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1. 发明专利

JPS5775701A Pipe edge cutting and turning device 失效
标题翻译：管边缘切割和切割装置
公开(公告)号：JPS5775701A
公开(公告)日：1982-05-12
申请号：JP15203980
申请日：1980-10-31
申请人： Hitachi Ltd , Hitachi Service Eng Co Ltd
发明人： OBARA TETSUO , TAKASE MASANORI , YOKOYAMA HIROSHI , SHIBATA MITSUO
IPC分类号： B23B5/00 , B23B5/16
摘要： PURPOSE: To collect the cutting dust into a vacuum cleaner by means of vacuum absorption in such a way that cutting dust produced from pipe cutting and truing process is cut off in the process of cutting and truing up a cooling pipe of a heat exchanger with use of titanium pipe or the like.
CONSTITUTION: Before the work of cutting and truing up the edge portion of cooling and heating pipes 5 of a large-sized heat exchanger in an atomic power plant, or another, a cutting dust collecting type cutter 21 and a cutter driving gear 2 are directly coupled and fixed with a combinder 23. Then, cutting of the edge portions of the pipes is set to work in such a way that a vacuum cleaner is operated, the driving gear 2 is further turned while a cutter guide 29 is inserted into a pipe 5 and pressed thereinto. Cutting dust which has been produced from its cutting is cut off by means of a chip breaker equipped on a cutting tool 30, which becomes discontinuous cutting dust, passes through a main body 31 that is sucked in vacuity by way of an exhaust bracket and a hose 19, and collected into the vacuum cleaner.
COPYRIGHT: (C)1982,JPO&Japio
摘要翻译：目的：通过真空吸收将切割粉尘收集到真空吸尘器中，使切割和切割过程中产生的切割灰尘在切割和切割热交换器的冷却管道的过程中被切断的钛管等。构成：在原子能发电厂等的大型热交换器的冷却和加热管5的边缘部分切割和修整之前，切割集尘型切割机21和切割驱动齿轮2直接然后，将管道的边缘部分的切割设置成使得真空吸尘器工作，使驱动齿轮2进一步转动，同时切割器引导件29插入到管道中 5并压入其中。由切割产生的切割灰尘通过设置在切割工具30上的切屑破碎机而被切断，切割工具30变成不连续的切割灰尘，穿过主体31，主体31通过排气支架吸入真空，软管19，并收集到吸尘器中。

2. 发明专利

JPS56121998A BLIND PLUG OF HEAT TRANSFER PIPE 失效
公开(公告)号：JPS56121998A
公开(公告)日：1981-09-25
申请号：JP2533080
申请日：1980-03-03
申请人： HITACHI LTD , HITACHI SERVICE ENG
发明人： YOKOYAMA HIROSHI , KANOU YOSHITSUGU , SUDA HIDEO , HORIE TOORU
IPC分类号： F16L55/12 , F16L55/10 , F28F11/04
摘要： PURPOSE:To obtain a blind plng simply attached to a heat transfer pipe which is used in a heat exchanger of a turbine condenser by clamping a through bolt and a clamping nut to expand a rubber plug and causing the same closely to adhere to the inner diameter of the enlarged pipe. CONSTITUTION:A bolt 14 is inserted into a through hole 12 of a rubber plug 11 having an outer diameter slightly smaller than the inner diameter of the enlarged pipe part 5 through a washer 13. Then, the plug 11 is inserted into the enlarged pipe part 5 of the heat transfer pipe 4 fixed to a pipe plate 3 and damaged and leaking. Then, a washer 15 is coated thereon and the bolt 14 is clamped, the vicinity of the through hole 12 of the rubber plug 11 is compressed by the convex surface of the washer 13 and 15, and a peripheral part 19 swells and rightly adheres to the pipe enlarged part 5, hole edges being urged against the washers 13 and 15 and the damaged pipe 4 being sealed. When this blind plug operation is applied to both ends of the damaged pipe, the damaged pipe 4 becomes a dead pipe.

3. 发明专利

JP2001307603A VACUUM SWITCH AND VACUUM SWITCH GEAR USING THE SAME 失效
公开(公告)号：JP2001307603A
公开(公告)日：2001-11-02
申请号：JP2000123675
申请日：2000-04-19
申请人： HITACHI LTD , TOKYO ELECTRIC POWER CO
发明人： MISHIRO TAKUYA , TANIMIZU TORU , KIKUGAWA SHUICHI , KOJIMA KATSUNORI , MORITA AYUMI , YOKOYAMA HIROSHI , MURATA KOICHI , HANABUCHI RYOTARO
IPC分类号： H02B13/02 , H01H1/58 , H01H31/00 , H01H33/66 , H01H33/662 , H01H33/666 , H01H33/668
摘要： PROBLEM TO BE SOLVED: To provide a vacuum switch which is miniaturized but has improved reliability, and a vacuum switch gear using the same. SOLUTION: This device is provided with a first vacuum container 1 housing a circuit breaker, a grounded second vacuum container 2 housing the first vacuum container 1, and a grounded third vacuum container 3 connected to the second vacuum container 2 and housing a circuit breaker 40 and a grounding device 30. The first vacuum container is electrically insulated from the second and the third vacuum container.

4. 发明专利

JPH09133725A AUTOMATIC POWER FEED METHOD 失效
公开(公告)号：JPH09133725A
公开(公告)日：1997-05-20
申请号：JP29243395
申请日：1995-11-10
申请人： HITACHI LTD
发明人： OGOSHI YOSHINORI , AOKI YOSHIO , SUGAWARA NOBUYUKI , INAYOSHI KENJI , YOKOYAMA HIROSHI
IPC分类号： G01R31/00 , B23P21/00 , H01J9/42 , H01J9/44
摘要： PROBLEM TO BE SOLVED: To automatically feed electric power by constraining and positioning leads of different length, and clamping the leads with electrically live plates at both sides of a lead continuity part, regarding an automatic power feed method used at a process for the assembly of an electric part having a lead and the inspection thereof. SOLUTION: Leads 8 having different length for a lamp 1 are constrained with a lead clamp chuck 3, and a clamp chuck vertical motion cylinder 5 is lowered, thereby constraining and positioning the leads 8. Thereafter, the positioned leads 8 are clamped with electrically live electrode plates 7 closed with electrode plate open/close cylinders 9, thereby automatically feeding power.

5. 发明专利

JP2592308B2 失效
公开(公告)号：JP2592308B2
公开(公告)日：1997-03-19
申请号：JP24414088
申请日：1988-09-30
申请人： HITACHI LTD
发明人： TANAKA AKIRA , INOE KOICHI , YAMADA KAZUJI , MYAZAKI KUNIO , MIURA OSAMU , ARAKAWA HIDEO , YOKOYAMA HIROSHI , NAGANUMA YOSHIO , MORIHARA ATSUSHI , OOCHI KAZUNORI
IPC分类号： G06F1/18 , H01L21/60 , H01L23/057 , H01L23/467 , H01L23/498 , H01L23/50 , H01L25/065
摘要： A semiconductor package for use in computers includes an insulating substrate (2) onto which a semiconductor device (1) is mounted, an insulating cap (3) which shuts out outside air and seals said semiconductor device (1), power-source lines (7) which provide power to the semiconductor device, and signal lines (6) which transmit output signals from the semiconductor device to external circuits. The signal lines are arranged perpendicularly to the insulating substrate so that they are prevented from the dielectric constant of the insulating substrate, while the power-source lines are formed within the insulating substrate and connected through conductive layers parallel to the surface onto which the semiconductor is mounted to external leads (4, 5).

6. 发明专利

JPH03164804A PROCESS CONTROL SYSTEM AND POWER PLANT PROCESS CONTROL SYSTEM 失效
公开(公告)号：JPH03164804A
公开(公告)日：1991-07-16
申请号：JP30217189
申请日：1989-11-22
申请人： HITACHI LTD
发明人： MATSUMOTO HIROSHI , SHIMODA MAKOTO , NOMURA MASAHIDE , SAITO TADAYOSHI , YOKOYAMA HIROSHI , KAJI AKIRA , MIYAGAKI HISANORI , NIKAWARA SEIITSU , HANAOKA HIROSHI
IPC分类号： F01K13/02 , G05B13/02
摘要： PURPOSE:To optimize a process by extracting a qualitatively matching operation plan from a correction rule, which determines operation plans in qualitative relations between the operation characteristic of the process and an operation target based on evaluated values obtained by an evaluating means, to determine the correction quantity of a control means. CONSTITUTION:The operation target and the actual operation characteristic of the process are evaluated and the preliminarily generated correction rule is referred to determine the operation controlled variable of the process. Relations between this correction quantity and the operation target are stored in a storage means (knowledge base) 500. When the operation target is inputted to this means 500, the corresponding correction quantity is immediately transmitted to a control means (control function) 1000, and the process is operated based on this correction quantity. When correction is required again, the correction rule is referred to determine the correction quantity again, and the result is stored in relation to the operation target and is immediately transmitted to the control means 1000 to optimize the process. Thus, it is optimized.

7. 发明专利

JPH0364061A INTEGRATED CIRCUIT DEVICE 失效
公开(公告)号：JPH0364061A
公开(公告)日：1991-03-19
申请号：JP19941789
申请日：1989-08-02
申请人： HITACHI LTD
发明人： ARAKAWA HIDEO , OKAMOTO MASAHIDE , OHASHI MASABUMI , OGIWARA SATORU , KODAMA HIRONORI , YAMADA KAZUJI , YOKOYAMA HIROSHI
IPC分类号： H01L23/373 , H01L25/04 , H01L25/18
摘要： PURPOSE:To provide a module structure of a low thermal resistance by employing pins made of conductive metal as connectors of carrier boards to a multilayer board. CONSTITUTION:Individual LSIs 6 are connected to a multilayer board 5 by flexible conductive metal pins 6 to satisfy electric functions, and all the LSIs can be brought into contact with a cap 2 by the flexible pins. The flexibility of the pin eliminates the substantially generating various dimensional errors to uniformly cool all the plurality of LSIs to stabilize characteristics. Highly conductive Cu, Ag, Al, W, No or their alloys is employed as the pin. On the other hand, in order to bring the LSI into contact with a cap, the pin needs flexibility, i.e., flexibility for eliminating dimensional errors of components and substantially generated in case of adhering them.

8. 发明专利

JPH036848A SEMICONDUCTOR COOLING MODULE 失效
公开(公告)号：JPH036848A
公开(公告)日：1991-01-14
申请号：JP14147889
申请日：1989-06-03
申请人： HITACHI LTD
发明人： NAGANUMA YOSHIO , MORIHARA ATSUSHI , OUCHI KAZUNORI , SATO YASUSHI , YOKOYAMA HIROSHI
IPC分类号： H01L23/473 , H01L23/433
摘要： PURPOSE:To reduce a contact section of a large heat resistance by providing a heat medium which transmits generated heat of a plurality of semiconductor elements to a heat conductor in contact with the semiconductor element and the heat conductor and by incorporating a cooling means in the heat conductor, and to improve cooling efficiency by cutting down a distance between the semiconductor element and coolant. CONSTITUTION:A flow path 10 of coolant 8 inside a cooling jacket is constituted to make the coolant to flow in zigzag through a turning flow path 11 shown by using a dotted line. Heat generated from a semiconductor element 2 mounted on a substrate 1 is transmitted to the coolant 8 through a wedge-shaped cooling element 3 and a wall of a heat conductor 4 which has a sawtooth cross section. A main body of a cooling jacket 14 is made integral by the heat conductor 4 and a flow path constituting plate 5. The wedge-shaped cooling element 3 is wedged in between the semiconductor element 2 and the heat conductor 4 by a press spring 7 just like a wedge to make the three bodies come into close contact each other. The wedge-shaped cooling element 3 makes the semiconductor element 2 and the heat conductor 4 come into close contact each other and transmits generated heat of the semiconductor element effectively.

9. 发明专利

JPH02246255A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH02246255A
公开(公告)日：1990-10-02
申请号：JP6798489
申请日：1989-03-20
申请人： HITACHI LTD
发明人： KOSEKI YASUO , EBARA KATSUYA , TAKAHASHI SANKICHI , YOKOYAMA HIROSHI , MORIHARA ATSUSHI , NAGANUMA YOSHIO , ZUSHI SHIZUO
IPC分类号： H01L23/373 , F28D20/02 , H01L23/473
摘要： PURPOSE:To cool the entire body at a uniform temperature and to stabilize the performance of a computer by utilizing the heat which is absorbed when a solid phase is transformed into a liquid phase, and cooling semiconductor devices. CONSTITUTION:A cooling medium within a container 10 is cooled to the freezing temperature or lower of the phase changing material in the cooling medium with a cooling coil 22A through which the refrigerant that is cooled with a refrigerator 22 flows. Droplets 5 which are the phase changing material are freezed, and minute solid-state particles 6 are obtained. The solid-state particles 6 are dispersed into liquid 4 whose phase is not changed. The cooling medium becomes the slurry-state cooling medium 2. The cooling medium flows through semiconductor devices 21 in a computor main body 11 by way of a motor operated valve 26 and Iiquid sending pipe 18. The slurry-state cooling medium 2 which flows through the semiconductor device 21 flows up from the lower part in a snake pattern. Heat generated from the semiconductor elements is absorbed with the cooling medium through a heat conducting member and a heat conducting surfaces. Thus, the heat generated in the computer is cooled highly efficiently at the uniform temperature of the part to be cooled.

10. 发明专利

JPH0283957A JET STREAM COOLER OF INTEGRATED CIRCUIT 失效
公开(公告)号：JPH0283957A
公开(公告)日：1990-03-26
申请号：JP23500288
申请日：1988-09-21
申请人： HITACHI LTD
发明人： OUCHI KAZUNORI , MORIHARA ATSUSHI , NAGANUMA YOSHIO , YOKOYAMA HIROSHI
IPC分类号： H01L23/467
摘要： PURPOSE:To cool down the heat generated by an integrated circuit efficiently by a method wherein coolant gas is supplied from an introducing nozzle onto the upper surface of the integrated circuit and, after heat exchange is performed, discharged from a drain nozzle. CONSTITUTION:The heat generated by an integrated circuit 3 is transmitted to a radiator 5 through a joint part 4. On the other hand, coolant gas 6 is jetted against the center part of the cooling fins of the radiator 5 by an introducing nozzle 8. Then, while heat exchange is performed between the gas 6 and the cooling fins, the gas 6 is made to flow from the center part toward the circumferential part of the radiator 5 as exhaust gas 7. The exhaust gas 7 is made to flow along the inner circumference of a drain nozzle 9 to the direction opposite to the direction of gas introduction and discharged. Further, if many integrated circuits 3 are provided on a wiring board 1 and cooled, the harmful influence given by the exhaust gas 7 upon other circuits 3 can be eliminated by providing the nozzle 9. With this constitution, a high performance cooler of an integrated circuit can be obtained.

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