is reduced and the resolution of the fluorescent device is improved. Namely, the resolution and S/N of the device can be improved even when the applied voltage is low, because the resolution and S/N deteriorating effects of the electron beam become larger as the energy of the beam decreases.

5. 发明专利

JPH0980319A ENDOSCOPE DEVICE 失效
公开(公告)号：JPH0980319A
公开(公告)日：1997-03-28
申请号：JP23800295
申请日：1995-09-18
申请人： HITACHI LTD
发明人： SAMEJIMA KENJI , TAKEDA YASUTSUGU , TSUJI KAZUTAKA , UMETANI KEIJI , KAJIYAMA TOMOHARU
IPC分类号： G02B23/24 , A61B1/04
摘要： PROBLEM TO BE SOLVED: To obtain an endoscope device whose obtained image sensitivity and resolution, and S/N are high even when a scope diameter is made small by providing an image pickup device which utilizes electron multiplying operation in a semiconductor. SOLUTION: An image pickup tube 100 which performs electric charge multiplying operation in the semiconductor is provided at the terminal part of the image guide 105 of the optical endoscope. An optical image projected from the external end surface of this image guide fiber 105 is formed on the photoconductive target of the image pickup tube 100 which performs the electric charge multiplying operation in the semiconductor through an optical lens 108. The electron beam of the image pickup tube 100 is deflected and converged with a voltage supplied from an electron beam scanning circuit 109 to the electrode and coil 110 in the tube to scan a photoconductive target, and then a specific target voltage is applied from a target electrode 111 to a transparent electrode provided on the light incidence side of the photoconductive target. Consequently, even when the scope diameter is small and the quantity of illumination light is small, the subject image can be observed with sufficient sensitivity.

6. 发明专利

JPH04112434A IMAGE PICKUP TUBE AND ITS OPERATING METHOD 失效
公开(公告)号：JPH04112434A
公开(公告)日：1992-04-14
申请号：JP23065890
申请日：1990-09-03
申请人： HITACHI LTD , JAPAN BROADCASTING CORP
发明人： OGAWA HIROBUMI , NAGATSUMA KAZUYUKI , SAMEJIMA KENJI , HIRAI TADAAKI , MARUYAMA HIROTAKA , OKAZAKI SABURO , SATO SHIRO
IPC分类号： H01J29/45 , H01J31/49
摘要： PURPOSE:To accomplish an image pickup tube for X-rays in which screen abnormality phenomena and defects on the screen are improved, by forming a target electrode on an insulative sheet restricted to its part corresponding to the effective scan region with electron beam. CONSTITUTION:A base board is formed from an insulate plate 1 provided with an opening 17 for passage of X-rays and an insulative sheet 2 which X-ray penetrates easily, and a target electrode 3 consisting of a conductive sheet is provided restricted to the part corresponding to the effective scan region with electron beam 10 projected over the insulative sheet 2. This target electrode 3 is connected with a pin electrode 5 for signal takeout penetrating the insulate plate 1 being insulated from a metal ring 7. This constitution enables operating of the target electrode 3 and metal ring 7 while they are connected with separate power supplies, and the voltage on the surface other than effective scanning region with electron beam 10 on a photo-electric conductive film 4 can be suppressed.

7. 发明专利

JPS6286652A OPERATING METHOD FOR IMAGE PICKUP TUBE 失效
公开(公告)号：JPS6286652A
公开(公告)日：1987-04-21
申请号：JP22370785
申请日：1985-10-09
申请人： HITACHI LTD
发明人： TSUJI KAZUTAKA , SHIMOMOTO TAIJI , SAMEJIMA KENJI , KUSANO CHUSHIRO , ISHIOKA YOSHIO , HIRAI TADAAKI
IPC分类号： H04N5/228 , H01J29/45 , H01J31/38
摘要： PURPOSE:To prevent generation of a pseudo-signal attending upon the redistribu tion of a secondary electron, by setting the electric potential of a collector electrode to a cathode electrode to the specified value. CONSTITUTION:At least a light permeable conductive film 17 and a light conductive film 19 are installed on a light permeable insulating substrate 16, and there is provided with a light conductive target setting up this light permeable insulating substrate 16 at the light incident side. Electric potential of a collector electrode to a cathode electrode is operated in making it higher than that of such energy that a second electron emission ratio of the light conductive larger cut 1 wit a negative grade to primary electron energy. With this constitution, potential on a scanning surface is balanced with the potential different from that of the collector electrode, whereby a potential grade between the scanning surface and the collector electrode is made sufficiently enlargeable, and a pseudo-signal attending on the redistribution of a secondary electron is made so as not to be produced.

8. 发明专利

JP2001326195A SEMICONDUCTOR CHIP, MANUFACTURING METHOD THEREOF AND MOUNTING METHOD OF THE SEMICONDUCTOR CHIP 失效
公开(公告)号：JP2001326195A
公开(公告)日：2001-11-22
申请号：JP2000148586
申请日：2000-05-16
申请人： HITACHI LTD
发明人： TASE TAKASHI , SAMEJIMA KENJI , SATO AKIRA
IPC分类号： H01L21/301
摘要： PROBLEM TO BE SOLVED: To enable reliable peel off of semiconductor chips from a dicing tape without breaking the chips, even if the chips are thin semiconductor chips and to enable efficient manufacture of the chips or mounting of the chips on a card or the like. SOLUTION: When semiconductor chips 190 are respectively formed in integrally with reinforcing sheets 260 via bonding agents 110 for reinforcing the chips 190 and the chips 190 are separated from their rear surfaces by a thrusting up needle, the chips are separated in a state of integral formation with the rigid sheets 260.

9. 发明专利

JPH0950771A IMAGE PICKUP DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH0950771A
公开(公告)日：1997-02-18
申请号：JP20200995
申请日：1995-08-08
申请人： HITACHI LTD
发明人： OGAWA HIROBUMI , SAMEJIMA KENJI , HIRAI TADAAKI
IPC分类号： H01L27/146 , H01J29/45 , H01J31/26 , H01L31/08
摘要： PROBLEM TO BE SOLVED: To form a positive hole implantation hindering layer with the excellent repeatability in a process for manufacturing a photoconductive target of an image pickup device. SOLUTION: Evaporation boat 11 is filled with the evaporation material 12 of the oxide sintered material at 60% or more of density, and a transparent electrode is formed on a transparent glass board 18, to which surface etching is performed, and placed on a rotary disk 17, and the evaporation boat 11 is electrified by the vacuum resistant heating evaporation so as to heat and vaporize the oxide sintered material, and a positive hole filling hindering layer is formed on each board on the rotary disk. An image pickup device having an image pickup target, in which the dark current is small and a fault of the screen is improved, is obtained.

10. 发明专利

JPH06338278A X-RAY CAMERA TUBE 失效
公开(公告)号：JPH06338278A
公开(公告)日：1994-12-06
申请号：JP12863393
申请日：1993-05-31
申请人： HITACHI LTD , JAPAN BROADCASTING CORP
发明人： SAMEJIMA KENJI , NAGATSUMA KAZUYUKI , TSUJI KAZUTAKA , HIRAI TADAAKI , MARUYAMA HIROTAKA , OKAZAKI SABURO
IPC分类号： H01J29/45 , H01J31/49
摘要： PURPOSE:To provide an X-ray camera tube which has higher sensitivity without causing a distortion in an image and a break in a photoconductive film even if a substrate is formed in reduced thickness. CONSTITUTION:A X-ray camera tube is provided with an X-ray transmissive incidence window 1 pressed into contact with and sealed to a camera tube outer-tube 6, a camera tube target-portion consisting of both a photoconductive film 4 which converts incident X-rays into their corresponding electric signals and a target electrode 3, and a scanning electron beam generator portion. The camera tube target-portion is separated from the incidence window 1.

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