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    • 3. 发明专利
    • LIQUID FEEDING DEVICE AND AUTOMATIC ANALYZER
    • JPH11247763A
    • 1999-09-14
    • JP5176098
    • 1998-03-04
    • HITACHI LTD
    • KOIDE AKIRAMIYAKE AKIRATERAYAMA TAKAOMIMAKI HIROSHIMORIOKA TOMONARI
    • G01N35/10F04B43/04F04B43/06F04B53/10
    • PROBLEM TO BE SOLVED: To smoothen the flow of bubbles and to inhibit the fluctuation of pressure by dividing a face at a side opposite to a diaphragm, of a liquid feed chamber into almost two, forming an inlet on a peripheral portion of one side thereof, and an outlet on a peripheral portion of the other side, and mounting the inlet and outlet valves integrally with the liquid feeding chamber in such manner that they are unevenly distributed on a peripheral portion of the liquid feeding chamber. SOLUTION: To replace the gas in the liquid feeding chamber 131 of a liquid feeding device with the liquid, a liquid introducing device is connected with an inlet 144 of the liquid feeding device, and the liquid is pressurized and fed into the inlet 144, so that the pressurized liquid reaches an inlet valve 132 through the liquid passages 143, 134, 122. The liquid is flowed into the liquid feeding chamber 131 when the inlet valve 132 is opened by the pressure of the liquid, the gas existing in the inlet portion is pushed and flowed to a flat plate passage, and the inlet portion is filled with the liquid. The gas in the liquid feeding device is sucked by a vacuum device connected with a discharge nozzle 111, on this occasion, the gas is sucked through an outlet valve 121 which is opened when the back pressure of the outlet valve 121 becomes lower than the internal pressure of the liquid feeding chamber 131.
    • 5. 发明专利
    • MICROPUMP AND MANUFACTURE THEREOF
    • JP2000154783A
    • 2000-06-06
    • JP32475998
    • 1998-11-16
    • HITACHI LTD
    • SASAKI YASUHIKOYOSHIMURA YASUHIROKOIDE AKIRAMIYAKE AKIRAWATABE SHIGEOTERAYAMA TAKAOMIMAKI HIROSHIISHIDA YASUHIKOMORIOKA TOMONARI
    • B81C3/00F04B43/04
    • PROBLEM TO BE SOLVED: To miniaturize a micropump and to prevent a chemical reaction of each member and a working fluid by opposing and overlapping surfaces to be jointed in vacuum or inactive atmosphere and pressurizing and joining the surfaces to be joined after a member forming the micropump is made as a silicon substrate, metallic films are formed on the whole of surfaces to be joined sides and the silicon substrate and the metallic films are cleaned. SOLUTION: In each substrate forming a micropump, monocrystal silicon is made as a base material. After etching working is performed for a chamber and valve substrates 20, 30 at first and thermal oxidation films are formed on the whole surface of each substrate, metallic films are formed on the whole of surfaces to be joined of both substrates and surfaces to be joined are formed. Subsequently, after Ar plasma is irradiated in vacuum, continuously opposed surfaces are opposed in vacuum and joining and positioning are performed, the surfaces are overlapped and the surfaces are joined by heating and pressurizing. Next, metallic films are formed on the whole of each surface to be joined of this joining body and a nozzle substrate 40, surfaces to be joined are formed, surfaces to be joined are joined in the same procedure, metallic films are formed on the whole of each surface to be joined side of this joining body and a diaphragm substrate 10 and surfaces to be joined are joined in the same procedure.