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1. 发明专利

JPH02143207A OPTOELECTRONIC DEVICE WITH OPTICAL COUPLING BODY 失效
公开(公告)号：JPH02143207A
公开(公告)日：1990-06-01
申请号：JP29593788
申请日：1988-11-25
申请人： HITACHI LTD
发明人： SASAYAMA ATSUSHI , SHIMAOKA MAKOTO , AIKI KUNIO , HANEDA MAKOTO , TAKAHASHI SHOICHI , MORIKAWA EIICHI
IPC分类号： G02B6/42 , H01S5/00
摘要： PURPOSE:To obtain an optical coupling system which is always stable when an optical connector plug is detached/attached from/to the coupling system by providing an engaging section where the sleeve fixes the plug with no gap. CONSTITUTION:An optical coupling body is constituted of a receptacle 3 and optical connector and the inner end section of the sleeve 9 of the receptacle 3 becomes narrower and constitutes an engaging section 23 which elastically acts with plural slits. Since the engaging section 23 elastically tightens the plug 20 of the optical connector when the plug 20 is inserted into the sleeve 9, the plug 20 can be fixed without gap. Therefore, the optical coupled state between an optical element 2 and the optical fiber connected with the plug 20 can always be maintained at the initial set state and highly accurate optical coupling can be realized.

2. 发明专利

JPS63263438A OPTICAL INSPECTION DEVICE 失效
公开(公告)号：JPS63263438A
公开(公告)日：1988-10-31
申请号：JP9740487
申请日：1987-04-22
申请人： HITACHI LTD , HITACHI TOKYO ELECTRONICS
发明人： FURUHASHI TAKAHIRO , SHIOZAWA KEISHIN , SASAYAMA ATSUSHI , YAZAKI NORIHIRO
IPC分类号： G01B11/24 , G01B11/255 , G01M11/00 , G02B6/32 , H01L33/58 , H01S5/00
摘要： PURPOSE:To detect whether or not an optical fiber is normal with high accuracy by detecting far field images at two points of laser light emitted by a microlens on the tip of the optical fiber and finding the divergence angle of the laser light, and finding the optical radius of curvature of the lens by applying the propagation rule of a Gaussian beam. CONSTITUTION:A core 1 made of quartz to which B, F, P, Ge, etc., are added is covered with a clad 3 of pure quartz to form the optical fiber 1, which is provided with a microlens structure 5 of 10-30mum in radius a the tip on a laser light projection side. Then this fiber 1 is mounted on a control table 32 movably in an X-, a Y-, and a Z-axial direction, a light emitting device 31 is connected to the incidence side, and the projection side is set opposite an infrared camera 40 on a support table 33, so that an image from it is displayed on a CRT 43 through a video controller 42. Thus, the widths WA and WB of the half-value total angles of Gaussian type far field images 50 and 51 obtained by image processing and the beam divergence angle theta are calculated and used to decide whether or not the radius of curvature of the lens 5 is within a reference range.

3. 发明专利

JPS6352108A PHOTOELECTRON DEVICE AND ITS MANUFACTURE 失效
公开(公告)号：JPS6352108A
公开(公告)日：1988-03-05
申请号：JP19532686
申请日：1986-08-22
申请人： HITACHI LTD
发明人： SASAYAMA ATSUSHI , HANEDA MAKOTO , ADACHI EIICHI
IPC分类号： G02B6/00 , G02B6/42 , H01L33/00 , H01S5/00
摘要： PURPOSE:To improve both of the mechanical strength and moisture proofness of a semiconductor laser device, by providing a filler accumulating section for preserving a liquid filler at the optical fiber leading-in section of a guide. CONSTITUTION:The core 19 at the leading edge of an optical fiber 10 is exposed and a glass tube 22 is inserted. The optical fiber 10 is inserted into a jacket guide 16 which is put in a package and fixed to the peripheral wall of the package and the core 19 part of the fiber 10 is fixed to a fiber guide 17 by soldering after it is inserted into the guide 17 in such a way that the core 19 part 19 can pierce the guide 17. Moreover, a resin accumulating section 18 is provided at the optical fiber leading-in section of the jacket guide 16 and a liquid resin is preserved in the accumulating section 18. The section 18 is maintained at a desired degree of vacuum by a prescribed time in a vacuum device. Thereafter, the resin is hardened by curing after bringing the semiconductor laser device back to an atmospheric-pressure environment.

4. 发明专利

JPS62276933A ELECTRONIC PARTS 失效
公开(公告)号：JPS62276933A
公开(公告)日：1987-12-01
申请号：JP11923386
申请日：1986-05-26
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： AIKI KUNIO , SASAYAMA ATSUSHI , NEMOTO TSUGIO , KUGIMIYA HARUO
IPC分类号： H04B10/60 , G02B6/42 , H01S5/00 , H04B10/00 , H04B10/07 , H04B10/40 , H04B10/50
摘要： PURPOSE:To ensure the ultrasonic bonding between a lead and a wire by making the lead of an electronic component prolonged at the inside/outside of a package prolonged in the package thicker than the other part. CONSTITUTION:An optoelectronic device for optical communication applies optical communication by lighting a laser light from a laser diode chip 15 and sending the laser light through an optical fiber calbe to a desired position. The part of the lead 6 prolonged in the inside of a main body 7 in the lead 6 prolonged at the inside/outside of the package main body 7 of the device is formed as a thick lead 22 whose diameter is, e.g., 0.75mmphi, and the part projected from the package is formed as a thin lead 23 whose diameter is, e.g., 0.45mmphi. One end of the part 22 is fixed by welding at the ehad 24 of the part 23 whose diameter is 0.75mmphi. A wire 20 connected to a pedestal 36 is connected to the lead 6 by ultrasonic wave wire bonding and since the part 22 is formed thick, the lead 6 is not vibrated even when the wire 20 is connected and sure bonding is applied.

5. 发明专利

JPS6271289A OPTOELECTRONIC DEVICE 失效
公开(公告)号：JPS6271289A
公开(公告)日：1987-04-01
申请号：JP20996785
申请日：1985-09-25
申请人： HITACHI LTD
发明人： SASAYAMA ATSUSHI , YAZAKI NORIHIRO
IPC分类号： H01L33/48 , H01S5/00
摘要： PURPOSE:To accurately position a stem and a cap by forming a positioning pawl on the partial peripheral edge of the cap, and engaging the pawl with a positioning groove formed on the stem. CONSTITUTION:When a cap 2 is mounted on a stem 1 to which a laser chip 5 is secured and a wire 10 is connected with, the positioning pawl 15 of the cap 2 is engaged with the positioning groove 14 of the stem 1, welded in this state to hermetically seal the cap 2 with the stem 1. As a result, since the positional relationship between the inclining direction of a glass plate 13 and the chip 5 always has the prescribed relationship, a semiconductor laser in which astigmatic difference correction is accurately achieved is formed. Accordingly, a laser light 6 emitted from the upper end of the cap 5 passes the transparent glass plate 13 to form the astigmatic difference correction out of a package formed by the stem 1 and the cap 2 to be emitted.

6. 发明专利

JPS61292977A PHOTOELECTRONIC DEVICE 失效
公开(公告)号：JPS61292977A
公开(公告)日：1986-12-23
申请号：JP13403985
申请日：1985-06-21
申请人： HITACHI LTD
发明人： SASAYAMA ATSUSHI
IPC分类号： H01L31/12 , H01L33/20 , H01L33/58 , H01L33/62
摘要： PURPOSE:To stabilize an optical output from a light-emitting diode at all times by incorporating the light-emitting diode and a light-receiving element into the same package. CONSTITUTION:A light-emitting diode (a light-emitting diode chip) 2 and a light-receiving element 18 are arranged adjacently while the center of a lens 24 is positioned at approximately the intermediate position of these light-emitting diode (the light-emitting diode chip) 2 and light-receiving element 18. Consequently, the amount of light required for optical communication transmits the lens 24 and is taken in by an optical fiber 27 while reflected beams 28 necessary and sufficient for monitoring the intensity of light from the light-emitting diode (the light-emitting diode chip) 2 reach the light-receiving element 18 in the photoelectronic device. The photoelectronic device is not subject to the effect of beams on the outside of a package because the aperture diameter of the lens 24 is small, thus resulting in the high reliability of monitoring.

7. 发明专利

JPS59213189A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：JPS59213189A
公开(公告)日：1984-12-03
申请号：JP8573983
申请日：1983-05-18
申请人： Hitachi Ltd
发明人： ADACHI EIICHI , SASAYAMA ATSUSHI , TSUNENO HIROSHI , ITOU MIKIHIKO
IPC分类号： H01L23/02 , H01L33/48 , H01S5/00 , H01S3/18 , H01L23/06
CPC分类号： H01L33/483 , H01L33/60
摘要： PURPOSE:To improve the hermetic adhesion property of a low melting point glass with a cap by a method wherein a substance made of an Al layer excellent in adhesion property with the low melting point glass is previously adhered on the plane glass mounting surface of the cap. CONSTITUTION:The element material for cap fabrication with Al, the substance firmly adhering to said glass, adhered over the entire surface is punched by press and drawn, thus forming the cap 4. The center of the cap 4 is so punched that an Al film 2 forms the inner wall. Next, a transparent glass plate 7 is loaded inside the window 5 of the cap 4 via said glass 6. Since the Al film 2 adhered to the cap 4 is adhered by clad, vapor, and plating methods, said film has a high adhesion strength. The glass plate 7 and said glass 6 are both made of glass and therefore have excellent wetting properties, and the adhesion strengths thereof are also large. Thereby, the glass plate 7 and the cap 4 are adhered firmly and hermetically.
摘要翻译：目的：通过以下方法提高低熔点玻璃与盖的气密粘合性：将由低熔点玻璃的粘合性优异的Al层制成的物质预先粘附在盖的平面玻璃安装面上。构成：通过压制和拉伸冲压由Al制成的用于盖子制造的元件材料，牢固地附着在所述玻璃上的物质粘附在整个表面上，从而形成盖4.帽4的中心被冲压成Al膜 2形成内壁。接着，通过玻璃6将透明玻璃板7装载到盖4的窗口5内。由于通过包层，蒸气和电镀方法粘附到盖4上的Al膜2粘附，因此所述膜具有高的粘合强度。玻璃板7和玻璃6均由玻璃制成，因此具有优异的润湿性，其粘合强度也很大。由此，玻璃板7和盖4被牢固地和气密地粘合。

8. 发明专利

JPS57177587A LASER DIODE 失效
公开(公告)号：JPS57177587A
公开(公告)日：1982-11-01
申请号：JP6237381
申请日：1981-04-27
申请人： HITACHI LTD , HITACHI IRUMA DENSHI KK
发明人： TAKAHASHI TAKEO , ISHII AKIRA , TOZAWA MASATO , SHIMIZU SHIYUUICHI , SASAYAMA ATSUSHI
IPC分类号： H01L33/48 , H01S5/00 , H01S5/022
摘要： PURPOSE:To stabilize a far field pattern of laser light so that the reflected light through a sensor does not travel into a transparent window, by arranging the sensor in slant when a stem and photosensor fixed with a laser diode chip is contained in a package material having a transparent window. CONSTITUTION:A stem 3 is erected on a flange 2 constituted of metal with good thermal conductivity with a lead 11 projected outside the device, and a laser diode chip 5 is fixed on the side surface on the upper end thereof via a buffer plate 4. Next, the lead 11 passed through the flange 2 is provided on the chip 5 side in the same way. When the photosensor 7 is arranged on the flange 2 being positioned between the lead and chip 5, the following process is taken: a slant surface 13 is provided on the surface of the flange 2 to fix the sensor 7 thereon so that the reflected light 12 by laser light 6 radiating downward from the chip 5 does not invade into the transparent window 10 on the upper end of a cap 8 which is constituted of glass plate 9.

9. 发明专利

JPS53143169A RESIN MOLDED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS53143169A
公开(公告)日：1978-12-13
申请号：JP5770877
申请日：1977-05-20
申请人： HITACHI LTD
发明人： ITOU MITSUO , SASAYAMA ATSUSHI , OOTANI NOBUO , KIKUCHI SAKAE
IPC分类号： H01L23/12 , H01L23/04 , H01L23/28 , H01L23/36
摘要： PURPOSE:To reduce the production of distortions in heat sink and insure holding of molding resin by providing a small protrusion to the side face near the summit part of a heat sink and fixing the molding resin with this.

10. 发明专利

JPS53104170A PEAD FRAME FOR TRANSISTOR 失效
公开(公告)号：JPS53104170A
公开(公告)日：1978-09-11
申请号：JP1823277
申请日：1977-02-23
申请人： HITACHI LTD
发明人： KUNISHI TAKAFUMI , ITOU MITSUO , OOTANI NOBUO , SASAYAMA ATSUSHI
IPC分类号： H01L23/48 , H01L21/60
摘要： PURPOSE:To rationalize works with omitting frame rotation work at a lead bonding time by forming a lead frame with tips of base and emitter leads close to each other.

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