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    • 6. 发明专利
    • MAGNETIC RECORDING AND REPRODUCING DEVICE
    • JPH06119601A
    • 1994-04-28
    • JP26841292
    • 1992-10-07
    • HITACHI LTD
    • NAGATOMO HIROYUKIKONISHI KATSUO
    • G11B5/02
    • PURPOSE:To eliminate the necessity of a precise drum installation and to prevent signal deterioration by transmitting signals between a rotating drum and a fixed drum and performing the signal transmission with an optical fiber CONSTITUTION:A magnetic head device consists of a rotating drum 1 and a fixed drum 2, magnetic heads 7 and 8 are provided on the drum 1 and signal recording and reproducing are performed by diagonally scanning the magnetic tape wound on the drums 1 and 2. The magnetic heads 7 and 8 are connected to a signal amplifier 10 and are connected to a signal dividing circuit 12 and a light receiving element 5. The magnetic heads 7 and 8 are also connected to a signal amplifier 11 and are connected to a signal synthesizing circuit 13 and a light emitting element 3. Light emitting elements 4 and 6 are provided on the fixed drum 2, an optical fiber 9 is provided in a rotational shaft 15 of the drum 1 and the center shaft of the fiber 9 is made coincident with the rotational center of the shaft 15. Power transmission to the drum 1 is performed by a rotary transformer 14.
    • 9. 发明专利
    • PRODUCTION OF THIN-FILM MAGNETIC HEAD
    • JPH03225611A
    • 1991-10-04
    • JP1900390
    • 1990-01-31
    • HITACHI LTD
    • SAITO MASAKATSUSHIBAYAMA YUKONAGATOMO HIROYUKIKONISHI KATSUOAOKI SHIGEO
    • G11B5/31
    • PURPOSE:To obtain the above head which obviates the generation of the misregistration between thin-film layers and projections and the generation of unequal wear by patterning the fresh thin-film layers on the lower core projections simultaneously with the projections. CONSTITUTION:Grooves are dug in a nonmagnetic substrate 1 and a magnetic film consisting of CoNbZr, etc., is formed by sputtering to flatten the grooves. SiO2 is then sputtered at a prescribed thickness to form the thin-film layer 3. The thin-film layer 3 and the lower magnetic core 2 are simultaneously patterned by ion etching, by which the projections 2a, 2b of the front part and the rear part and the thin-film patters 3a, 3b thereon are formed. An insulating film 41 consisting of SiO2, etc., is formed as the insulating layer of the 1st coil and after a coil conductor 5 consisting of Cr/Cu/Cr is formed, an insulating film 42 of the 2nd coil consisting of the same material as the material of the insulating 41 is sputtered to flatten the surface. The core projections 2a, 2b are then registered on the insulating layers 41, 42 and through- holes 6a, 6b are formed by ion etching. The remaining of the thin-film patterns 3a, 3b is etched away. Cr or the like is then formed as a gap material 7 and thereafter, the same material as the material of the lower magnetic core is sputtered and etched to form the upper magnetic core 8. A protective film is then formed.
    • 10. 发明专利
    • THIN FILM MAGNETIC HEAD
    • JPH01248306A
    • 1989-10-03
    • JP7430888
    • 1988-03-30
    • HITACHI LTD
    • NAGATOMO HIROYUKISAITO MASAKATSUKUREBAYASHI MASAAKIKONISHI KATSUOISHIHARA KIYOSHI
    • G11B5/31
    • PURPOSE:To stably and surely perform electrical connection by increasing the margin of an etching time by forming a through hole where a remainder part from which a part of a lower layer electrode pattern is eliminated forms an oblique plane, and connecting an upper layer electrode pattern to the lower layer electrode pattern at a part including the oblique plane. CONSTITUTION:The through holes 11 and 12 are formed so as to form the oblique planes 10a and 10b on the remainder part of the lower layer electrode patterns 8a and 8b by eliminating a part of the electrodes 8a and 8b, and the upper layer electrodes 9a and 9b are connected electrically to the lower layer electrodes 8a and 8b at the part including the oblique plane parts 10a and 10b. Therefore, the oblique planes where connected lower layer electrode patterns 8a and 8b are exposed can be formed surely even when a certain degree of excess or shortage exists in the etching time of the through holes 11 and 12, and no insulating film remains on the upper planes of the lower layer electrode patterns 8a and 8b. In such a way, it is possible to set the large margin of the etching time and to perform connection between the upper and the lower layer electrodes stably and surely.