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    • 3. 发明专利
    • SEMICONDUCTOR STACK
    • JPH0637198A
    • 1994-02-10
    • JP18787992
    • 1992-07-15
    • HITACHI LTDHITACHI MITO ENG KK
    • TAKAKU TOSHIHIKOSAITO HIDEJI
    • H01L23/04
    • PURPOSE:To reduce the weight of a semiconductor stack by interposing coned disc springs between connecting bodies sandwiched between stacked bodies of semiconductor stacks and fixing the connecting plates held between the coned disc springs to a mounting frame. CONSTITUTION:A coned disc spring 8 is provided in the counterbored part of a supporting body 1 and an insulator 4 is provided by pressing the insulator 4 with a spring seat 10. Then an insulator 4, spring seat 20, coned disc spring 19, connecting plate 13, coned disc spring 19, spring seat 20, and insulator 4 are put between stacked bodies each of which is composed of a cooling fin 5, semiconductor device 6, cooling fin 5, and connecting conductor 7. A ball seat 3, ball 2, and supporting body 19 are arranged at the end section and, while they are pressed in the direction directed by the arrow, stack bolts 11 are tightened with nuts 11. Then the plate 13 is fitted to a fitting 14 with bolts 15 and the fitting 14 is fixed to a mounting frame 18 with bolts 16. Therefore, an unbalanced load caused by the flexure of the semiconductor stack can be absorbed by the coned disc springs 19 on both sides of the plate 13 and the weight of the stack can be reduced.
    • 6. 发明专利
    • SEMICONDUCTOR STACK
    • JPH04206563A
    • 1992-07-28
    • JP32893090
    • 1990-11-30
    • HITACHI LTDHITACHI MITO ENG KK
    • TAKAKU TOSHIHIKOITAHANA HIROSHITSUNODA KOJISAITO HIDEJI
    • H01L25/11
    • PURPOSE:To use components such as spring washers and the like in common and to dispense with a support so as to enable a semiconductor stack to be miniaturized and lightweight by a method wherein unit laminates sandwiching a thin plate between them are compressed, and the thin plate is fixed to a rigid body through the intermediary of a dimension adjusting mechanism. CONSTITUTION:Spring washers 8 are arranged in a support 1, an insulating seat 4 which insulates a support 10 that supports a spring from fins 5 is provided, a semiconductor element 6, the cooling fins 5, a connector 7, and a thin plate 13 are provided, the spring washers 8 are arranged at the end of a support 9, the spring washers 8 are pressed by supports 3, a stud bolt 11 is fastened by a nut 12, the thin plate 13 is fixed both to a mounting plate 14 by a bolt 15 and to a rigid body 17 by a bolt 16. The laminate concerned is controlled in mounting position by the bolts 14 and 15, and the positional deviation of the laminate in an axial direction caused by thermal expansion can be absorbed by the thin plates 13. By this setup, a laminate long in an axial direction in which it is compressed can be pressed to uniformly give pressure to the contact surface of semiconductors and mounted on a rigid body.