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    • 6. 发明专利
    • PRESSURE DETECTOR
    • JPS5882137A
    • 1983-05-17
    • JP17974281
    • 1981-11-11
    • HITACHI LTD
    • TAKAHASHI YUKIOSHIMAZOE MICHITAKA
    • G01L9/04G01L9/00
    • PURPOSE:To raise safety and reliability by forming a pressure receiving chamber by making anode-connection of the diaphragm made of a semiconductor single crystal at a pressure conversion section with a member that is provided with a fluid introduction hole with thermal expansion coefficient that is about the same as the diaphragm. CONSTITUTION:A pressure conversion section 11 consists of a single crystal diaphragm 12 that is provided with a strain sensitive section, an insulation film that is formed on the diaphragm 12 and a thin film strain gauge 14 that is fixed on the insulation film 13. The pressure conversion section 11 is stacked on a metallic supporting base 20 made of Kovar through a glass base 18 on which a fluid introduction hole 17 with thermal expansion coefficient that is about the same as that of the diaphragm 12 on the pressure conversion section 11. The pressure conversion section 11 and the metallic supporting base 20 are electrically firmly connected by anode-connection to form a pressure receiving chamber 21. With this arrangement organic materials that deteriorate characteristic can be eliminated and also the effects of the strain of the weldment of the gauge 14 and others can be avoided.
    • 8. 发明专利
    • Detector for detecting pressure and pressure difference of semiconductor
    • 用于检测压力和压力差的半导体检测器
    • JPS5750479A
    • 1982-03-24
    • JP12642780
    • 1980-09-10
    • Hitachi Ltd
    • SHIMAZOE MICHITAKAMATSUOKA YOSHITAKAYASUKAWA AKIO
    • G01L9/04G01L9/00H01L29/84
    • H01L29/84
    • PURPOSE:To improve accuracy in measuring pressure, by a method wherein the thin part of a diaphragm formed by cutting a groove out of a substrate made of a semiconductor single crystal with its central and peripheral parts left untouched is provided with a strain sensitive region, while a second groove is cut into the central part thereof. CONSTITUTION:A cut groove 4 is made in a single crystal 1 such as Si excluding its central part 2 and peripheral part 3. A thin distorted part 5 is provided with a strain resistance element 6, while a second cut groove 7 is made in the central part, to form a thin part 8 and a thick portion 9. By so doing, because film stress caused by the transformation of the distorted part 5 is compensated with the elongation of the thin part 8, the non-linearity of the distortion against pressure is reduced and accuracy in measuring pressure can be improved.
    • 目的:为了提高测量压力的精度,通过以下方法提供了一种方法,其中通过将其中心和周边部分保持不变的由半导体单晶制成的基板切割出槽形成的隔膜的薄部分设置有应变敏感区域, 而第二凹槽被切割成其中心部分。 构成:在除了中心部分2和周边部分3之外的诸如Si的单晶1中制成切割槽4.薄变形部分5设置有应变电阻元件6,而第二切割槽7制成在 中心部分,以形成薄的部分8和厚的部分9.通过这样做,由于由变形部分5的变形引起的薄膜应力由薄部分8的伸长率补偿,扭曲的非线性反对 压力降低,可以提高测量压力的精度。
    • 10. 发明专利
    • FABRICATING METHOD OF SEMICONDUCTOR DEVICE
    • JPS55143028A
    • 1980-11-08
    • JP5035379
    • 1979-04-25
    • HITACHI LTD
    • TAKAHASHI YUKIOSHIMAZOE MICHITAKA
    • H01L21/223
    • PURPOSE:To accurately form the impurity density in a semiconductor wafer by coating the impurity layer on one surface of the wafer when diffusing the impurity in the wafer, vacuum sealing it in a capsule, heat treating it and diffusing the impurity layer on the surface to be diffused of the other surface. CONSTITUTION:An SiO2 film 4 is coated on one surface 2 of a silicon wafer 1 to be diffused, and an impurity layer 5 to become a diffusing source is diffused on the other surface thereof according to an ordinary method. Then, a desired pattern is formed on a part of a film 4 by a photoetching process, a plurality of such wafers 1 are stood at an interval on a quartz boat 7 and contained in a quartz capsule 6. Thereafter, the capsule 6 is evacuated to a vacuum of 10 Torr or higher and heat treated at 1,000-1,200 deg.C to diffuse the impurity in the layer 5 to the surface 2 to be diffused to provide a predetermined diffused region thereon. Thus, the impurity density of the diffused region becomes accurate to be adapted for diffused resistor of a strain gauge or the like.