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    • 3. 发明专利
    • DRY-TYPE TRANSFORMER COIL
    • JPH1131625A
    • 1999-02-02
    • JP18623197
    • 1997-07-11
    • HITACHI LTD
    • IKEDA KENJISUZUKI SHIGEOSHIMIZU TOSHIOIZUNA TOMOMI
    • H01F27/32H01F30/00
    • PROBLEM TO BE SOLVED: To prevent water, dust, etc., for infiltrating the inside of a coil by winding an outer circumferential coating material around a coil outer circumferential part, and a eliminating the exposed part of a wiring by sealing an end part by additional reaction type silicone resin. SOLUTION: A high-voltage coil or a low-voltage coil is prepared by winding an electrical insulation coating material 5 on a conductor 4, winding it to an insulating tube 6 thereafter, winding an outer circumferential coating material 7 to an outer circumferential part, hardening a semi-hardening resin used in each member through a heating treatment, and then filling silicone resin 8 thereinto. An exposed part in a wiring is eliminated, water, waste, dust, etc., are prevented from entering an inside of a coil, and reliability and appearance are improved by filling the outer circumferential part of a coil with an outer circumferential coating material and filling an end part with additional reaction type silicone resin. In the coil, the entire body to an inside of a coil is not molded by silicon resin unlike as in a mold transformer, but the both end parts of a coil alone are sealed by additional reaction type silicone resin. Therefore, the operation for having silicone resin infiltrate into the inside of a wiring can be omitted.
    • 10. 发明专利
    • RESIN SEALED SEMICONDUCTOR DEVICE
    • JPS6411355A
    • 1989-01-13
    • JP16679987
    • 1987-07-06
    • HITACHI LTD
    • OGATA MASAJISEGAWA MASANORIABE HIDETOSHIHOZOJI HIROYUKISUZUKI SHIGEO
    • H01L23/29C08G59/24C08L63/00H01L23/31
    • PURPOSE:To enhance the resistance to a crack, the resistance to heat of a solder and the reliability of moistureproofness by a method wherein this device is sealed by using a thermoset molding material where a large quantity of spherical molten silica whose grain diameter, grain-size distribution and specific surface area are specified is mixed. CONSTITUTION:A spherical filler which is used as a molding material for sealing a semiconductor is prepared by mixing an epoxy resin or a polyimide or polyaminobismaleimide thermoset resin with more than 80wt.% of spherical molten silica having the following characteristics: its average grain diameter is within a range of 5-15mum; its maximum grain diameter is less than 100mum; if its grain-size distribution is expressed by using an RRS grain-size diagram., at least more than 60wt.% of an intermediate grain diameter excluding a coarse grain part and a fine grain part displays the linearity and its gradient n is less than 1.0; its average specific surface area is less than 4m /g. The fluidity, the hardening performance and the molding workability of this molding material are excellent; a resin seal semiconductor manufactured by using this molding material displays the good reliability regarding the resistance to a thermal shock, the moistureproofness or the like.